CARSEM Search Results

INCOMING RAW MATERIAL INSPECTION chart

Abstract: INCOMING RAW MATERIAL INSPECTION form INCOMING RAW MATERIAL INSPECTION INCOMING RAW MATERIAL INSPECTION method INCOMING RAW MATERIAL flowchart LINEAR TECHNOLOGY mark code INCOMING MATERIAL FLOW PROCESS INCOMING RAW MATERIAL aql incoming inspection mil-std-883 2015 Gold Ball Bond Shear
Contextual Info: Pg. 1 of 3 ATTACHMENT 2. ASSEMBLY FLOWCHART INCOMING Vendor: Product: Package: Location of Wafer Fab: Assembly: Final Test: Q.C. Test Source Accept Test: Quality Contact: Linear Technology BIPOLAR PROCESS TO-92 Linear Technology Carsem Maylasia Linear Technology

P-18585

Abstract: DS1233
Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS1233 Oct-96 9644 A5 CARSEM DM635839AAA 1.2µ NITRIDE 03 SOT223 STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C): HTC Vapor Phase

DS1259

Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS1259 Sep-96 9619 C2 CARSEM DM604260AAD 2.0µ NITRIDE 16 PDIP STRESS/JOB NO. Infant / High Voltage Life 125°C, 7.0 V. P-18160, P-18231 READPOINT

IPC-7527

Abstract: PCB design for 0.2mm pitch csp package IPC7527 tssop 16 exposed pad stencil metcal VPI-1000 qfn 44 PACKAGE footprint 7x7 DIe Size qfn 48 7x7 stencil QFN 16 CARSEM package outline QFN 8 CARSEM APR-5000
Contextual Info: MLP Application Note APPLICATION NOTE Comprehensive User’s Guide April 2002 April 2002 Cover Page Page MLP Application Note CONTENTS 1.0 1.1 THE CARSEM MICRO LEADFRAME PACKAGE MLP Introduction 2.0 2.1 MANUFACTURING CONSIDERATIONS SMT Process 3.0 3.1 3.2

74 HTC 08

Abstract: 74 HTC 00 P-20606
Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS2502 Sep-97 9737 A6 CARSEM DM718527ABB 1.2µ OX/NI EPROM 08 SOIC 150 STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C):

16656

Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS2434 Nov-95 9534 C4 CARSEM DM512004AAC1 1.2µ OX/NI 03 PR-35 STRESS/JOB NO. Infant / High voltage Life 125°C, 7.0 V. P-16613, P-16655 READPOINT

Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS2502 Dec-95 9546 A6 CARSEM DM534661ANA 1.2µ OX/NI EPROM 08 SOIC 150 STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C):

16889

Abstract: B/TDA 16840
Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS2107A Jan-96 9552 A6 CARSEM DM510561AAA 1.2µ NITRIDE 16 SOIC STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C): HTC Vapor Phase

Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS5002 Oct-97 9738 B3 CARSEM DM722224AAB 1.2µ OX/NI 80 PQFP STRESS/JOB NO. READPOINT Sample Size/No. of Fails Electrical Cum % 203/0 0.0% Preconditioning (P/C):

P-17715

Abstract: P-17714
Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY DS1259 Jun-96 9552 C2 CARSEM STRESS/JOB NO. Infant / High Voltage Life 125°C, 7.0 V. P-17662, P-17712 ASSEMBLY LOT NO PROCESS TYPE DM543696ACB1 2.0µ NITRIDE READPOINT Sample Size/No. of Fails

Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS2401 Sep-96 9627 B1 CARSEM DM611170AJ 1.2µ OX/NI 03 TO-92 STRESS/JOB NO. Infant / High voltage Life 125°C, 7.0 V. P-18166, P-18189 READPOINT

dallas date code ds12887

Abstract: dallas date code P23073 DS1225A DALLAS DS80C320 9832 P23403 dallas date code ds80c320 P23074
Contextual Info: RELIABILITY MONITOR STRESS: ULTRASOUND CONDITIONS: J-STD-020 MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE DS1233 A5 JAN 99 P23064 9842 CARSEM DM823017AB SOT-223 DS1803 A2 NOV 98 P22797 9833 CHIPPAC, KOREA DS1869 A3 MAR 99 P23360

Contextual Info: RELIABILITY REPORT DATE: 03/10/05 QUALITY ENG : PURPOSE: Micrel MIC5236 Low Quiescent Current µCap LDO Regulator 408 435-3476 99133-1E QUAL VEHICLE : PACKAGE TYPE : ASSEMBLY LOC MIC5236 3.0BM SOIC CARSEM M/C D/C # FAB LOC LOT # PROCESS 6300H 9941E SAN JOSE

CEL9220

Abstract: MICREL sot-23-5 DATE CODE
Contextual Info: RELIABILITY REPORT DATE: 10/04/2005 QUALITY ENG : PURPOSE: Micrel MIC5205YM5 Lead Free Package (408)435-3476 QUAL VEHICLE PACKAGE TYPE ASSEMBLY M/C D/C FAB LOC LOT PROCESS MIC5205 2.9YM5 SOT-23-5 NiPdAu CARSEM CEL9220 0516 FORTUNE 2A43078 BCC MIC5205 3.0YM5

Contextual Info: RELIABILITY REPORT DATE : 3/04/05 QUALITY ENG : PART NUMBER : Dinh Pham MIC37150/151/152/252 PROJECT # : PACKAGE TYPE : ASSEMBLY LOC D/C # LOT # FAB # M/C PROCESS 21096 MIC37150 SPAK-5L CARSEM 0137 531138 Fortune KMC289 BCDM 21116 (MIC37151) SPAK-5L CARSEM

CEL9220

Contextual Info: RELIABILITY REPORT DATE: 01/03/2006 QUALITY ENG : TITLE: Dinh Pham MIC5255YM5, 150mA Low Noise µCap CMOS LDO. QUAL VEHICLE : PACKAGE TYPE : ASSEMBLY LOC M/C D/C # FAB LOC MIC5255-3.1YM5 SOT-23 –5L CARSEM CEL9220 0522 FORTUNE PART NO. LOT ID. 168H 500H MIC5255-3.1YM5

P-17812

Abstract: DS1233 9624
Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS1233 Jul-96 9624 A5 CARSEM DM608597ACH 1.2µ NITRIDE 03 SOT223 STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C): HTC Vapor Phase

SUMITOMO EME-1100H

Abstract: mold compound SUMITOMO Compound DS2400 1100-H 1100H CARSEM DS1233 DS1410D
Contextual Info: DALLAS SEMICONDUCTOR 4401 South Beltwood Parkway Dallas, Texas 75244–3292 214 450–0400 Date: March 6, 1997 Subject: PRODUCT CHANGE NOTICE – B70601 Description: Qual of 6710S Mold Compound at Carsem for SOT 233 Packages Description of Change: SOT 223 packages are currently assembled with SUMITOMO EME 1100H mold compound. Proposed

CARSEM

Abstract: DS2434
Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS2434 May-96 9615 C4 CARSEM DM533591ABF 1.2µ OX/NI 03 PR-35 STRESS/JOB NO. Infant / High voltage Life 125°C, 7.0 V. P-17760, P-17769 READPOINT

CARSEM

Abstract: DS2434
Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS2434 Feb-96 9537 C4 CARSEM DM512002AAD 1.2µ OX/NI 03 PR-35 STRESS/JOB NO. Infant / High voltage Life 125°C, 7.0 V. P-16958, P-17018 READPOINT

Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS2401 Sep-97 9726 B2 CARSEM DM715208AEA 1.2µ OX/NI 03 TO-92 STRESS/JOB NO. Infant / High voltage Life 125°C, 7.0 V. P-20432, P-20478 READPOINT

TI date code

Contextual Info: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Single Metal Ti/TiN layers used on all Metals INFANT LIFE READ POINT QTY FAILS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE DS2502 C3 JUN '00 25568 0011 Carsem S DM941230AG

Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS2502 Oct-97 9739 CARSEM DM729067AKB 0.8µ OX/NI EPROM 06 TSOC STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C): Bake, 125°C, 24 Hr

9721

Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS2502 Jun-97 9721 A6 CARSEM DM708155ACB 1.2µ OX/NI EPROM 08 SOIC 150 STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C):