SUMITOMO EME Search Results

EME-7351

Abstract: Sumitomo 1000 sumitomo epoxy sumitomo silver epoxy Compound JESD22-A112 EME7351 mold compound SUMITOMO 140C
Contextual Info: Cypress Semiconductor Qualification Report QTP# 97351 VERSION 1.0 January, 1998 32 Ld TSOP Package - Sumitomo EME 7351 Mold Compound Anam, Korea Assembly Cypress Semiconductor Assembly: Anam, Korea Package: TSOP - Sumitomo EME-7351/S351 Mold Compound QTP# 97351, V. 1.0

P7060

Abstract: KMC188-1 KMC-188-1 plaskon TEXAS INSTRUMENTS, Mold 5262a 500 mold compound EME6250 EME6750
Contextual Info: TEXAS INSTRUMENTS Final Notification for PDIP/PLCC Package Mold Compound Change to Sumitomo EME6300HS September 20, 1996 Abstract Texas Instruments is making its final announcement of its implementation of the new mold compound material SUMITOMO EME6300HS in its manufacturing facility in TI Philippines, Inc.

sumitomo epoxy

Abstract: sumitomo EME-7351LS EME7351LS EME7351UT Compound EME-7351
Contextual Info: TO: ALL PERICOM CUSTOMERS SUBJECT: Sumitomo Epoxy Mold Compound Issue – EME7351UT Pericom’s current plastic encapsulated, Surface Mount Technology SMT packaged peripheral leaded products do not utilize Sumitomo’s EME7351UT mold compound. This epoxy uses a Particled Phosphorus Flame Retardant Agent, which was found by some

Contextual Info: DCS/PCN-1134 PRODUCT CHANGE NOTICE Initial Final Contact Date: Implementation Date: Alert Category: Alert Type: PCN #: April 30, 2009 May 30, 2009 Material Change Mold compound/die attach change PCN #: 1134 TITLE Conversion of Sumitomo mold compound EME-6300H being discontinued by manufacturer to Sumitomo equivalent mold

sumitomo 6600

Abstract: sumitomo epoxy 6600 4835 sumitomo EME 6600 sumitomo epoxy 8361H CY74FCT2245ATQC CY74FCT2646ATQC CY7C199-12VC JESD22
Contextual Info: Cypress Semiconductor Qualification Report QTP# 99101 VERSION 1.0 May, 1999 Sumitomo EME 6600CR Molding Compound Cypress Philippines CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Cypress Semiconductor Quality and Reliability Department Cypress Semiconductor

sumitomo epoxy

Abstract: 7C109A CY7C109 EME TI
Contextual Info: Qualification Report January 1997 QTP# 95483, Version 1.0 SUMITOMO EME-9300 Low Alpha Molding Compound PRODUCT DESCRIPTION (for qualification) Information provided in this document is intended for generic qualification and technically describes the Cypress part

EME 7320

Abstract: Ablestik Ablestik 8361 7320 a144g SUMITOMO EME G A100A CY7C09579V-AC JESD22 ASE Cypress
Contextual Info: Cypress Semiconductor Mold Compound Qualification Report QTP# 002403 VERSION 1.0 January, 2001 Sumitomo EME 7320 Mold Compound, MSL3 for DCD-Thin Quad Flat Pack, TQFP ASE Taiwan CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director

sumitomo epoxy

Abstract: EME 7320 7320 8361H CY7C375-AC JESD22
Contextual Info: Cypress Semiconductor Package Qualification Report QTP# 000303 VERSION 1.1 March, 2000 Up to160 Lead Thin Quad Flat Pack Sumitomo EME 7320 Mold Compound ASE Taiwan CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director 408 432-7069

QMI 509 epoxy

Abstract: SUMITOMO eme-6600hr 6600HR SOJ package MSL QMI 509 epoxy datasheet CY7C63001A-SC JESD22 EME6600HR mold compound EME 6600HR
Contextual Info: Cypress Semiconductor Package Qualification Report QTP# 023401 VERSION 2.0 GI July, 2004 32-lead SOIC package using Sumitomo EME 6600HR Mold Compound, MSL1 Cypress Philippines CML-R CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Mira Ben-Tzur Principal Reliability Engineer

EME-7351

Abstract: 140C 8361H JESD22 sumitomo silver epoxy
Contextual Info: Cypress Semiconductor Qualification Report QTP# 97514 VERSION 1.0 July, 1998 28 Ld TSOP Package Sumitomo EME-7351 Molding Compound Cypress Philippines Assembly Cypress Semiconductor Assembly: Cypress Philippines Package: 28 Ld TSOP QTP# 97514, V. 1.0 Page 2 of 4

SUMITOMO EME6600

Abstract: EME6600 Compound 6600cs 3818 MIL-STD-883c-method 1010 6600CS
Contextual Info: Cypress Semiconductor Package Qualification Report QTP# 99234 VERSION 1.1 September 2000 52-208-pin Plastic Quad Flatpack Package PQFP Sumitomo 6600CS molding Compound ASE Taiwan CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director

PCN0310

Abstract: EME-6300 MP-8000 MP8000 Nitto MP 7000 ASE QFP 8000 Series mold compound EME6300 Nitto MP 8000
Contextual Info: PROCESS CHANGE NOTICE PCN0310 MOLD COMPOUND CHANGE FOR 100 LEAD QFP PACKAGE Change Description: ASE Malaysia will be extending the use of Nitto’s MP-8000 series mold compound to Altera’s 100 lead Quad Flat Package. Currently this package is using Sumitomo’s EME-6300 series

SUMITOMO EME-1100H

Abstract: mold compound SUMITOMO Compound DS2400 1100-H 1100H CARSEM DS1233 DS1410D
Contextual Info: DALLAS SEMICONDUCTOR 4401 South Beltwood Parkway Dallas, Texas 75244–3292 214 450–0400 Date: March 6, 1997 Subject: PRODUCT CHANGE NOTICE – B70601 Description: Qual of 6710S Mold Compound at Carsem for SOT 233 Packages Description of Change: SOT 223 packages are currently assembled with SUMITOMO EME 1100H mold compound. Proposed

PCN0404

Abstract: SUMITOMO g700l sumitomo EME G700L G700L TQFP 144 PACKAGE Compound SUMITOMO mold compound TQFP 144 PACKAGE altera G700
Contextual Info: PROCESS CHANGE NOTICE PCN0404 ADDITIONAL MOLD COMPOUND FOR TQFP 144 PACKAGE Change Description: The Sumitomo G700L mold compound is being added as additional mold compound choice for selected Altera devices in thin quad flat pack TQFP 144 lead packages assembled by

sumitomo crm

Abstract: CRM-501 SUMITOMO CDC2582 CDC2586 CDC582 CDC586 SN74ABT32316 SN74ABT32318 CEL-X-9000
Contextual Info: TEXAS INSTRUMENTS Notification of the Planned Qualification for Certain ASL TQFP Packages at the Hiji, Japan Assembly Site January 19, 1996 Abstract Texas Instruments Advanced System Logic ASL is consolidating the manufacture of certain TQFP packaged devices. The affected devices, currently being built in TI’s Philippines and Sherman, Texas

en4065

Abstract: EN-4065 SUMITOMO eme Sumitomo 1000 SN74FB1650 SN74FB1651 TNETA1611 TEXAS INSTRUMENTS, Mold Compound sumitomo hitachi en 4065
Contextual Info: TEXAS INSTRUMENTS Notification for the Planned Qualification for the 100 Pin PCA and 120 Pin PCB Packages at the Hiji, Japan Assembly Site Initial Notification of Planned Qualification for the 100 Pin PCA and 120 Pin PCB Packages at the Hiji, Japan Assembly Site

sumitomo

Abstract: en4065 SUMITOMO eme 5274A 50C24 hitachi trace code hitachi assembly date code Sumitomo 1000 SN74FB1650 SN74FB1651
Contextual Info: TEXAS INSTRUMENTS Final Notification of Qualification for the 100 Pin PCA and 120 Pin PCB Packages at the Hiji, Japan Assembly Site February 5, 1997 Abstract Texas Instruments Standard Linear and Logic SLL is adding Hiji as a qualified assembly site for

PCN0702

Abstract: SUMITOMO G700 SUMITOMO G600 SUMITOMO EME G700 sumitomo 6300h mold compound SUMITOMO EME G600 EME G600 material properties G600 mold compound mp8000ch4 sumitomo G700 Tg
Contextual Info: Revision: 1.2.0 PROCESS CHANGE NOTIFICATION PCN0702 UPDATE MOLD COMPOUND CHANGE FOR PQFP, PDIP, AND RQFP PACKAGES Change Description: This is an update to PCN0702, published March, 2007. Altera is implementing mold compound material changes on the Plastic Quad Flat Pack PQFP , Plastic Dual In-Line

sumitomo epoxy 6300h

Abstract: sumitomo epoxy wafer LTO CY74FCT16244T EME-6300H hysol sumitomo 6300h mold compound
Contextual Info: Qualification Report March, 1995 QTP# 94432/94434 Version 1.0 16-Bit Buffers/Line Drivers/Transceiver CYPRESS SEMICONDUCTOR PAGE 3 PRODUCT DESCRIPTION for qualification Information provided in this document is intended for generic qualification and technically describes the Cypress part

74CT573

Abstract: MALAYSIA CDIP28 TSOC 6 socket 74FCT191 74FCT543 hysol sumitomo epoxy sumitomo epoxy 6300h TSOC
Contextual Info: Qualification Report January, 1995 QTP# 94048 Version 1.3 FAB3 0.65 µm FCT-T PRODUCTS CYPRESS SEMICONDUCTOR PAGE 3 PRODUCT DESCRIPTION for qualification Information provided in this document is intended for generic qualification and technically describes the Cypress part

CY7C190

Abstract: cy7c189 sumitomo silver epoxy 7C189 EME-6300H UL-94V0 lc 245a CY27S07 dynamic ram cmos 16pin 7C190
Contextual Info: Qualification Report January 1992 QTP 90313 64 Bit Static RAM Family MARKETING PART NBR DEVICE DESCRIPTION CY7C189 Inverted R/W CY7C190 R/W Version 1.1 PRODUCT DESCRIPTION for qualification Information provided in this document is intended for generic qualification and technically describes the Cypress part

8361J

Abstract: mp8000ch4 Ablestik sumitomo crm EME-G700L g700l R6786-24 sumitomo EME G700L SUMITOMO g700l EME-G700
Contextual Info: February 24, 2005 CN 022405 Customer Notification Assembly Subcontractor Change for QFP and PLCC Packaged Devices Dear Valued Customer: This notification is for the purpose of informing you of a change by Mindspeed Technologies in the packages used for the following devices:

sumitomo epoxy

Abstract: CY74FCT16543T EME-6300H O5611 MANUFACTURER AND SUPPLIER LOCATION INFORMATION
Contextual Info: Qualification Report July, 1995 QTP# 94431 Version 1.0 56-Pins SSOP package CYPRESS SEMICONDUCTOR PAGE 3 PRODUCT DESCRIPTION for qualification Information provided in this document is intended for generic qualification and technically describes the Cypress part

CY7C128A 16k sram

Abstract: CY7C128A SRAM CY7C128A CY7C167A CY7C168A CY7C169A CY7C170A CY7C171A CY7C172A EME-6300H
Contextual Info: Qualification Report June, 1994, QTP# 91423/93201 Version 1.1 16K Chop Redesign MARKETING PART NUMBER DEVICE DESCRIPTION CY7C128A 2K x 8 Static R/W RAM CY7C167A 16K x 1 Static R/W RAM CY7C168A 4K x 4 Static RAM CY7C169A 4K x 4 Static RAM CY7C170A 4K x 4 Static RAM