HTSSL Search Results

7C453

Contextual Info: Qualification Report June 1992, QTP 9113A Version 1.1 512, 2048 x 9 FIFO QUALIFICATION MARKETING PART NUMBER DEVICE DESCRIPTION CY7C453 2048 x 9 Cascadeable FIFO CY7C451 512 x 9 Cascadeable FIFO CY7C441 512 x 9 FIFO CY7C443 2048 x 9 FIFO PAGE 2 CYPRESS SEMICONDUCTOR

toshiba tc 97101

Abstract: tc 97101 M7401 M73049 "256K x 16" SRAM PLCC M73002 M7206 M7-300 M72016 T 9722
Contextual Info: CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT QUARTER 3, 1997 PERFORM PER THE REQUIREMENT OF 25-00008, RELIABILITY MONITOR PROGRAM SPECIFICATION Marc Hartranft QA Engineering Department Manager CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT

cmos SRAM 35ns 8k X 8 dip

Abstract: 7C166 CY7C161 CY7C162 CY7C164 CY7C166 CY7C185 CY7C186 CY7C187 7C164
Contextual Info: Qualification Report January 1992 QTP 91094 64K SRAM FAMILY MARKETIN G DEVICE PART NBR DESCRIPTION CY7C161 16K x 4 SIO CY7C162 16K x 4 (SIO) CY7C164 16K x 4 CY7C166 (OE) CY7C185 8K x 8 CY7C186 8K x 8 (.6 DIP) CY7C187 64K x 1 Version 1.2 PRODUCT DESCRIPTION (for qualification)

CY7C4271-JC

Abstract: cypress 98267 9832 CY5037
Contextual Info: CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT QUARTER 4, 1998 PERFORM PER THE REQUIREMENT OF 25-00008, RELIABILITY MONITOR PROGRAM SPECIFICATION Ed Russell Reliability Manager CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT Quarter 4, 1998

22A-104

Contextual Info: Cypress Semiconductor Product Reliability 1996 Published May, 1996 CYPRESS SEMICONDUCTOR PRODUCT RELIABILITY TABLE OF CONTENTS 1.0 OVERVIEW OF CYPRESS SEMICONDUCTOR TOTAL QUALITY MANAGEMENT SYSTEM . 1 2.0 ELECTRICAL AVERAGE OUTGOING QUALITY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

EME-6300H

Abstract: sumitomo epoxy 6300h D284 J28S yc 504
Contextual Info: Reliability Report April 1994, QTP# 94183, Rev. 1.0 4K x 4 ECL STATIC RAM MARKETING PART NUMBERS CY10E484/CY10E484L CY100E484/CY100E484L CY101E484/CY101E484L CYPRESS SEMICONDUCTOR PAGE 2 PRODUCT DESCRIPTION for qualification Information provided in this document is intended for generic qualification and technically describes the Cypress part

93191

Abstract: sumitomo 6300h mold compound CY7C191 CY7C192 CY7C194 CY7C195 CY7C196 CY7C197 CY7C198 CY7C199
Contextual Info: PAGE 1 CYPRESS SEMICONDUCTOR Qualification Report July, 1994, QTP#93192/93191, Version 2.4 256K SRAM, RAM 2.1 SHRINK MARKETING PART NUMBER DEVICE DESCRIPTION CY7C191 64K x 4 Separate IO with transparent write CY7C192 64K x 4 Separate IO without transparent write

sumitomo silver epoxy

Abstract: EME-6300H 92361 CY7C460 CY7C462 CY7C464 CY7C470 CY7C472 CY7C474 0.8um cmos
Contextual Info: Qualification Report June, 1994, QTP# 92361 Version 1.1 CY7C46X/47X, MINNESOTA FAB MARKETING PART NUMBER DEVICE DESCRIPTION CY7C460 Cascadable 8K x 9 FIFO CY7C462 Cascadable 16K x 9 FIFO CY7C464 Cascadable 32K x 9 FIFO CY7C470 8K x 9 FIFO CY7C472 16K x 9 FIFO

cy3341

Abstract: 7C401 cy7c405 EME-6300H 7C404
Contextual Info: Qualification Report April, 1993, QTP# 7191 & 9504, Version 1.0 64 x 4 and 64 x 5 Cascadeable FIFOs MARKETING PART NUMBER DEVICE DESCRIPTION CY3341 CY7C405 64 x 4 Serial Memory FIFO CY7C401/403 64 x 4 Cascadeable FIFO CY7C402/404 64 x 5 Cascadeable FIFO PRODUCT DESCRIPTION (for qualification)

EME-6300H

Abstract: 6300H mos die CY7C1399 CY7C197 CY7C199
Contextual Info: Qualification Report June, 1995 - QTP# 94465 Version 1.0 RAM2.8 TRANSISTOR FOR RAM2.5 PROCESS PRODUCT DESCRIPTION for qualification Information provided in this document is intended for generic qualification and technically describes the Cypress part supplied:

7C322B

Abstract: PALC22V10B EME-6300H PLDC20G10B PLDC20RA10
Contextual Info: Qualification Report August, 1995 QTP# 94392, Version 1.0 CMOS PLD Marketing Part Description PALC22V10B Reprogrammable CMOS PAL Devic PLDC20G10B CMOS Generic 24-pin Reprogrammable Logic Device PLDC20RA10 Reprogrammable Asynchronous CMOS Logic Device PAL is registered trademark of Monolithic Memories Inc.

CY6264

Abstract: hyundai CY7C161 CY7C162 CY7C164 CY7C166 CY7C185 CY7C187 EME-6300H CY7C6264
Contextual Info: Qualification Report December, 1994, QTP# 94446 Version 1.0 CY6264 8K x 8 Static R/W RAM PRODUCT DESCRIPTION for qualification Information provided in this document is intended for generic qualification and technically describes the Cypress part supplied:

Generic PROM Family

Abstract: sumitomo epoxy CY7C225A CY7C235A EME-6300H UL-94V0
Contextual Info: Qualification Report August 1993, CTP# 930305 Version 1.0 4K/8K PROM - PROM20 PROCESS FAMILY MARKETING PART NUMBER DEVICE DESCRIPTION CY7C225A 512 x 8 Registered PROM CY7C235A 1024 x 8 Registered PROM CY7C281/2A 1024 x 8 PROM PRODUCT DESCRIPTION for qualification

sumitomo epoxy

Abstract: CY74FCT16543T EME-6300H O5611 MANUFACTURER AND SUPPLIER LOCATION INFORMATION
Contextual Info: Qualification Report July, 1995 QTP# 94431 Version 1.0 56-Pins SSOP package CYPRESS SEMICONDUCTOR PAGE 3 PRODUCT DESCRIPTION for qualification Information provided in this document is intended for generic qualification and technically describes the Cypress part

sumitomo epoxy 6300h

Abstract: CY74FCT162543T EME-6300H
Contextual Info: Qualification Report April, 1995 QTP# 94433 Version 1.0 56-Pins TSSOP package CYPRESS SEMICONDUCTOR PAGE 3 PRODUCT DESCRIPTION for qualification Information provided in this document is intended for generic qualification and technically describes the Cypress part

sumitomo epoxy

Abstract: CY7C276 EME-6300H 20 PIN LEADLESS CHIP CARRIER x-ray
Contextual Info: Qualification Report August, 1993, QTP 92192 16K x 16 PROM MARKETING PART NUMBER DEVICE DESCRIPTION CY7C270 Reprogrammable 16K x 16 Processor-Specific PROM CY7C276 16K x 16 Reprogramable PROM Version 1.0 PRODUCT DESCRIPTION for qualification Information provided in this document is intended for generic qualification and technically describes the Cypress part

CY7C425

Abstract: Cypress CY7C421 CY7C429 EME-6300H CY7C42 qualification p2831
Contextual Info: Qualification Report May, 1994, QTP# 91292/90231 Version 1.0 CASCADEABLE FIFOS MARKETING PART NUMBER DEVICE DESCRIPTION CY7C420/CY7C421 512 x 9 Cascadeable FIFO CY7C424/CY7C425 1024 x 9 Cascadeable FIFO CY7C428/CY7C429 2048 x 9 Cascadeable FIFO PRODUCT DESCRIPTION for qualification

GI 312 diode

Abstract: CERAMIC PIN GRID ARRAY CPGA lead frame ceramic pin grid array package wire bond VIC064 CPGA 168 lead frame CERAMIC PIN GRID ARRAY 144 pins VIC068A CERAMIC PIN GRID ARRAY wire lead frame description of transistor bc 148 CY7C964
Contextual Info: Qualification Report November, 1994 - QTP# 93101 Version 1.1 CMOS2AN PROCESS MARKETING PART NUMBER VIC64 DEVICE DESCRIPTION VMEbus Interface Controller with D64 VIC068A VMEbus Interface Controller VAC068A VMEbus Address Controller CY7C964 Bus Interface Logic Circuit

cy7c901

Abstract: CY7C910 62512 CY7C910-PC D406C EME-6300H 600-MIL CDIP
Contextual Info: Qualification Report QTP# 90308/92204 Version 1.0 September, 1994 CY7C9XX LOGIC FAMILY MARKETING PART NUMBER DEVICE DESCRIPTION CY7C901 CMOS Four-Bit Slice CY7C910 CMOS Microprogram Controller PRODUCT DESCRIPTION for qualification Information provided in this document is intended for generic qualification and technically describes the Cypress part

VIC068A-BC

Abstract: M71079 M7108 CY62256-VC m71070 LOGIC-R31 M72051 m7101 M72038 VIC068A-AC
Contextual Info: CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT QUARTER 2, 1997 PERFORM PER THE REQUIREMENT OF 25-00008, RELIABILITY MONITOR PROGRAM SPECIFICATION Marc Hartranft QA Engineering Department Manager CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT

M7401

Abstract: m74010 m7402 M74050 M74040 M74064 m80129 hyundai 9750 9745-1 VIC068A cy7c199zi
Contextual Info: CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT QUARTER 1, 1998 PERFORM PER THE REQUIREMENT OF 25-00008, RELIABILITY MONITOR PROGRAM SPECIFICATION Marc Hartranft Reliability Manager CYPRESS SEMICONDUCTOR CORPORATION PRODUCT RELIABILITY REPORT

INCOMING RAW MATERIAL INSPECTION procedure

Abstract: 5962-8867001LA MIL-STD-883 Method 2010 Mil-Std-883 Wire Bond Pull Method 2011 Sample form for INCOMING Inspection of RAW MATERIAL CY7C122 PALC22V10 plate INCOMING RAW MATERIAL INSPECTION procedure outgoing raw material inspection procedure visual inspection of raw materials
Contextual Info: fax id: 8509 Quality, Reliability, and Process Flows Quality, Reliability, and Process Flows Corporate Views on Quality and Reliability Product Testing Categories Cypress believes in product excellence. Excellence can only be defined by how the users perceive both our product quality

CY62256LL-PC

Abstract: VIC068A-GC VIC64-NC VIC64-UMB PALCE22V10-JI PALC16L8Q PLD VME A113 CY7B923 JESD22-A113
Contextual Info: Cypress Semiconductor Product Reliability 1997 Published June, 1997 CYPRESS SEMICONDUCTOR PRODUCT RELIABILITY TABLE OF CONTENTS 1.0 OVERVIEW OF CYPRESS SEMICONDUCTOR TOTAL QUALITY MANAGEMENT SYSTEM. 1 2.0 ELECTRICAL AVERAGE OUTGOING QUALITY. 2

Contextual Info: REVISION F HTSS-1XX-XX-XX-D-XX-XX POLARIZATION OPTION -XX: INDICATES POSITION OMITTED No OF POSITIONS DO NOT SCALE FROM THIS PRINT -02 STRAIGHT ONLY -03 THRU -18, -20, -24, -25, -28, -30, -32 & -36 LEAD STYLE -01,-02,-03 (SEE TABLE ' -04, -05 (SEE TABLE 2)