CY7B180 Search Results

Contextual Info: CY7B180 CY7B181 s CYPRESS SEMICONDUCTOR 4K x 18 Cache Tag Features • Can be used as 4K x 18 SRAM • Supports 66-MHz cache for all major high-speed processors Functional Description T he CY7B180 and CY7B181 are high-perform ance B iC M O S cache tag R A M s orga­

Contextual Info: CY7B180 CY7B181 PRELIMINARY CYPRESS SEMICONDUCTOR Features 4K x 18 Cache Tag • Can be used as 4K x 18 SRAM Functional Description Supports 50-MHz cache for all major high-speed processors 4K x 18 tag organization BiCMOS for optimum speed/power High speed

Contextual Info: CY7B180 CY7B181 I CYPRESS SEMICONDUCTOR 4K x 18 Cache Tag Features • C an be used as 4K x 18 SRAM • Supports 66-MHz cache for all major high-speed processors • 4K x 18 tag organization • BiCMOS for optimum speed/power • High speed — 10-ns match delay

ue09

Abstract: CY7B180-12GC cd 2313 UE 09
Contextual Info: CY7B180 CY7B181 AD VAN C ED IN F O R M A T IO N CYPRESS SEMICONDUCTOR 4K x 18 Cache Tag Features Functional Description • 4K x 18 tag organization T h e CY7B180 and CY7B181 are high-perform ance B iCM O S cache tag R A M s orga­ nized as 40% words by 18 bits. Each word

CY7B180-12JC

Abstract: CY7B181
Contextual Info: CY7B180 CY7B181 ' r CYPRESS SEMICONDUCTOR 4K x 18 Cache Tag Features • Can be used as 4K x 18 SRAM • Supports 66-MHz cache for all major high-speed processors • 4K x 18 tag organization • BiCMOS for optimum speed/power • High speed — 10-ns match delay

CY7C169

Abstract: 54600
Contextual Info: Thermal Management CYPRESS Part Number CY7B173 CY7B174 CY7B180 CY7B181 CY7B185 CY7B186 CY7B191 CY7B192 CY7B194 CY7C122 CY7C123 CY7C128 CY7C128A CY7C130 CY7C131 CY7C132 CY7C136 CY7C140 CY7C141 CY7C142 CY7C146 CY7C147 CY7C148 CY7C149 CY7C150 CY7C157 CY7C161A

76494

Abstract: EME-6300H 80973 Q393
Contextual Info: Qualification Report April ,1993, QTP #91481 Version 1.0 BiCMOS CACHE TAG SRAMS MARKETING PART NUMBER DEVICE DESCRIPTION CY7B180 4K x 18 Cache Tag CY7B181 4K x 18 Cache Tag PRODUCT DESCRIPTION for qualification Information provided in this document is intended for generic qualification and technically describes the Cypress part

HESE12

Abstract: cd3510
Contextual Info: PRELIM INARY r^ Y p p p C Q - 4K x 18 Cache Tag SEMICONDUCTOR Features • Can be used as 4K x 18 SRAM • Supports 50*MHz cache for all major h ig h sp eed processors F unctional D escription • 4 K x 18 tag organization • BiCMOS for optimum speed/power

CY62256LL-PC

Abstract: VIC068A-GC VIC64-NC VIC64-UMB PALCE22V10-JI PALC16L8Q PLD VME A113 CY7B923 JESD22-A113
Contextual Info: Cypress Semiconductor Product Reliability 1997 Published June, 1997 CYPRESS SEMICONDUCTOR PRODUCT RELIABILITY TABLE OF CONTENTS 1.0 OVERVIEW OF CYPRESS SEMICONDUCTOR TOTAL QUALITY MANAGEMENT SYSTEM. 1 2.0 ELECTRICAL AVERAGE OUTGOING QUALITY. 2

CY27S03A

Abstract: 15JC10 CY7C190 cy7c9101 cy7c122 die VIC068A user guide
Contextual Info: Thermal Management and Component Reliability slope of the logarithmic plots is given by the activation energy of the failure mechanisms causing thermally activated wear out of the device see Figure 1 . One of the key variables determining the long-term reliability

Contextual Info: Qualification Report October 1993, Version 1.0, QTP# 93275 Thin Small Outline Package 32 Lead TSOP Type 1 Dry packing required CYPRESS SEMICONDUCTOR PAGE 2 PLASTIC PACKAGE/ASSEMBLY DESCRIPTION Package Outline, Type, or Name: Lead Frame material: 32 Pins TSOP

EME 6300HR

Abstract: EME-6300
Contextual Info: Qualification Report September 1993, Version 1.3, QTP# 93251 ASAT ASSEMBLY QUALIFICATION 80 Lead Quad Plastic Quad Flatpack PQFP (Dry packing) CYPRESS SEMICONDUCTOR PAGE 2 PLASTIC PACKAGE/ASSEMBLY DESCRIPTION Mold Compound Name/Manufacturer: Lead Frame material:

CY7C9101

Abstract: CY7C510 CY7C190 cy7c189 G30-88 CY7c910 EA 9394 cy3341 CY6116 cy7c901
Contextual Info: fax id: 8511 Thermal Management Thermal Management and Component Reliability One of the key variables determining the long-term reliability of an integrated circuit is the junction temperature of the device during operation. Long-term reliability of the semiconductor chip degrades proportionally with increasing temperatures following an exponential function described by the

Gunn Diode symbol

Abstract: cy202 CY7C190 WSP-109BMP3 pal22V10D cy7b166 cy7c291 CY7C371 EV film cap calculation gunn diode datasheet
Contextual Info: CYPRESS SEMICONDUCTOR PRODUCT RELIABILITY APPENDIX A: FAILURE RATE CALCULATION Thermal Acceleration Factors Acceleration factors AF for thermal stresses (High Temperature Operating Life, Data Retention and High Temperature Steady State Life) are calculated from the Arrhenius equation.