FBGA 256 Search Results

ep2c20

Abstract: EPC2 EP1C12 EP2C5 EP2C15A EP2C35 EP2C50 EPC16 EPCS16 EPCS64
Contextual Info: Thin Quad Flat Pack T Plastic Quad Flat Pack (Q) FineLine BGA (F) 100-Pin TQFP 144-Pin TQFP 208-Pin PQFP 240-Pin PQFP 256-Pin FBGA 324-Pin FBGA 400-Pin FBGA 484-Pin FBGA 484-Pin UFBGA2 672-Pin FBGA 896-Pin FBGA 1 “A” devices differ only in reduced

vr7pu

Abstract: VR7PU567258GBD SODIMM DDR3 Mechanical Dimensions CB-172 VR7PU287258FBC VR7PU567258GBZ vr7pu287 VR7PU567258FBA VR7PU567258FBC 1066F
Contextual Info: DDR3 72bit Unbuffered SODIMM MODULE CONFIGURATIONS 1GB 1GB 1GB 1GB 1GB 1GB Module Configuration 128MX72 128MX72 128MX72 128MX72 128MX72 128MX72 Device Configuration 128Mx8 128Mx8 128Mx8 128Mx8 128Mx8 128Mx8 Device Package FBGA FBGA FBGA FBGA FBGA FBGA Module

SODIMM DDR3 Mechanical Dimensions

Abstract: VR7PA127258GBD DDR3 SODIMM SPD JEDEC VR7PA567258GBZ viking connector 12 pin
Contextual Info: DDR3 72bit Registered SODIMM MODULE CONFIGURATIONS 1GB 1GB 1GB 1GB 1GB 1GB Module Configuration 128MX72 128MX72 128MX72 128MX72 128MX72 128MX72 Device Configuration 128Mx8 128Mx8 128Mx8 128Mx8 128Mx8 128Mx8 Device Package FBGA FBGA FBGA FBGA FBGA FBGA Module

daewon tray

Abstract: Daewon T0809050 daewon tray 1F1-1717-AXX strapack s-669 DAEWON tray 48 DAEWON JEDEC TRAY DAEWON FBGA KS-88085 1F1-1717-AXX tray bga
Contextual Info: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices AN-071-5.0 Application Note This application note provides guidelines for handling J-Lead, Quad Flat Pack QFP , and Ball-Grid Array (BGA, including FineLine BGA [FBGA] and lidless FBGA

H5GQ4H24MFR-R2C

Abstract: H5GQ2H24AFR-R0C H5GC4H24MFR-T2C H5GQ1H24BFR-R0C H5GQ1H24BFR-T2C H5GC2H24BFR-T2C H5TQ2G63DFR-11c H5GQ2H24AFR-T2C H5TC4G63AFR-11C H5TQ2G63FFR
Contextual Info: Page 1 DENSI TY ORG. SPEED PART NUMBER PKG. FEATURE AVAI L. 1.1GHz 0.9ns H5TQ4G63AFR-N1C FBGA(96ball) 8Bank, 1.5V/ 1.5V Now 1.0GHz (1.0ns) H5TC4G63AFR-N0C FBGA(96ball) 8Bank, 1.35V/ 1.35V Now FBGA(96ball) 8Bank, 1.5V/ 1.5V Now FBGA(96ball) 8Bank, 1.35V/ 1.35V

RTAX2000S

Abstract: RTAX2000 CQ256 2-CQFP RTAX2000S-CQ352 SK-AX1-CQ352-KITBTM SK-AX250-CQ352RTFG484S RTAX2000S-CQ256
Contextual Info: Application Note AC274 CQFP to FBGA Adapter Sockets Table of Contents Introduction . . . . . . . . . . . . . . . . . . . . . . . . CQFP to FBGA Adapter Sockets . . . . . . . . . . . . . CQFP to FBGA Adapter Socket Assembly Procedure . . CQ352 to FG484 23x23 Adapter Socket Outline Drawing

AX2000-CQ256

Abstract: RTAX2000S-CQ352
Contextual Info: Application Note AC274 CQFP to FBGA Adapter Sockets Table of Contents Introduction . . . . . . . . . . . . . . . . . . . . . . . . CQFP to FBGA Adapter Sockets . . . . . . . . . . . . . CQFP to FBGA Adapter Socket Assembly Procedure . . CQ352 to FG484 23x23 Adapter Socket Outline Drawing

PCN0515

Abstract: sumitomo G770 G770* sumitomo G770 mold compound G770 sumitomo Unbiased HAST 130, 85 RH, 100 Hrs G770 G770* G770 mold compound Sumitomo 1000 thermal conductivity of sumitomo g770 G770 HC
Contextual Info: PROCESS CHANGE NOTIFICATION PCN0515 MOLD COMPOUND CHANGE FOR FBGA PACKAGES Change Description: Altera is adopting the Sumitomo G770 series mold compound as the standard mold material on Altera FineLine BGA® FBGA device packages. Devices in FBGA packages currently

DDR2-400

Abstract: DDR2-533 DDR2-667 DDR2-800 JEDEC tray standard 13
Contextual Info: Jun.2010 DDR2 Code Information Component K4TXXXXXXX - XXXXXXX 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 1. Memory K 11. "─" 2. DRAM : 4 12. Package Z : FBGA (Lead-Free) J : FBGA DDP (Lead-Free) H : FBGA (Lead-Free & Halogen-Free) M : FBGA DDP (Lead-Free & Halogen-Free)

H9ccnnn

Abstract: H9CKNNNB H5MS1G22AFRE3M H5MS2G22MFR-J3M H5MS2G62 H55S2622JFR-60M H9TKNNN2GDMP-LRNDM DDR333 H5MS2G62AFR-J3M H5MS1G22AFR-E3M
Contextual Info: Page 1 DENSI TY ORG. SPEED PART NUMBER Package FEATURE Availability 2Gb 64M x 16 166MHz H55S2G62MFP-60M FBGA 54ball 4Bank, 1.8V/ 1.8V Now 133MHz H55S2G62MFP-75M FBGA(54ball) 4Bank, 1.8V/ 1.8V Now 166MHz H55S2G22MFP-60M FBGA(90ball) 4Bank, 1.8V/ 1.8V Now 133MHz

MR0D08BMA35

Abstract: 128Kbx8 MR0A08B FBGA thermal resistance
Contextual Info: Thermal Resistance – 256Kb Density and 1Mb Density MRAM in 8x8mm FBGA Applicable Products: 256Kb Density and 1Mb Density MRAM in 8x8mm FBGA Temperature Grade Commercial Industrial Operating Temperature Products Part Numbers 256Kb Density 1 32Kbx8 Single VDD

MT41K256M32

Abstract: MT41K256M3 8Gb DDR3 SDRAM twindie MT41K256M16
Contextual Info: 8Gb: x32 TwinDie DDR3L SDRAM Description TwinDie 1.35V DDR3L SDRAM MT41K256M32 – 32 Meg x 32 x 8 Banks Description Options Marking • Configuration – 32 Meg x 32 x 8 banks • FBGA package Pb-free – 136-ball FBGA (11mm x 14mm x 1.2mm) Rev. D – 136-ball FBGA

package tsop1

Abstract: 16G nand AG01000 NCE 6G memory 4g onenand
Contextual Info: One-NAND Code Information 1/2 Last Updated : August 2009 KFXXXXXXXX - XXXXXXX 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 12. Package (AG01000 PKG SPEC Reference) A : FBGA (Lead-Free, Halogen-Free) B : FBGA (Lead-Free, Halogen-Free, OSP) D : FBGA (Lead-Free)

Contextual Info: PRN256M8V69AG8GKF-15E DDR3 SDRAM PRN256M8V69AG8GKF-15E PRN256M8 – 32 Meg x 8 x 8 Banks Options Marking Configuration -256MX8 256M8 Product Code -DDR3 Density 2Gb Vx 8x Voltage/ Refresh 1.5V/8K Refresh FBGA Package PB-free x8 78/117B 9x11.5MM FBGA Package (Leaded)

Contextual Info: BCM2132 PRODUCT Brief EDGE/GPRS/GSM SINGLE-CHIP MULTIMEDIA BASEBAND PROCESSOR FEATURES SUMMARY OF BENEFITS • Comprehensive EDGE/GPRS/GSM system design • Single mixed-signal package options: • 256 pin FBGA @ 14 x 14 mm • 276 pin FBGA @ 12 x 12 mm

H5TQ2G63BFR-H9C

Abstract: H5TQ1G83BFR-H9C H26M42001EFR H5RS1H23MFR h27u1g8f2b H27U1G8F2 H27UBG8T2A H27UBG8T H5MS2G22MFR-J3M H26M54001BKR
Contextual Info: Rev 0.0 Q2’2010 Databook C omputing Memory DDR3 SDRAM : Component VDD DENSITY ORG. SPEED PART NUMBER PKG. FEATURE AVAIL. 1.5V 1Gb 256Mx4 DDR3 1333 H5TQ1G43BFR-H9C FBGA 78ball 8Bank, 1.5V, CL9,9-9-9 Now H5TQ1G43TFR-H9C FBGA(78ball) 8Bank, 1.5V, CL9,9-9-9

IEC60730

Abstract: CMOS Sensor to H.264 STK 361 ARM926EJ-S lcd cross reference VIA ARM926EJ-S SD-Card layout TMPA900CMXBG toshiba lcd controller board TMPA912CM
Contextual Info: ARM9 Microcontroller TMPA900CMXBG Memory Features ADC 10-bit Ch. 16-bit Timer RTC / WDT 32 FBGA 289 √ √ H/D 2 3 2 1 8 6 √ 91 1.7~3.6 TMPA901CMXBG 2 ARM926EJ-S 200* - 32 FBGA 177 √ √ H/D 1 2 1 1 4 6 √ 43 1.7~3.6 ARM926EJ-S 200* - 56 FBGA 361 √

H5TQ2G63FFR-RDC

Abstract: H5TQ4G63MFRPBC H5TC8G83AMR-PBA HMT351U7EFR8C-PB H5TQ2G63DFR-PBC
Contextual Info: Page 1 DDR3 SDRAM Solder- Dow n VDD DENSI TY ORG. SPEED PART NUMBER PKG. FEATURE AVAI L. 1.5V 2Gb 256Mx8 DDR3 1866 H5TQ2G83EFR-RDC FBGA 78ball 8Bank, 1.5V, CL13,13-13-13 Now DDR3 1600 H5TQ2G83CFR-PBC FBGA(78ball) 8Bank, 1.5V, CL11,11-11-11 Now H5TQ2G83EFR-PBC

Contextual Info: Data Sheet LEADFRAME CABGA/fBGA Features ChipArray Packages Amkor’s ChipArray® Ball Grid Array CABGA packages are laminate based packages that are compatible with SMT mounting processes worldwide. The near chip size CABGA fine-pitch BGA (fBGA) offers a

Contextual Info: 184pin Registered DDR SDRAM DIMMs based on 256Mb D ver. FBGA This Hynix Registered Dual In-Line Memory Module (DIMM) series consists of 256Mb D ver. DDR SDRAMs in 60 ball FBGA package on a 184pin glass-epoxy substrate. This Hynix 256Mb D ver. based Registered DIMM series provide a

sdram dimm layout hynix

Abstract: 6050 DDR333 DDR400 DDR400B 256mb ddr333 200 pin hynix module suffix DM U23
Contextual Info: 184pin Registered DDR SDRAM DIMMs based on 256Mb D ver. FBGA This Hynix Registered Dual In-Line Memory Module (DIMM) series consists of 256Mb D ver. DDR SDRAMs in 60 ball FBGA package on a 184pin glass-epoxy substrate. This Hynix 256Mb D ver. based Registered DIMM series provide a

MTFC4G

Abstract: MTFC16G micron emmc MTFC32G micron eMMC 100 ball BGA MTfc8g emmc csd MTFC4 micron emmc 4.4 MTFC16GKQDI
Contextual Info: 4GB, 8GB, 16GB, 32GB: e•MMC Features e·MMC Memory MTFC4GGQDM, MTFC4GGQDI, MTFC8GKQDI, MTFC16GKQDI, MTFC32GKQDH Features Figure 1: Micron e·MMC Device • MultiMediaCard MMC controller and NAND Flash • 153-ball FBGA or 169-ball FBGA (6/6 RoHS-compliant)

dax6

Abstract: Mobile SDRAM
Contextual Info: V55C1256164MG 256Mbit MOBILE SDRAM 1.8 VOLT, TSOP II / FBGA PACKAGE 16M X 16 75 9 10 System Frequency fCK 133 MHz 111 MHz 100MHz Clock Cycle Time (tCK3) 7.5ns 9.0 ns 10 ns Clock Access Time (tAC3) CAS Latency = 3 6.0 ns 7.0 ns 8.0ns • Available in 54-ball FBGA (with 9x6 ball array

m312l

Contextual Info: 512MB, 1GB, 2GB FBGA DDR400 Registered DIMM DDR SDRAM DDR SDRAM Registered Module DDR400 Module 60FBGA 184pin Registered Module based on 512Mb B-die (x4, x8) with 1,125mil/1,200mil Height Revision 1.1 November. 2004 Revision 1.1 November 2004 512MB, 1GB, 2GB FBGA DDR400 Registered DIMM