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    SUMITOMO SILVER EPOXY Search Results

    SUMITOMO SILVER EPOXY Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MP-5FRJ11STWS-014
    Amphenol Cables on Demand Amphenol MP-5FRJ11STWS-014 Flat Silver Satin Modular Straight-Thru Cables, RJ11 / RJ11 14ft PDF
    MP-5FRJ12STWS-025
    Amphenol Cables on Demand Amphenol MP-5FRJ12STWS-025 Flat Silver Satin Modular Straight-Thru Cables, RJ12 / RJ12 25ft PDF
    MP-5FRJ45STWS-025
    Amphenol Cables on Demand Amphenol MP-5FRJ45STWS-025 Flat Silver Satin Modular Straight-Thru Cables, RJ45 / RJ45 25ft PDF
    MP-5FRJ11STWS-007
    Amphenol Cables on Demand Amphenol MP-5FRJ11STWS-007 Flat Silver Satin Modular Straight-Thru Cables, RJ11 / RJ11 7ft PDF
    MP-5FRJ12STWS-014
    Amphenol Cables on Demand Amphenol MP-5FRJ12STWS-014 Flat Silver Satin Modular Straight-Thru Cables, RJ12 / RJ12 14ft PDF

    SUMITOMO SILVER EPOXY Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    p20d

    Abstract: CERPAK data retention eprom Cypress 7c26 CY7C261 CY7C263 CY7C264 CY7C266 CY7C269 EME-6300H
    Contextual Info: Qualification Report March, 1992 QTP 91296 Version 1.0 64K EPROM FAMILY, 0.8µ MARKETING PART NUMBER DEVICE DESCRIPTION CY7C261 8K x 8 POWER-SWITCHED CY7C263 8K x 8 CY7C264 8K x 8 600-MIL PKG CY7C266 8K x 8 POWER-SWITCHED EPROM PINOUT CY7C269 8K x 8 REGISTERED DIAGNOSTIC


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    CY7C261 CY7C263 CY7C264 600-MIL CY7C266 CY7C269 QTP90271 p20d CERPAK data retention eprom Cypress 7c26 CY7C261 CY7C263 CY7C264 CY7C266 CY7C269 EME-6300H PDF

    cmos SRAM 35ns 8k X 8 dip

    Abstract: 7C166 CY7C161 CY7C162 CY7C164 CY7C166 CY7C185 CY7C186 CY7C187 7C164
    Contextual Info: Qualification Report January 1992 QTP 91094 64K SRAM FAMILY MARKETIN G DEVICE PART NBR DESCRIPTION CY7C161 16K x 4 SIO CY7C162 16K x 4 (SIO) CY7C164 16K x 4 CY7C166 (OE) CY7C185 8K x 8 CY7C186 8K x 8 (.6 DIP) CY7C187 64K x 1 Version 1.2 PRODUCT DESCRIPTION (for qualification)


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    CY7C161 CY7C162 CY7C164 CY7C166 CY7C185 CY7C186 CY7C187 Cypr507/1 200mA cmos SRAM 35ns 8k X 8 dip 7C166 CY7C161 CY7C162 CY7C164 CY7C166 CY7C185 CY7C186 CY7C187 7C164 PDF

    CY93L422PC

    Abstract: cy9122 cy93l422 cy7c122 sumitomo epoxy am-113 7C122 EME-6300H UL-94V0 CY93422 22 CDIP DIMENSIONS
    Contextual Info: Qualification Report January 1992 QTP 90172 256 x 4 Static RAM MARKETING PART NBR DEVICE DESCRIPTION CY7C122 SIO Version 1.1 PRODUCT DESCRIPTION for qualification Information provided in this document is intended for generic qualification and technically describes the Cypress part


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    CY7C122 7C122A 200mA CY93L422PC cy9122 cy93l422 cy7c122 sumitomo epoxy am-113 7C122 EME-6300H UL-94V0 CY93422 22 CDIP DIMENSIONS PDF

    sumitomo epoxy

    Abstract: EME 7320 7320 8361H CY7C375-AC JESD22
    Contextual Info: Cypress Semiconductor Package Qualification Report QTP# 000303 VERSION 1.1 March, 2000 Up to160 Lead Thin Quad Flat Pack Sumitomo EME 7320 Mold Compound ASE Taiwan CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director 408 432-7069


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    to160 CY7C375-AC sumitomo epoxy EME 7320 7320 8361H CY7C375-AC JESD22 PDF

    86171

    Abstract: EME-6300H CY7C123 CY7C150 UL-94V0 94v-0 dynamic RAM EME6300H
    Contextual Info: Qualification Report January 1992 QTP 90151 1K x 4 Static RAM MARKETING PART NBR DEVICE DESCRIPTION CY7C150 SIO Version 1.1 PRODUCT DESCRIPTION for qualification Information provided in this document is intended for generic qualification and technically describes the Cypress part


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    CY7C150 7C150A 200mA 86171 EME-6300H CY7C123 CY7C150 UL-94V0 94v-0 dynamic RAM EME6300H PDF

    CY7C191

    Abstract: CY7C192 CY7C194 CY7C196 CY7C197 CY7C198 CY7C199
    Contextual Info: Qualification Report June 1992, QTP 92062 Version 3.1 256K SRAM FAB 3 QUALIFICATION MARKETING PART NUMBER DEVICE DESCRIPTION CY7C191 64K x 4, Seperate I/O, Transparent Write, Static RAM CY7C192 64K x 4, Seperate I/O, Static RAM CY7C194 64K x 4, Static RAM


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    CY7C191 CY7C192 CY7C194 CY7C196 CY7C197 CY7C198 CY7C199 CY7C191/192/194/195/196/197/198/199 15psig) CY7C191 CY7C192 CY7C194 CY7C196 CY7C197 CY7C198 CY7C199 PDF

    sumitomo epoxy eme6300h

    Abstract: eme6300h OP-128 130C JESD22 CY2292SC
    Contextual Info: Cypress Semiconductor Package Qualification Report QTP# 000101 VERSION 1.1 June, 2000 16 Lead, 150 mil, Plastic Small Outline IC SOIC OSE Philippines Assembly CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director (408) 432-7069


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    CY2292SC 85C/85 sumitomo epoxy eme6300h eme6300h OP-128 130C JESD22 CY2292SC PDF

    Tsi148-133IL

    Abstract: G770* sumitomo ablebond 2100A TSI148-133CL 2100a epoxy G770J A1001-01 8355F A1001 seal sumitomo
    Contextual Info: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1001-01 Product Affected: Date Effective: Contact: Title: Phone #: Fax #: E-mail: DATE: Apr 2, 2010 TSI148-133CL TSI148-133IL


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    A1001-01 TSI148-133CL TSI148-133IL Tsi148-133IL G770* sumitomo ablebond 2100A TSI148-133CL 2100a epoxy G770J A1001-01 8355F A1001 seal sumitomo PDF

    EME-7351

    Abstract: Sumitomo 1000 sumitomo epoxy sumitomo silver epoxy Compound JESD22-A112 EME7351 mold compound SUMITOMO 140C
    Contextual Info: Cypress Semiconductor Qualification Report QTP# 97351 VERSION 1.0 January, 1998 32 Ld TSOP Package - Sumitomo EME 7351 Mold Compound Anam, Korea Assembly Cypress Semiconductor Assembly: Anam, Korea Package: TSOP - Sumitomo EME-7351/S351 Mold Compound QTP# 97351, V. 1.0


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    EME-7351/S351 EME-7351 30C/60 CY7C109-ZC Sumitomo 1000 sumitomo epoxy sumitomo silver epoxy Compound JESD22-A112 EME7351 mold compound SUMITOMO 140C PDF

    7C453

    Contextual Info: Qualification Report June 1992, QTP 9113A Version 1.1 512, 2048 x 9 FIFO QUALIFICATION MARKETING PART NUMBER DEVICE DESCRIPTION CY7C453 2048 x 9 Cascadeable FIFO CY7C451 512 x 9 Cascadeable FIFO CY7C441 512 x 9 FIFO CY7C443 2048 x 9 FIFO PAGE 2 CYPRESS SEMICONDUCTOR


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    CY7C453 CY7C451 CY7C441 CY7C443 32-pin CY7C453/451 32-pin, 300Mil CY7C443/441 7C453 PDF

    1k SRAM

    Abstract: CY7C182-PC EME-6300H CY7C123
    Contextual Info: Qualification Report March 1995, QTP# 93351 Version 1.0 CY7C123 256 x 4 Static R/W RAM PRODUCT DESCRIPTION for qualification Information provided in this document is intended for generic qualification and technically describes the Cypress part supplied:


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    CY7C123 7C123A CY7C185-PC 200mA 1k SRAM CY7C182-PC EME-6300H CY7C123 PDF

    sumitomo crm epoxy

    Abstract: EME G600 CRM 1076NS SUMITOMO EME G600 sumitomo epoxy 1076 epoxy CRM1076NS Sumitomo CRM1076NS sumitomo crm crm-1076NS CRM1076NS
    Contextual Info: High-Speed DMOS Quad FET Analog Switch Arrays LLC SD5000 / SD5001 / SD5002 SD5400 / SD5401 / SD5402 FEATURES • • • • • • DESCRIPTION Low PropagatiomTime . . . . . . . . . . . . . . . . . . . . 600 psec Low On Resistance Low Insertion Loss Low Capacitance:


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    SD5000 SD5001 SD5002 SD5400 SD5401 SD5402 SD5000N SD5001N SD5002N sumitomo crm epoxy EME G600 CRM 1076NS SUMITOMO EME G600 sumitomo epoxy 1076 epoxy CRM1076NS Sumitomo CRM1076NS sumitomo crm crm-1076NS CRM1076NS PDF

    STMicroelectronics marking code date

    Abstract: Date Code Marking STMicroelectronics ST MICROELECTRONICS DATE CODE MARKING sumitomo crm epoxy Part Marking STMicroelectronics Ablebond 8360 marking code stmicroelectronics ablestik 8360 device Marking STMicroelectronics 1076E
    Contextual Info: PRODUCT/PROCESS CHANGE NOTIFICATION PCN MPG-EEP/04/451 FWH AND LPC FAMILY PLCC32 PACKAGE ENVIRONMENTAL FRIENDLY AND ASSEMBLY LOCATION CHANGE 2004/02/12 PCN MPG-EEP/04/451 Product Family /Commercial Product M50FW M50LPW M50FLW Type Of Change Multiple types of changes


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    MPG-EEP/04/451 PLCC32 M50FW M50LPW M50FLW 30-Apr-2004 30-May-2004 STMicroelectronics marking code date Date Code Marking STMicroelectronics ST MICROELECTRONICS DATE CODE MARKING sumitomo crm epoxy Part Marking STMicroelectronics Ablebond 8360 marking code stmicroelectronics ablestik 8360 device Marking STMicroelectronics 1076E PDF

    Ablebond 84-1*SR4

    Abstract: Ablebond 84-1LMISR4 ablebond epoxy 84-1LMISR4 MAX8211CPA lead frame cu C194 sumitomo silver epoxy 6300H C194 84-1lmisr4 sumitomo epoxy 6300h
    Contextual Info: Environmental Management and Materials Information Product Content Information for: MAX8211CPA+ Yes Lead−Free Qualified Moisture Sensitivity Level L1 Package Code Package Type Body Size Package Option Pin Count P8+1 PDIP .300" Standard 8 Qualified Assembler


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    MAX8211CPA+ UL-94 84-1LMISR4 Ablebond 84-1*SR4 Ablebond 84-1LMISR4 ablebond epoxy 84-1LMISR4 MAX8211CPA lead frame cu C194 sumitomo silver epoxy 6300H C194 84-1lmisr4 sumitomo epoxy 6300h PDF

    EME-7351

    Abstract: Compound sumitomo epoxy
    Contextual Info: Cypress Semiconductor Package Qualification Report QTP# 99112 VERSION 1.0 April, 2000 32 Lead 400mil SOJ Package Level 2 Omedata CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director (408) 432-7069 Cypress Semiconductor Package: 32 Lead (400mil) SOJ


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    400mil) 32Lead EME7351 CY7C109-VC CY7C109-VIB 85C/60 EME-7351 Compound sumitomo epoxy PDF

    SUMITOMO EME6600

    Abstract: SN 99053 99053 EME6600 JESD22 Cypress Semiconductor Qualification Report
    Contextual Info: Cypress Semiconductor Qualification Report QTP# 99053 VERSION 1.0 November, 1999 68 LD PLCC GEC Philippines CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director 408 432-7069 Cypress Semiconductor Assembly: GEC. Philippines QTP# 99053, V. 1.0


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    EME6600 30C/60 CY7C4285-JC 19902521-A SUMITOMO EME6600 SN 99053 99053 JESD22 Cypress Semiconductor Qualification Report PDF

    KOMATSU

    Abstract: CY7C199 JESD22
    Contextual Info: Qualification Report July 1996, QTP# 96112, Version 1.0 Komatsu Silicon Supplier Fab 4, 8" Prime N-type Wafer PRODUCT DESCRIPTION (for qualification) Information provided in this document is intended for generic qualification and technically describes the Cypress part


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    CY7C199 28-pin, 300-mil CY7C199) 7C199C CY7C199-20VCT 85C/85 KOMATSU CY7C199 JESD22 PDF

    SUMITOMO g700l

    Abstract: Ablestik 84-1LMIT1 G600 mold compound g700l G600 material composition sumitomo epoxy novolac SUMITOMO g600 bond wire gold 84-1LMIT1 Sumitomo EME6600D
    Contextual Info: SOT26 GaAs 20 Alpha Rd Chelmsford MA 01824 Tel:{978} 250-3343 Fax: {978} 250-3373 Product Information Product Environmental Data Sheet Date/Time Revision: Manufacture site: Product Number Product Name Product Mass Product Note February 25, 2005 Chelmsford MA


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    EME6600D SUMITOMO g700l Ablestik 84-1LMIT1 G600 mold compound g700l G600 material composition sumitomo epoxy novolac SUMITOMO g600 bond wire gold 84-1LMIT1 Sumitomo EME6600D PDF

    SUMITOMO g600f

    Abstract: G600F sumitomo epoxy G600F of bakelite material dali G600 Dissolve Oxygen 3540C
    Contextual Info: RESISTOR NETWORKS Bourns Manufacturers Representatives Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team Bourns Internal Bourns Plant Managers June, 2010 Thin Film on Silicon Resistor Networks Models 2NBS, 2QSP Mold Material Change


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    G600F. G600F N1031 KA/2010/30950A-04 SUMITOMO g600f sumitomo epoxy G600F of bakelite material dali G600 Dissolve Oxygen 3540C PDF

    96056

    Abstract: 140C CY7B8392 CY7B8392-JC CY7B8392-PC EME-6300H plcc-16 pin
    Contextual Info: Qualification Report September 1996, QTP# 96312, Version 1.0 CY7B8392 Ethernet Coax Transceiver Interface PRODUCT DESCRIPTION (for qualification) Information provided in this document is intended for generic qualification and technically describes the Cypress part


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    CY7B8392 28-pin 16-pin, 300-mil 7B9392 SM8392-PC CY7B8392-PC 85C/85 96056 140C CY7B8392 CY7B8392-JC CY7B8392-PC EME-6300H plcc-16 pin PDF

    CY7C185

    Abstract: CY6264 CY7C164 CY7C166 CY7C187
    Contextual Info: Qualification Report December 1996, QTP# 95515/96024 Version 2.1 64K SRAM, RAM28 TECHNOLOGY MARKETING PART NUMBER DEVICE DESCRIPTION CY7C185/186 8K x 8 Static RAM, OE & CE, Common I/O CY6264 8K x 8 Static RAM, OE & CE, Common I/O CY7C161/162 16K x 4 Static RAM, OE & CE, Separate I/O


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    RAM28 CY7C185/186 CY6264 CY7C161/162 CY7C164 CY7C166 CY7C187 CY7C185 28-pin, 300-mil CY7C185 CY6264 CY7C164 CY7C166 CY7C187 PDF

    cy7c9101

    Abstract: cy7c9101* Datasheet CY7B145 EME-6300H PALC22V10 12955 MIL-STD-883C method 2011
    Contextual Info: Qualification Report QTP# 95052, Version 1.0 ANAM-PHILIPPINES SUB CONTRACTOR 20-68 Pins PLCC Package, None Die Coat PRODUCT DESCRIPTION (for qualification) Information provided in this document is intended for generic qualification and technically describes the Cypress part


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    PALC22V10/CY7C9101/CY7B145 28-Pins PALC22V10) 68-Pins CY7C9101/CY7B145) PALC222V10) 16-Bit CY7C9101) CY7B145) cy7c9101 cy7c9101* Datasheet CY7B145 EME-6300H PALC22V10 12955 MIL-STD-883C method 2011 PDF

    EME-7351

    Abstract: Ablestik 8361 140C JESD22 JESD22-A112
    Contextual Info: Cypress Semiconductor Qualification Report QTP# 97098 VERSION 1.0 April, 1997 28 Ld Thin Small Outline Package TSOP Anam, Philippines Cypress Semiconductor Assembly: Anam, Philippines Package: TSOP QTP# 97098, V. 1.0 Page 2 of 4 April, 1997 PLASTIC PACKAGE/ASSEMBLY DESCRIPTION


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    209mil JESD22-A11 85C/85 CY7C199-ZC EME-7351 Ablestik 8361 140C JESD22 JESD22-A112 PDF

    CY6264

    Abstract: CY7C164 CY7C166 CY7C185 CY7C187
    Contextual Info: Qualification Report December 1996, QTP# 95311, Version 1.1 64K SRAM, RAM28 TECHNOLOGY MARKETING PART NUMBER DEVICE DESCRIPTION CY7C185/186 8K x 8 Static RAM, OE & CE, Common I/O CY6264 8K x 8 Static RAM, OE & CE, Common I/O CY7C161/162 16K x 4 Static RAM, OE & CE, Separate I/O


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    RAM28 CY7C185/186 CY6264 CY7C161/162 CY7C164 CY7C166 CY7C187 CY7C185 28-pin, 300-mil CY6264 CY7C164 CY7C166 CY7C185 CY7C187 PDF