COMPOUND Search Results

Contextual Info: Special Connectors Battery Connectors 2.5mm/3.0mm Pitch 2.5mm Pitch, Plug Assembly 10 Position, Part Number : 1123684-7 Material and Finish : Housing — Thermoplastic Molding Compound, UL94V-0 -32.9-28.7- rated, black Contact — Copper Alloy, Nickel-underplated all over,

PHOTO SENSORS

Abstract: fiber optical photo detector LED Reflective Optical Sensor Infrared photosensor OPTICAL INTERRUPTER position infrared detector object detection
Contextual Info: S. Classification of Photo Sensors The Toshiba Photo Sensor is classified as follows: Infrared LED [Emitters Visible LED Photo Transistor Photo sensors• Photo Diode IDetectors Photo 1C : Photo Interrupter ; Compound ; sensors : Photo Reflective Sensor 3. Photosensor Applications

35502a

Contextual Info: 2A01G - 2A07G CREAT BY ART Pb 2.0 AMPS. Glass Passivated Rectifiers DO-15 RoHS COMPLIANCE Features Glass passivated chip junction High efficiency, Low VF High current capability High reliability High surge current capability Low power loss Green compound with suffix "G" on packing

material safety for neoprene rubber

Abstract: cas number 00840600 coc fire fighting
Contextual Info: Material Safety Data Sheet MSDS Information = Section 1. CHEMICAL PRODUCT SECTION Product Name: Silicone Free Heat Sink Compound Product Number: 1978 General Use: Product Description:

Resistor 600 ohm 25W

Contextual Info: BVM Series Stackpole Electronics, Inc. Ceramic Housed Vertical Bracket Mount Resistor Features: • • • • • • Resistive Product Solutions Flameproof inorganic construction High temperature potting compound Non-inductive available up to 50Ω RoHS compliant / lead-free

PDR5K

Abstract: PDR5K-13
Contextual Info: PDR5K 5A GLASS PASSIVATED RECTIFIER PowerDI 5 Features Mechanical Data • • • • • • Glass Passivated Die Construction Low Leakage Current Lead Free Finish, RoHS Compliant Note 1 "Green" Molding Compound (No Br, Sb) • • NEW PRODUCT • •

Contextual Info: BC817 SERIES NPN GENERAL PURPOSE TRANSISTORS 45 Volt VOLTAGE POWER 330 mW • General purpose amplifier applications • NPN epitaxial silicon, planar design • Collector current IC = 500mA • Lead free in compliance with EU RoHS 2011/65/EU directive • Green molding compound as per IEC61249 Std. . Halogen Free

Contextual Info: 2SC2411K NPN GENERAL PURPOSE SWITCHING TRANSISTOR VOLTAGE 32 Volts POWER 225mW • NPN epitaxial silicon,planar design • Collector-emitter voltage VCE=32V • Collector current IC=500mA • Lead free in comply with EU RoHS 2011/65/EU directives. • Green molding compound as per IEC61249 Std. . Halogen Free

Contextual Info: LM5111 LM5111 Dual 5A Compound Gate Driver Literature Number: SNVS300F LM5111 Dual 5A Compound Gate Driver General Description The LM5111 Dual Gate Driver replaces industry standard gate drivers with improved peak output current and efficiency. Each “compound” output driver stage includes MOS and bipolar transistors operating in parallel that together sink more

512nm

Abstract: 1000PPM 506nm
Contextual Info: COTCO LUMINANT DEVICE HUIZHOU LTD. SPECIFICATION FOR COTCO LED LAMP Document No : Model No: Rev. No : Date: SPE/ LD-700ABG1-D0 LD-700ABG1-D0 01 2005-09-16 Description: 7 x 7mm, QFN Type, High Power Bluish Green LED For Illumination, Clear Compound Encapsulated.

1000PPM

Abstract: LD-701CHR1-A5 5202 GE
Contextual Info: COTCO LUMINANT DEVICE HUIZHOU LTD. SPECIFICATION FOR COTCO LED LAMP Document No : Model No: Rev. No : Date: SPE/ LD-701CHR1-A5 LD-701CHR1-A5 04 2005-07-20 Description: 7 x 7mm, QFN Type, High Power Red LED For Illumination, Clear Compound Encapsulated. Dice Material:

1000PPM

Abstract: LD-300DWN1-70 4044v LD300
Contextual Info: COTCO LUMINANT DEVICE HUIZHOU LTD. SPECIFICATION FOR COTCO LED LAMP Document No : Model No: Rev. No : Date: SPE/LD-300DWN1-70 LD-300DWN1-70 01 2005-10-6 Description: 3 x 3mm, QFN Type, High Power White LED For Illumination, Clear Compound Encapsulated. Dice Material:

QMI 509 epoxy

Abstract: SUMITOMO eme-6600hr 6600HR SOJ package MSL QMI 509 epoxy datasheet CY7C63001A-SC JESD22 EME6600HR mold compound EME 6600HR
Contextual Info: Cypress Semiconductor Package Qualification Report QTP# 023401 VERSION 2.0 GI July, 2004 32-lead SOIC package using Sumitomo EME 6600HR Mold Compound, MSL1 Cypress Philippines CML-R CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Mira Ben-Tzur Principal Reliability Engineer

Contextual Info: DATA SHEET COMPOUND TRANSISTOR AA1L4Z on-chip resistor NPN silicon epitaxial transistor For mid-speed switching FEATURES PACKAGE DRAWING UNIT: mm • On-chip bias resistor (R1 = 47 kΩ) • Complementary transistor with AN1L4Z ABSOLUTE MAXIMUM RATINGS (Ta = 25°°C)

Contextual Info: BC856 PNP General Purpose Transistor FEATURES • Ideally suited for automatic insertion • For Switching and AF Amplifier Applications MECHANICAL DATA • Case: SOT-23 Plastic • Case material: “Green” molding compound, UL flammability classification 94V-0, No Br. Sb. CI

Contextual Info: DS520-30LED02 SURFACE MOUNT SCHOTTKY BARRIER DIODE REVERSE VOLTAGE – 30 Volts FORWARD CURRENT – 0.1 Ampere FEATURES • Low VF drop • Low Reverse Current MECHANICAL DATA • Case: QFN_1.0*0.6*0.5 package. • Case Material: “Green” molding compound, UL flammability classification 94V-0, No Br. Sb. CI

Contextual Info: Formosa MS Chip Schottky Barrier Diodes FM320 THRU FM3100 Silicon epitaxial planer type Features SMC Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy Molding Compound. 0.283 7.2 0.260(6.6) For surface mounted applications.

Contextual Info: Formosa MS Chip Schottky Barrier Diodes FM5817-L THRU FM5819-L Silicon epitaxial planer type Features SMA-L Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy Molding Compound. 0.205 5.2 0.189(4.8)

Contextual Info: Formosa MS Chip Schottky Barrier Diodes FM320-B THRU FM3100-B Silicon epitaxial planer type Features SMB Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy Molding Compound. 0.213 5.4 0.197(5.0) 0.016(0.4) Typ.

Contextual Info: Formosa MS Chip Silicon Rectifier FM4001 THRU FM4007 Glass passivated type Features SMA Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy Molding Compound. 0.189 4.8 0.165(4.2) 0.012(0.3) Typ. For surface mounted applications.

Contextual Info: Formosa MS Low VF Chip Schottky Barrier Diodes SL32-A THRU SL34-A Silicon epitaxial planer type Features SMA Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy Molding Compound. 0.189 4.8 0.165(4.2)

Contextual Info: Formosa MS Chip Schottky Barrier Diodes FM520-B THRU FM5100-B Silicon epitaxial planer type Features SMB Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy Molding Compound. 0.213 5.4 0.197(5.0) 0.016(0.4) Typ.

Contextual Info: Formosa MS Chip Schottky Barrier Diodes FM1020-T1 THRU FM1040-T1 Silicon epitaxial planer type Features SMC-T1 Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy Molding Compound. 0.272 6.9 0.248(6.3)

Contextual Info: Formosa MS Chip Schottky Barrier Diodes FM120-S THRU FM1100-S Silicon epitaxial planer type Features SMA-S Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy Molding Compound. 0.205 5.2 0.189(4.8)