RQFP Search Results

Contextual Info: Com m ercial/Industrial D ev ice s PLCC 44 68 84 PQFP 100 144 160 208 240 RQFP 208 240 VQFP 80 TQFP 100 144 BGA 225 176 272 313 CPGA 329 84 100 132/133 175/176 207 257 CQFP 84 132 172 196 208 256 HiRel/Space D evice RadTolerant < o o 12 x CM CO X 5 A </

AF14

Abstract: AC22 AE23 EPF10K200S AE10-AE11 AE20-AE21 AJ43
Contextual Info: EPF10K200S Device Pin-Outs ver. 1.0 Pin Name 1 240-Pin RQFP 356-Pin FineLine BGA 484-Pin FineLine BGA 599-Pin PGA 600-Pin BGA 672-Pin FineLine BGA MSEL0 (2) MSEL1 (2) nSTATUS (2) nCONFIG (2) DCLK (2) CONF_DONE (2) INIT_DONE (3) nCE (2) nCEO (2) nWS (4) nRS (4)

ADV9401

Abstract: RQFP ALTERA PART MARKING EPF81188ARC240-3 on 240 EPF81188RI240-3 marked EPF81188ARC240-2 EPF81188ARC240-4 altera MARKING
Contextual Info: December 14, 1994 Dear Customer: Effective January 1, 1995, Altera will institute a new marking procedure on 240- and 304-pin Power Quad 2 packages. These changes are only aesthetic in nature and do not affect the functionality of the devices. Figure 1 illustrates the new mark that will appear on 240-pin RQFP and 304-pin RQFP

PCN0702

Abstract: SUMITOMO G700 SUMITOMO G600 SUMITOMO EME G700 sumitomo 6300h mold compound SUMITOMO EME G600 EME G600 material properties G600 mold compound mp8000ch4 sumitomo G700 Tg
Contextual Info: Revision: 1.2.0 PROCESS CHANGE NOTIFICATION PCN0702 UPDATE MOLD COMPOUND CHANGE FOR PQFP, PDIP, AND RQFP PACKAGES Change Description: This is an update to PCN0702, published March, 2007. Altera is implementing mold compound material changes on the Plastic Quad Flat Pack PQFP , Plastic Dual In-Line

Contextual Info: FLEX 8000 ^ nyA \ September 1994, ver. 1 Program m able Logic Device Fam ily Data Sheet Supplement This data sheet supplement provides updated information for the 280-pin pin-grid array PGA and 304-pin power quad flat pack (RQFP) packages (see Figures 1 and 2, respectively). This supplement must be used together

ipc-sm-786A

Abstract: EPX780 altera TQFP 32 PACKAGE EPF10K20 EPF10K30 EPF10K40 EPF8636 TQFP 144 PACKAGE altera RQFP
Contextual Info: CUSTOMER ADVISORY RQFP & TQFP MOISTURE RECLASSIFICATION In ADV 9505, Altera announced that it had established dry packing requirements for the RQFP package, as well as for other QFP and PLCC packages. Dry packing enhances the shipping process by placing devices in vacuum-sealed moisture-barrier bags with

t25 4 J9

Abstract: t25 4 j5 T25 4 E8 t25 4 F6 EPF10K200S T25 4 E5 t35 4 c8 af14 ba43 bf44
Contextual Info: EPF10K200S Device Pin-Outs ver. 1.0 Pin Name 1 240-Pin RQFP 356-Pin FineLine BGA 484-Pin FineLine BGA 599-Pin PGA 600-Pin BGA 672-Pin FineLine BGA MSEL0 (2) MSEL1 (2) nSTATUS (2) nCONFIG (2) DCLK (2) CONF_DONE (2) INIT_DONE (3) nCE (2) nCEO (2) nWS (4) nRS (4)

m 208 b1

Abstract: EPM7256E EPM7256S
Contextual Info: EPM7256E & EPM7256S Dedicated Pin-Outs ver. 1.0 Dedicated Pin 160-Pin PQFP 1 , (2) 192-Pin PGA (2) 208-Pin RQFP/PQFP (3) INPUT/GCLK1 INPUT/GCLRn INPUT/OE1 INPUT/OE2/GCLK2 TDI (4) TMS (4) TCK (4) TDO (4) GND 139 141 140 142 146 23 98 135 3, 18, 32, 47, 57, 64, 66, 81,

ADV0305

Abstract: amkor Amkor Technology
Contextual Info: CUSTOMER ADVISORY ADV0305 ADDITIONAL SOURCE FOR ALTERA’S POWER QUAD FLAT PACK PACKAGE FOR THE FLEX 10K AND APEX DEVICE FAMILIES Change Description: Altera is adding Amkor’s thermally enhanced MQFP PowerQuad package as an additional source for Altera’s Power Quad Flat Pack RQFP package used for

t25 4 J9

Abstract: be37 AR-17 BA41 AA43 t25 4 L9 BA43 t25 4 F6 t25 4 H9 BE43
Contextual Info: EPF10K200S Device Pin-Outs ver. 1.1 Pin Name 1 240-Pin RQFP 356-Pin FineLine BGA 484-Pin FineLine BGA 599-Pin PGA 600-Pin BGA 672-Pin FineLine BGA MSEL0 (2) MSEL1 (2) nSTATUS (2) nCONFIG (2) DCLK (2) CONF_DONE (2) INIT_DONE (3) nCE (2) nCEO (2) nWS (4) nRS (4)

RQFP

Abstract: EPM9560RC208-15 CQFP 208 datasheet altera epm9560rc208-15 208 pin rqfp drawing CQFP 208 EPM9560WC208-20 EPM9560RC208-20 EPM9560 EPM9560RC208-15C
Contextual Info: PRODUCT DISCONTINUANCE NOTICE SELECTED MAX 9000 ORDERING CODES Altera will be discontinuing the EPM9560 in the 208-pin ceramic quad-flat pack package CQFP and substituting compatible power quad flat pack package (RQFP) alternatives. All EPM9560 devices in the 208-pin RQFP are form, fit and functionally equivalent* to the

ACTEL A1240xl

Abstract: actel a1020b A42MX16 A42MX36 40MX 42MX A1225XL A1020B A40MX02 A40MX04
Contextual Info: Package Options: User I/Os per Package Integrator Series PQFP 100 57 72 69 83 144 72 57 VQFP 72 69 83 83 72 72 72 72 72 72 83 83 A32400DX 72 A32300DX 72 A32200DX 69 104 160 RQFP 72 A32140DX 57 A32100DX 57 A3265DX 57 A1280XL 57 A1240XL 68 3200DX A1225XL 34

ADV9505

Contextual Info: June 22, 1995 Dear Customer: Altera has established procedures to ship FLEX 8000 208-, 240-, and 304-pin Power Quad Flat Packs RQFP in dry pack immediately. Dry packing of other QFP packages will follow and a schedule will be published shortly. Dry packing enhances the current QFP shipping process by placing all QFP devices in

PCN1002

Abstract: EPF10K100ARI240-3 EPM9560ARI208-10 EPM7256SRI208-10N EPF10K30RI208-4N epm9560ri208-20 EPF10K20RI208-4 EPF10K30RI240-4N EPM7256SRI208-10 EPF10K20RC208-4
Contextual Info: Revision: 1.0.0 PROCESS CHANGE NOTIFICATION P CN1 0 0 2 Additional Assembly Source and Power Quad Flat Pack RQFP 208 and 240 Package Conversion Change Description Altera is introducing Amkor, Philippines (ATP) as an additional assembly source for the RQFP 208

am3 pins

Abstract: diode t25 4 F6 am3 Pin Package Ac32 g4 diode t25 4 H9 AC32 AD32 AC22 AE23 AF14
Contextual Info: EPF10K100A Device Pin-Outs ver. 1.0 Pin Name 240-Pin PQFP/RQFP 356-Pin BGA 484-Pin FineLine BGA 600-Pin BGA MSEL0 2 MSEL1 (2) nSTATUS (2) nCONFIG (2) DCLK (2) CONF_DONE (2) INIT_DONE (3) nCE (2) nCEO (2) nWS (4) nRS (4) nCS (4) CS (4) RDYnBSY (4) CLKUSR (4)

EPM7256E

Abstract: EPM7256S
Contextual Info: EPM7256E & EPM7256S Dedicated Pin-Outs ver. 1.0 Dedicated Pin 160-Pin PQFP 1 , (2) 192-Pin PGA (2) 208-Pin RQFP/PQFP (3) INPUT/GCLK1 INPUT/GCLRn INPUT/OE1 INPUT/OE2/GCLK2 TDI (4) TMS (4) TCK (4) TDO (4) GND 139 141 140 142 146 23 98 135 3, 18, 32, 47, 57, 64, 66, 81,

t25 4 e9

Abstract: AH36 ag33 diode diode t25 4 F6 AP4 89 AE23 Ah-36 diode t25 4 L5 af14 AE13
Contextual Info: EPF10K50 Device Pin-Outs ver. 1.0 Pin Name 1 240-Pin PQFP/RQFP MSEL0 (2) MSEL1 (2) nSTATUS (2) nCONFIG (2) DCLK (2) CONF_DONE (2) INIT_DONE (3) nCE (2) nCEO (2) nWS (4) nRS (4) nCS (4) CS (4) RDYnBSY (4) CLKUSR (4) DATA7 (4) DATA6 (4) DATA5 (4) DATA4 (4)

actel cqfp 84

Abstract: actel a1020b RT1425A actel a1010b actel 172 cqfp
Contextual Info: Package Options: User I/Os per Package January 1999 1999 Actel Corporation 1 Commercial/Industrial Devices RQFP VQFP TQFP BGA CPGA CQFP 129 172 172 125 176 34 57 69 69 72 83 72 72 57 125 125 152 125 176 176 202 176 176 202 57 78 112 129 78 144 78 112 144

Actel A1225A

Abstract: actel a1010b actel cqfp 84 A1010B A1020B
Contextual Info: BACK Package Options: User I/Os per Package Integrator Series PQFP 100 57 72 69 83 144 72 57 VQFP 72 69 83 83 72 72 72 72 72 72 83 83 A32400DX 72 A32300DX 72 A32200DX 69 104 160 RQFP 72 A32140DX 57 A32100DX 57 A3265DX 57 A1280XL 57 A1240XL 68 3200DX A1225XL

EPF10K70

Abstract: EPM7128S 6 pin mini-din connector EPF10K20 9 pin mini-din monitor connector moving message display using 7 segment EPC1P1 EPM7128* kit EPM7128S Application
Contextual Info: December 2004, v3.1 Introduction University Program UP2 Education Kit User Guide The University Program UP2 Education Kit was designed to meet the needs of universities teaching digital logic design with state-of-the-art development tools and programmable logic devices PLDs . The package

EP20K1000C

Abstract: EP20K200C EP20K400C EP20K600C EPC16 FA12 ep20k apex board
Contextual Info: APEX 20KC Programmable Logic Device February 2002 ver. 2.0 Features. Data Sheet • ■ Programmable logic device PLD manufactured using a 0.15-µm alllayer copper-metal fabrication process – 25 to 35% faster design performance than APEXTM 20KE devices

100-Pin Package Pin-Out Diagram

Abstract: C343I ZF MicroSystems 486
Contextual Info: MAX 7000 ju iä ti MAX Programmable Logic Device Family J a n u a ry 1998. ver. 5 Features. D ata S h e e t • ■ ■ ■ ■ ■ ■ ■ High-performance, EEPROM-based programmable logic devices PLDs based on second-generation Multiple Array M atrix (MAX)

764150

Abstract: YAMAICHI 132 PGA SA-PQ208
Contextual Info: fcM Socket Recommendation for Actel FPGA Packages P r o t o t y p i n g S o c k e t s R e s o l d by A c t e l These sockets have been engineered and manufactured by the respective original manufacturer. Actel resells small quantities of these sockets to Actel customers in order to

Contextual Info: FLEX 8000 Programmable Logic Device Family May 1999, ver. 10 Features. D a ta she et • ■ ■ ■ ■ Low-cost, high-density, register-rich CMOS programmable logic device PLD family (see Table 1) 2,500 to 16,000 usable gates 282 to 1,500 registers System-level features