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8361H Abstract: EME-7351 Ablestik JESD22 hitachi mold cel copper bond wire tsop package 99344 Contextual Info: Cypress Semiconductor Reflow Qualification Report QTP# 99344 VERSION 2.0 November, 2000 235°°C Solder Reflow Profile TSOP Package Family All assembly sites for these packages CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director	Original	zs444n 44-lead 619919886q cy7c199-zc +1130c/60 cy7c1021-zsc cy62128-zc 8361h eme-7351 ablestik jesd22 hitachi mold cel copper bond wire tsop package 99344	PDF

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8361H

Abstract: EME-7351 Ablestik JESD22 hitachi mold cel copper bond wire tsop package 99344
Contextual Info: Cypress Semiconductor Reflow Qualification Report QTP# 99344 VERSION 2.0 November, 2000 235°°C Solder Reflow Profile TSOP Package Family All assembly sites for these packages CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director

Original

zs444n 44-lead 619919886q cy7c199-zc +11

PDF