FLC16 Search Results

Contextual Info: FLC167WF C-Band Power GaAs FET FEATURES • • • • • High Output Power: P1dB = 31.8dBm Typ. High Gain: G1dB = 7.5dB(Typ.) High PAE: hadd = 35%(Typ.) Proven Reliability Hermetic Metal/Ceramic Package DESCRIPTION The FLC167WF is a power GaAs FET that is designed for general

CD 294

Abstract: FLL357 348dB FLL400IP-2 FLK102MH-14 hemt low noise die Fujitsu GaAs FET Amplifier FLK017XP FLL120 fujitsu gaas fet
Contextual Info: FLC167WF - C-Band Power GaAs FET FEATURES • • • • • High O utput Power: P-|<jB = 3 1 .8dBm Typ. High Gain: G ^ b = 7.5dB(Typ.) High PAE: r iadd = 35% (Typ.) Proven Reliability Herm etic M etal/C eram ic Package

Contextual Info: FLC167WF C-Band Power GaAs FET FEATURES • • • • • High Output Power: P1dB = 31.8dBm Typ. High Gain: G1dB = 7.5dB(Typ.) High PAE: ηadd = 35%(Typ.) Proven Reliability Hermetic Metal/Ceramic Package DESCRIPTION The FLC167WF is a power GaAs FET that is designed for general

Contextual Info: FLC161WF FUJITSU C-Band Power GaAs FETs FEATURES • • • • • High Output Power: P-|<jB = 31.8dBm Typ. High Gain: G ^ b = 7.5dB(Typ.) High PAE: = 35%(Typ.) Proven Reliability Hermetic Metal/Ceramic Package DESCRIPTION The FLC161WF is a power GaAs FET that is designed for general

Eudyna Devices

Abstract: FLC167WF
Contextual Info: FLC167WF C-Band Power GaAs FET FEATURES • • • • • High Output Power: P1dB = 31.8dBm Typ. High Gain: G1dB = 7.5dB(Typ.) High PAE: ηadd = 35%(Typ.) Proven Reliability Hermetic Metal/Ceramic Package DESCRIPTION The FLC167WF is a power GaAs FET that is designed for general

FLC167WF

Contextual Info: FLC167WF C-Band Power GaAs FET FEATURES • • • • • High Output Power: P1dB = 31.8dBm Typ. High Gain: G1dB = 7.5dB(Typ.) High PAE: ηadd = 35%(Typ.) Proven Reliability Hermetic Metal/Ceramic Package DESCRIPTION The FLC167WF is a power GaAs FET that is designed for general

FLC161WF

Abstract: flc161 FLC161WF/101
Contextual Info: FLC161WF C-Band Power GaAs FETs FEATURES • • • • • High Output Power: P1dB = 31.8dBm Typ. High Gain: G1dB = 7.5dB(Typ.) High PAE: hadd = 35%(Typ.) Proven Reliability Hermetic Metal/Ceramic Package DESCRIPTION The FLC161WF is a power GaAs FET that is designed for general

FLC167WF

Abstract: flc167
Contextual Info: FLC167WF C-Band Power GaAs FET FEATURES • • • • • High Output Power: P1dB = 31.8dBm Typ. High Gain: G1dB = 7.5dB(Typ.) High PAE: ηadd = 35%(Typ.) Proven Reliability Hermetic Metal/Ceramic Package DESCRIPTION The FLC167WF is a power GaAs FET that is designed for general

FLC161

Contextual Info: FLC161WI C-Kand Power j ü A s ! ET s ABSOLUTE MAXIMUM RATING (Ambient Temperature Ta=25°C IfeMn Symbol Condition Rating UMt Drain-Source Voltage Vd S 15 V Gate-Source Voltage Vg S -5 V 7.5 w °c °c Total Power Dissipation Pt Tc = 25°C Storage Temperature

Contextual Info: CHIP FUSES; RECTANGULAR TYPE KAMAYA OHM FLC/Low-ratio Fusing ¥Features 1. Low-ratio fusing. •Rated Current i140% fusing 120s Typical. 2. Certified UL, and c-UL. ·File No. : E176847 L C L US L L 3.Major application L L •PC related equipment and peripherals (PC, Hard Drive, Printer etc.).

Contextual Info: NEW CHIP FUSES; RECTANGULAR TYPE KAMAYA OHM FLC/Low-ratio Fusing •Features 1. Low-ratio fusing. •Rated Current i140% fusing 120s Typical. 2. Certified UL, and c-UL. ·File No. : E176847 C L L US L L 3.Major application L L •PC related equipment and peripherals (PC, Hard Drive, Printer etc.).

Contextual Info: SPECIFICATION OF FLC□□□□□□NLCL SERIES FEATURES 1. Very strong solderability by flow soldering , soldering iron. 2. Highly accurate dimensions , can be mounted automatically. 3. Terminals are highly resistant to pull forces. 4. Highly resistant to mechanical shocks and pressure.

FLL105

Abstract: FLL55 FLL300-1 FLL300-2 FLL101 fll171 FLL200-3 "FLL105" FLL-300-1 FLK202
Contextual Info: SELECTION GRAPHS Output Power at 1dB Gain Compression dBm GaAs FETs CHIPS c o "co CO CD CL E o O ç aj CD m "D o $ o CL "3 Q. "3 O Frequency (GHz) Fufrsu Selection Graphs 1 1997 Microwave Databook SELECTION GRAPHS HEMTs 16 10 Associated Gain 12 (dB) 14 CÛ

FLL55

Abstract: FLL171ME FLL101ME FLL120MK FLC253MH-6 FLU10XM fll300ip-2 flu10 fll171 FLL351ME
Contextual Info: POWER GaAs FETs Electrical Characteristics Ta =25°C PidB TYP. (dB) GidB TYP. (dB) Mattel TYP. (dB) 1 (GHz) Vos (V) (mA) •FLU10XM 29.5 13.5 47 2.0 10 •FLU17XM 32.5 12.5 46 2.0 •FLU35XM 35.5 11.5 46 FLL101ME 29.5 13.5 FLL171ME 32.5 FLL351ME Rth TYP.

Contextual Info: CHIP FUSES; RECTANGULAR TYPE KAMAYA OHM FLC/Low-ratio Fusing •Features 1. Low-ratio fusing. •Rated Current i140% fusing 120s Typical. 2. Certified UL, and c-UL. ·File No. : E176847 C L L US L L 3.Major application L L •PC related equipment and peripherals (PC, Hard Drive, Printer etc.).

FLC252018NLCL

Contextual Info: SPECIFICATION OF FLC□□□□□□NLCL SERIES FEATURES 1. Very strong solderability by flow soldering , soldering iron. 2. Highly accurate dimensions , can be mounted automatically. 3. Terminals are highly resistant to pull forces. 4. Highly resistant to mechanical shocks and pressure.

FLC301XP

Abstract: FLC301XP equivalent FLK052XP Fujitsu GaAs FET application note ISS1B1 CS98E1V6R800-K41D CS98E1V6R000-K41B fujitsu "application notes" FJS-DS-158 fll171
Contextual Info: APPLICATION NOTES II. FET CHIPS A. REMOVAL OF GaAs FET AND HEMT CHIPS FROM SHIPPING CONTAINERS 1 REQUIREMENTS Anti-static work surface Grounding cable and wrist Metal tweezers or vacuum Clean container to receive Binocular microscope with strap probe transferred chips

FLC081XP

Abstract: FLC253MH-6 FLC253MH-8 FLC091WF FLC053WG FLC103WG FLK022WG FLK012WF FLK052WG FHX15FA
Contextual Info: - 132 - m % tí: € m & m s f =£ t * 1 H % K V tm * {S) a * i» (A) % S të ^ VGS* ñ * P d /P c h (W) Igs s ; (max) (A) Vos (V) m (min) (max) Vd s (A) (A) (V) te (Ta=25°C) (min) (max) Vd s (V) (V) (V) (min) (S) Id (A) Vd s (V) b (A) FHX05X X-Band LN A

Contextual Info: NEW CHIP FUSES; RECTANGULAR TYPE KAMAYA OHM FLC/Low-ratio Fusing •Features 1. Low-ratio fusing. •Rated Current i140% fusing 120s Typical. 2. Certified UL, and c-UL. ·File No. : E176847 C L L US L L 3.Major application L L •PC related equipment and peripherals (PC, Hard Drive, Printer etc.).

FLL57MK

Abstract: ELM7785-60F FLL400IP2 flc107 FLK027WG FLC057WG fll600iq-2 FLL357 fll177 FLL357ME
Contextual Info: Wireless Devices: GaAs FETs High Power GaAs FETs Sumitomo Electric has developed 40W - 80W high power Push-Pull GaAs FETs for Mobile Base Station applications such as Cellular, WCDMA, LTE and WiMAX. Additionally, plastic packaged devices are under development for cost driven systems.

Contextual Info: SPECIFICATION OF FLC□□□□□□NLCL SERIES FEATURES 1. Very strong solderability by flow soldering , soldering iron. 2. Highly accurate dimensions , can be mounted automatically. 3. Terminals are highly resistant to pull forces. 4. Highly resistant to mechanical shocks and pressure.

FMC141401-02

Abstract: fujitsu gaas marking code Fujitsu K022 FLL300-2 FLL55 FSX52WF FUJITSU L101 fujitsu x51 FLL200-2 FLL300-1
Contextual Info: APPLICATION NOTES I. PACKAGED FETS and MODULES A. HANDLING PREECAUTIONS GaAs FETS are sensitive to electrostatic discharge. Fujitsu ships all GaAs FETs in electrostatic protection packaging. User must pay careful attention to the following precautions when taking

FSX52WF

Abstract: fujitsu "application notes" fsx51wf NF037 FMC141401-02 FLL101 fll171 FMC1414P1-02 FLL55 FLL120MK
Contextual Info: APPLICATICI NOTES IV. DESIGN SUGGESTIONS A. RECOMMENDED DEVICE LINE-UPS This section contains recommended line-ups of Fujitsu Semiconductor devices for amplifier applications in common frequency bands. The continuity of these line-ups has been checked using minimum values of