23X23 Search Results

Contextual Info: Part Number: S7100PH-C4 Package: 484L HSGBA 23x23mm Material Declaration Statement of Materials, Construction Material Component Name Weight (g) Element/Compound 1 2 Die Underfill 0.1502 0.0170 3 Epoxy 0.0500 4 Heat Spreader 2.3620 5

bga solder ball shear

Abstract: JESD22-B111 JESD22B111 23X23 JESD97 bga thermal cycling reliability
Contextual Info: PRODUCT/PROCESS CHANGE NOTIFICATION PCN CRP/05/1015 SUBSTRATE METALLISATION AND LEAD FREE SOLDER BALLS CHANGE FOR BGA PACKAGES WITH SIZE EQUAL OR BELOW 23X23 Table 1. Change Identification Product Family / Commercial Product All BGA Packages with size equal or below 23x23

sac305

Abstract: G770* sumitomo ABL-2100A G770J 2100a epoxy G770 sumitomo epoxy HSBGA VSC452XHW-02 secret
Contextual Info: Package Material Composition and Mass Calculation Customer:Vitesse Package:23x23 HSBGA Device Type:VSC452XHW-02 Die Size: 7100 X 7300 um Total Pck. Weight g : 2675.785 Provided By: Gerry Alamillo Date: 2007/08/14 name Mold Compound Substrate Silicon Die Attach

P-BGA345-23x23-1

Abstract: PRBG0345FB-A
Contextual Info: JEITA Package Code P-BGA345-23x23-1.00 RENESAS Code PRBG0345FB-A Previous Code 345FHP MASS[Typ.] 2.1g φb A A φx M S AB ZD A1 e e B D y S Index mark Laser mark S ZE E AA Y W V U T R P N M L K J H G F E D C B A 1 2 3 4 5 6 7 8 9 101112131415161718192021

dead bug

Abstract: PA-QFJ196SB-P-Z-02 QFJ196SA QFJ196SB 23X23
Contextual Info: 2.754" 196 pin QFP top carrier/socket QFJ196SA, and QFJ196SB foot prints Top socket compatibility options: -L live bug , -D (dead Bug), -N (non formed) substitute for X. 3.149" 2.754" 1.207" 1.083" 1.009" Base (default): Plugable base Socket 196 pin 23x23 PGA female interface

PRBG0297FA-A

Abstract: P-BGA297-23x23-1
Contextual Info: JEITA Package Code P-BGA297-23x23-1.00 RENESAS Code PRBG0297FA-A B D1 D Previous Code 297F7X-A MASS[Typ.] 1.7g A A ZD b S AB e ZE AA Y W V U T R P N M L K J H G F E D C B A E1 E e A1 Reference Symbol y S 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21

23X23

Abstract: PBGA376 BGA376 PRBG0376FA-A
Contextual Info: JEITA Package Code P-BGA376-23x23-1.00 RENESAS Code PRBG0376FA-A Previous Code 376FHP MASS[Typ.] 2.1g φb A A φx M S AB e A1 ZD e B D y S Index mark Laser mark S ZE E AB AA Y W V U T R P N M L K J H G F E D C B A 1 2 3 4 5 6 7 8 9 10111213141516171819202122

RTAX2000S

Abstract: RTAX2000 CQ256 2-CQFP RTAX2000S-CQ352 SK-AX1-CQ352-KITBTM SK-AX250-CQ352RTFG484S RTAX2000S-CQ256
Contextual Info: Application Note AC274 CQFP to FBGA Adapter Sockets Table of Contents Introduction . . . . . . . . . . . . . . . . . . . . . . . . CQFP to FBGA Adapter Sockets . . . . . . . . . . . . . CQFP to FBGA Adapter Socket Assembly Procedure . . CQ352 to FG484 23x23 Adapter Socket Outline Drawing

AX2000-CQ256

Abstract: RTAX2000S-CQ352
Contextual Info: Application Note AC274 CQFP to FBGA Adapter Sockets Table of Contents Introduction . . . . . . . . . . . . . . . . . . . . . . . . CQFP to FBGA Adapter Sockets . . . . . . . . . . . . . CQFP to FBGA Adapter Socket Assembly Procedure . . CQ352 to FG484 23x23 Adapter Socket Outline Drawing

FGPS35064-MR-10

Abstract: FGPS35064-UF-10 FGPS35064-SM-10 GPS4100
Contextual Info: Product Specification GPS4100 Active internal GPS antenna Features 9 9 9 9 Ceramic Patch Antenna Measures 23x23x7mm Surface-mount Various Cable/Connector options Specifications 1575.42MHz ±1.023MHz Supported Frequency Element Gain 0dBic @ zenith VSWR 2:1 max @ centre frequency

P-BGA441

Abstract: 23X23 PRBG0441FA-A
Contextual Info: JEITA Package Code P-BGA441-23x23-1.00 RENESAS Code PRBG0441FA-A Previous Code 441FHP MASS[Typ.] 2.2g φb A A φx M S AB ZD A1 e e B D y S Index mark Laser mark ZE E AA Y W V U T R P N M L K J H G F E D C B A 1 2 3 4 5 6 7 8 9 101112131415161718192021 Index mark

PRBG0345FA-A

Contextual Info: JEITA Package Code P-BGA345-23x23-1.00 RENESAS Code PRBG0345FA-A D MASS[Typ.] 1.7g A b A D1 B Previous Code 345F7X-A S AB ZD e AA Y W V U T R P N M L K J H G F E D C B A ZE E1 E e A1 y S Index mark S 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 Reference

23X23

Contextual Info: JEITA Package Code T-HLFBGA352-23x23-0.80 RENESAS Code TLBG0352GA-A Previous Code BT-352T/BT-352TV MASS[Typ.] 1.5g D w S B E w S A x4 v A1 y S A y1 S S ZD e e A AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A Reference Symbol B Dimension in Millimeters

"network interface cards"

Abstract: DI 783
Contextual Info: „„ RELEASED SIUNI-622-MAX DATASHEET PMC-1980589 • - ■ . PM* I , I 7 IV PMC-Sierra, Inc. ISSUE 6 PM5356 SIUNI-622-MAX SA TURN USER NETWORK INTERFACE 622-MAX PM5356 S/UNI-622-MAX SATURN USER NETWORK INTERFACE (622-MAX) S/UNI- 622-MAX DATASHEET

sot923

Abstract: sot-923 weight SOT-923
Contextual Info: Package Details - SOT-923 Mechanical Drawing Lead Code: Reference individual device datasheet. Part Marking: Single Character Alpha/Numeric Code Mounting Pad Geometry Dimensions in mm Central TM Semiconductor Corp. w w w. c e n t r a l s e m i . c o m R0 (9-January 2008)

Contextual Info: Package Details - SOT-883L Mechanical Drawing Lead Code: Reference individual device datasheet. Part Marking: Single Character Alpha/Numeric Code. Mounting Pad Geometry Dimensions in mm Central TM Semiconductor Corp. w w w. c e n t r a l s e m i . c o m

TL* MARKING

Contextual Info: Package Details - TLM621H Mechanical Drawing Lead Code: 1 Source 2) Drain 3) Drain 4) Drain 5) Drain 6) Gate Part Marking: 2-3 Character Alpha/Numeric Code Mounting Pad Geometry Dimensions in mm) Central TM Semiconductor Corp. w w w. c e n t r a l s e m i . c o m

SOT953

Abstract: eia marking code marking code 953 marking code 24 SOT-95
Contextual Info: Package Details - SOT-953 Mechanical Drawing Lead Code: Reference individual device datasheet. Part Marking: 2-3 Character Alpha/Numeric Code Mounting Pad Geometry Dimensions in mm Central TM Semiconductor Corp. w w w. c e n t r a l s e m i . c o m R0 (9-January 2008)

89H48H12G3

Abstract: TSI350A
Contextual Info: Comprehensive Portfolio from the Leader in PCI Express Solutions Integrated DeviceTechnology ANALOG AND RF | INTERFACE AND CONNECTIVITY PCI Express Timing Solutions Highly Integrated Clocks for PCIe-based Systems The IDT PCI Express timing products meet or

e500v2

Abstract: MSC8157 BSC9132
Contextual Info: TM August 2013 50B Connected Nodes by 2020* Computers People Everything 1 2 3 1T $100 1.0 2.0 3.0 100B Cloud 10B Wireless Enterprise 1B $1 10M Past 1990 Today 2000 1¢ 2010 2 1 Future 3 2020 *Source Ericsson Factory Automation TM 2 Smart Energy Transportation

STV0289

Abstract: sti5189 STV0289 date code st40 jtag analog satellite tuner stv0289 st40 Application CPU ST40-300 DVB-S FEC demodulator jtag st TELETEXT TRANSMITTER
Contextual Info: STi5189 Low-cost QPSK demodulator and MPEG2 decoder for set-top box applications Data brief Features • Advanced security features, compatible with the latest CA requirements ■ Satellite STBs can be produced with very small BOM and two-layer PCBs ■ DVB-S compliant

89HPES16T4G2

Abstract: PCIE SWITCH IDT
Contextual Info: 89HPES16T4G2 Data Sheet 16-Lane 4-Port Gen2 PCI Express Switch Advance Information* ® Device Overview Features High Performance PCI Express Switch – Sixteen 5 Gbps Gen2 PCI Express lanes – Four switch ports • One x4 upstream port • Three x4 downstream ports

star tracker

Contextual Info: Other Custom Products FORMAT P IX E L S IZ E ii TYPE FEATURES 512x512 15x15 Full Frame 1024x1024 15x15 Full Frame Standard Catalog Item 2048 x 2048 7.5 X 7.5 Full Frame 2048 x 2048 15x15 Full Frame 4096 x 4096 7.5 x 7.5 Full Frame 4096 x 4096 15x15 Full Frame

LR 4100 RELAY

Contextual Info: 58 AM TE-32 ASSP Telecom Standard Product Data Sheet Released r, 20 05 12 :5 3: PM4332 y, 13 De ce m be TE-32 in er In co n Tu es da High Density 32 Channel T1/E1/J1 Framer Proprietary and Confidential Released Issue No. 6: November 2005 Do wn lo ad ed by