QMI 509 epoxy
Abstract: SUMITOMO eme-6600hr 6600HR SOJ package MSL QMI 509 epoxy datasheet CY7C63001A-SC JESD22 EME6600HR mold compound EME 6600HR
Contextual Info: Cypress Semiconductor Package Qualification Report QTP# 023401 VERSION 2.0 GI July, 2004 32-lead SOIC package using Sumitomo EME 6600HR Mold Compound, MSL1 Cypress Philippines CML-R CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Mira Ben-Tzur Principal Reliability Engineer
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32-lead6600hr28-44lead635mils+1201bll-si610221877mcy62128bll-siqmi 509 epoxysumitomo eme-6600hrsoj package mslqmi 509 epoxy datasheetcy7c63001a-scjesd22eme6600hrmold compoundeme 6600hr
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