sumitomo epoxy
Abstract: sumitomo EME-7351LS EME7351LS EME7351UT Compound EME-7351
Contextual Info: TO: ALL PERICOM CUSTOMERS SUBJECT: Sumitomo Epoxy Mold Compound Issue – EME7351UT Pericom’s current plastic encapsulated, Surface Mount Technology SMT packaged peripheral leaded products do not utilize Sumitomo’s EME7351UT mold compound. This epoxy uses a Particled Phosphorus Flame Retardant Agent, which was found by some
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eme7351uteme7351useme7351lssumitomo epoxy+4sumitomoeme-7351lscompoundeme-7351
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EME-7351
Abstract: 140C 8361H JESD22 sumitomo silver epoxy
Contextual Info: Cypress Semiconductor Qualification Report QTP# 97514 VERSION 1.0 July, 1998 28 Ld TSOP Package Sumitomo EME-7351 Molding Compound Cypress Philippines Assembly Cypress Semiconductor Assembly: Cypress Philippines Package: 28 Ld TSOP QTP# 97514, V. 1.0 Page 2 of 4
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eme-73518361hjesd22-a112cy7c199-zc+3140cjesd22sumitomo silver epoxy
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8361H
Abstract: EME-7351 Ablestik JESD22 hitachi mold cel copper bond wire tsop package 99344
Contextual Info: Cypress Semiconductor Reflow Qualification Report QTP# 99344 VERSION 2.0 November, 2000 235°°C Solder Reflow Profile TSOP Package Family All assembly sites for these packages CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director
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zs444n44-lead619919886qcy7c199-zc+1130c/60cy7c1021-zsccy62128-zc8361heme-7351ablestikjesd22hitachi mold celcopper bond wiretsop package99344
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a13 sot23-5
Abstract: sine wave generator using LM358 EME-7351 A14* marking sot23-5 SOT23 M7 simple LM324 COMPARATOR CIRCUIT a13 marking sot23 Analog devices marking Information PACKAGE SOIC eme marking sot23 LMV321M5
Contextual Info: t s e all r o t a r a p m o C & SPRING p m Sm SI SC7 NGLE 0-5/ SOT +IN 1 23-5 Op A in D l r o W e h t s ’ e s On thi for V- 2 LMV821 LMV358 LMV393 LMV822 LMV324 LMV339 LMV824 A UT O • Rail-to-Rail Output 50% Smaller than SOT-23 Supply Operation build an we
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lmv821lmv358lmv393lmv822+13lmv324lmv339ot-23a13 sot23-5sine wave generator using lm358eme-7351a14* marking sot23-5sot23 m7simple lm324 comparator circuita13 marking sot23analog devices marking information package soiceme marking sot23lmv321m5
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Ablebond 84-1*SR4
Abstract: z9925 EIAJ ED-4701 MARK A48 857L TSMC 0.35um Volt, SPDM, CMOS 98068A 0.6 um cmos process ablebond 84-1lmisr4
Contextual Info: Reliability Summary Report PI6CV857A August 28, 2002 Reliability by Design Page 1 of 20 INDEX: Commitment to Quality: Page 3 Product Family and Wafer Fab Process: Page 4 Wafer Fab Subcontractors and Codes: Page 4 Standard Package Type Code and Dimensions:
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pi6cv857aablebond 84-1*sr4z9925eiaj ed-4701+7mark a48857ltsmc 0.35umvolt, spdm, cmos98068a0.6 um cmos processablebond 84-1lmisr4
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EME-7351
Abstract: Sumitomo 1000 sumitomo epoxy sumitomo silver epoxy Compound JESD22-A112 EME7351 mold compound SUMITOMO 140C
Contextual Info: Cypress Semiconductor Qualification Report QTP# 97351 VERSION 1.0 January, 1998 32 Ld TSOP Package - Sumitomo EME 7351 Mold Compound Anam, Korea Assembly Cypress Semiconductor Assembly: Anam, Korea Package: TSOP - Sumitomo EME-7351/S351 Mold Compound QTP# 97351, V. 1.0
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eme-7351/s351eme-735130c/60cy7c109-zc+9sumitomo 1000sumitomo epoxysumitomo silver epoxycompoundjesd22-a112eme7351mold compoundsumitomo140c
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EME-7351
Abstract: JESD22 140C EME-7351LS
Contextual Info: Cypress Semiconductor Qualification Report QTP# 98191/92VERSION 1.0 August, 1998 32 Ld TSOP Type I Package Gateway Electronics, Philippines Cypress Semiconductor Assembly: Gateway Electronic, Philippines Package: TSOP, Type I QTP# 98191/92, V. 1.0 Page 2 of 4
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98191/92versioneme-7351lsjesd22-a11230c/60+67c109gc-gwzc619804698l619804698l1eme-7351jesd22140c
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EME-7351
Abstract: Compound sumitomo epoxy
Contextual Info: Cypress Semiconductor Package Qualification Report QTP# 99112 VERSION 1.0 April, 2000 32 Lead 400mil SOJ Package Level 2 Omedata CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director (408) 432-7069 Cypress Semiconductor Package: 32 Lead (400mil) SOJ
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400mil32leademe7351cy7c109-vc+5cy7c109-vib85c/60eme-7351compoundsumitomo epoxy
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JEDEC JESD22-B116
Abstract: SUMIKON EME EME7351-LP EME-7351 71V016H KMC-184 JESD22-B116 mold compound MIL-STD-883 shinetsu KMC-184
Contextual Info: Integrated Device Technology, Inc. 2975 Stender Way, Santa Clara, CA - 95054 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: G-0110-06 Product Affected: Date Effective: DATE: 12/14/2001 Package Family TSSOP, TQFP, TSOP March 15, 2002 Contact: Geoffrey Cortes Manager, Corporate Quality & Reliability
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g-0110-06eme-7351lpeme-s351lp4-10h+10jedec jesd22-b116sumikon emeeme7351-lpeme-735171v016hkmc-184jesd22-b116mold compoundmil-std-883shinetsu kmc-184
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EME-6300
Abstract: eme6600cs EME6600 EME6300 G700 eme-6600cs JESD22-A113 mp8000 EME-7351 MP-8000
Contextual Info: MOISTURE SENSITIVITY CLASSIFICATION OF MICREL SURFACE MOUNT PACKAGES HOW TO USE THIS TABLE: PRODUCT AND PACKAGES CLASSIFIED LEVEL 3 REQUIRE BAKE AND DRY PACK WITH APPROPRIATE WARNING LABEL PRODUCT AND PACKAGES CLASSIFIED LEVEL 2 REQUIRE DRY PACK ONLY WITH APPROPRIATE WARNING LABEL
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o-263sc-70mic2529mic2527+13sy69952mic5400eme6300150x150eme-6300eme6600cseme6600g700eme-6600csjesd22-a113mp8000eme-7351mp-8000
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MP 130B
Abstract: sumitomo epoxy LPV324M MP 130B 02 cf 5097 nitto UV tape A193K NSC marking code PB eme-7351ls eme marking sot23
Contextual Info: LPV321/358/324 Qualification Package 9µA Op Amp Family With 150kHz GBW NEW LPV FAMILY Part # Function Package LPV321 LPV358 LPV324 Single Dual Quad SC70-5, SOT23-5 SOIC, MSOP SOIC, TSSOP LPV Series LMV Series National’s Low-Power LPV300 Familiy IN SC70 Packaging
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lpv321/358/324150khzlpv321lpv358+15lpv324sc70-5ot23-5lpv300lpv321/lpv358/lpv324mp 130bsumitomo epoxylpv324mmp 130b 02cf 5097nitto uv tapea193knsc marking code pbeme-7351lseme marking sot23
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TTL 7400 national semiconductor
Abstract: sine wave generator using LM358 a13 marking sot23 eme marking sot23 lm358 sum LMV321 LMV321M5 LMV324 MAL LM393 LMV339
Contextual Info: t s e l mal r o t a r a p m o C & SPRING p m S SI SC7 NGLE 0-5/ SOT +IN 1 23-5 Op A in D l r o the W s ’ e n s O thi for V- 2 Click Here For Web Info LMV321 LMV331 LMV821 LMV358 LMV393 LMV822 LMV324 LMV339 LMV824 1 SOT-23 + 8 V TB 6 IN B 7 OU A – + A - 2
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lmv321lmv331lmv821lmv358+12lmv393lmv822lmv324lmv339ot-23ttl 7400 national semiconductorsine wave generator using lm358a13 marking sot23eme marking sot23lm358 sumlmv321m5mal lm393
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QMI519
Abstract: KEG3000D QMI-519 ra3906 GR828FC Kyocera mold compound Hitachi Datecode KE-G300 KE-G3000 Henkel
Contextual Info: Date Created: 1/28/2004 Date Issued: 3/2/2004 PCN # 20040411 DESIGN/PROCESS CHANGE NOTIFICATION - FINAL This is to inform you that a design and/or process change will be made to the following product s . This notification is for your information and concurrence.
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epax02ext686mm74hct00mtcxmm74hct05mtc+13mm74hct08mtcxmm74hct14mtcmm74hct240mtcxqmi519keg3000dqmi-519ra3906gr828fckyocera mold compoundhitachi datecodeke-g300ke-g3000henkel
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leadframe C7025
Abstract: Ablestik 84-1 EME7351T Ablestik 84-1 lmis-r4 74LCXR162245MTX Ablestik LMISR4 FSTUD16211MTDX Sumitomo 7351T Ablestik leadframe Cu C7025
Contextual Info: Date Created: 4/21/2004 Date Issued: 5/3/2004 PCN # 20033907-B DESIGN/PROCESS CHANGE NOTIFICATION - FINAL This is to inform you that a design and/or process change will be made to the following product s . This notification is for your information and concurrence.
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20033907-bepax026437211ext74vcxh16374mtdx+1674vhc161284mtdfin1108mtdxfin1216mtdfin1217mtdxfin3383mtdfin3385mtdxleadframe c7025ablestik 84-1eme7351tablestik 84-1 lmis-r474lcxr162245mtxablestik lmisr4fstud16211mtdxsumitomo 7351tablestikleadframe cu c7025
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