PLASKON Search Results

E115797

Abstract: ablebond 84-1 LMI ABLEBONd 84-1 Ablebond 84-1 SR4 E115797 ablebond 84-1 LMI Ablebond 84-1 SR4 thyristor catalogue TICP106M-S 1015 to-92 mold compound std883
Contextual Info: October, 2005 Circuit Protection Division Bourns Manufacturers Representatives Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team N IT CU ECTIO R I C ROT P Thyristor Surge Protector Product Change Notification PCN Tracking Number 39 Mold Compound Change - TO-92 & DO-92 Packages

"Current Loop Converter"

Contextual Info: ADC08831/2 Qualification Package Click Here For ADC08831 Web Info Click Here For ADC08832 Web Info Single/Dual Channel A/D Converters 1.00 0.80 0.60 0.40 0.20 0.00 -0.20 -0.40 -0.60 -0.80 -1.00 255 ADC08831/ADC08832 QUALIFICATION PACKAGE Table of Contents

ablebond 84-1 LMI

Abstract: E115797 Ablebond 84-1 SR4 ABLEBONd 84-1 mil std 1015 R3752-1-S CS 110 thyristor 84-1 LMI plaskon TICP106M
Contextual Info: October, 2005 Circuit Protection Division Bourns Manufacturers Representatives Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team N IT CU ECTIO R I C ROT P Thyristor Surge Protector Product Change Notification PCN Tracking Number 39 Mold Compound Change - TO-92 & DO-92 Packages

BAI 59

Abstract: plaskon FBGA PACKAGE thermal resistance
Contextual Info: Cypress Semiconductor Package Qualification Report 000201 VERSION 1.0 October, 2000 48 Fine Pitch Ball Grid Array FBGA Level 3 7mm x 7 mm Cypress Philippines Assembly CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director (408) 432-7069

RPM sensor

Abstract: digital tachometer design
Contextual Info: Home> Products > PCB level Position Sensors Miniature Plastic package > SS400 > Product Page Order Product and Get Support SS449A-S Search for product and support information. All Sensing and Control U.S. Authorized Distributors SS400 Series Unipolar Hall-Effect Digital

RPM sensor

Abstract: plaskon 3300h
Contextual Info: Home> Products > PCB level Position Sensors Miniature Plastic package > SS400 > Product Page Order Product and Get Support SS443A-S Search for product and support information. All Sensing and Control U.S. Authorized Distributors SS400 Series Unipolar Hall-Effect Digital

lm1117-3.3v

Abstract: n05a code N05A N03A LM1117MP-3.3 LM1117 lm1117 3.3V LM1117MPX-5 LM1117MP-5.0 N06A
Contextual Info: LM1117 Qualification Package t u o p o r D w o L A r m o t a 800 ul g e R r a e n i L ! t i e Mad e W – d e k s rd a d You a n a St y r t us d h n t th i I i w w n a an r o t a l Regu cing Click Here for Web Information TTMM c i r P ge a t n a Adv r you?™

MAX232

Abstract: EN-4088Z SN74ABT16240 SN74ABT16240A SN74ABT16241 SN74ABT16241A 1500KV ABT16241 Hitachi EN-4088Z ABT16240A
Contextual Info: TEXAS INSTRUMENTS Qualification Notification for the SN74ABT16240A and SN74ABT16241A, Die Revision D February 20, 1997 Abstract Texas Instruments qualified the SN74ABT16240A and SN74ABT16241A die revision D replacing die revision B. Die revision D includes an all layer change, which incorporates timing

ABT16541A

Abstract: SN74ABT16540 SN74ABT16540A SN74ABT16541 SN74ABT16541A abt245n ASL2B SN74ABT245 EN4088Z
Contextual Info: TEXAS INSTRUMENTS Qualification Notification for the SN74ABT16540A and SN74ABT16541A, Die Revision D May 14, 1997 Abstract Texas Instruments qualified the SN74ABT16540A and SN74ABT16541A die revision D, replacing die revision B. Die revision D includes an all layer change and improves the

Ablebond 71-1

Abstract: Ablebond 71 BCT8373 SN74BCT8373 SN74BCT8373A 5247 8 pin
Contextual Info: TEXAS INSTRUMENTS Qualification Notification for the SN74BCT8373A, Die Revision B February 7, 1996 Abstract Texas Instruments has qualified the SN74BCT8373A, Die Revision B, to replace the SN74BCT8373, no die revision. Die revision B was redesigned to conform to IEEE Standard 1149.11990 JTAG . The die and device revision are necessary to change the TDO drive state controls to

SN74CBT16233

Abstract: eiaj datecode relco CBT16233 EN-4088Z SN74CBT16233DL ASL2B
Contextual Info: TEXAS INSTRUMENTS Qualification Notification for the SN74CBT16233, Die Revision B October 29, 1998 Abstract Texas Instruments has qualified a die revision for the CBT16233, die revision ‘B’. This device was redesigned in order to incorporate improved ESD protection circuitry.

SN74ABT5400

Abstract: SN74ABT5400A SN74ABT5402 SN74ABT5402A ABT5402A
Contextual Info: TEXAS INSTRUMENTS Qualification Notification for the SN74ABT5400A, Die Revision C SN74ABT5402A, Die Revision B April 26, 1996 Abstract Texas Instruments Advanced System Logic is issuing this notification to qualify the SN74ABT5400A, die revision C and the SN74ABT5402A, die revision B, to replace the

SN74ALS163A

Abstract: SN74ALS161A SN74ALS161B SN74ALS161BN SN74ALS163B
Contextual Info: TEXAS INSTRUMENTS Qualification Notice for Selected ALS-2 Products September 22, 1995 Abstract Texas Instruments Advanced System Logic is issuing this notification, one in a continuing series, to qualify a group of die revisions in the Advanced Low Power Schottky and Advanced Schottky families

28091

Abstract: Ablestik 2000
Contextual Info: 09/22/2004 RELIABILITY REPORT FOR DS21Q552, Rev B1 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com

Contextual Info: ISO 9001 Registered PRX+2452 Part Number Contact Form A Switch Configuration SPST Rev. B World's Smallest Surface Mount Overmolded Reed Switch Features Advantages • Hermetically sealed contacts • Extended operations in extreme environments • Sensor materials are lead free and RoHS compliant

SS400-S

Abstract: 3300h SS466A SS443A plaskon 3300h SS413A SS461A SS400 SS411A SS441A
Contextual Info: Solid State Sensors Digital Position Sensors FEATURES ɀ 3.8-30 VDC supply voltage ɀ Digital current sinking output ɀ 3 pin in-line PCB terminals ɀ Quad-Hall design virtually eliminates mechanical stress effects ɀ Temperature compensated magnetics ɀ Operate/release points can be

130C

Abstract: JESD22 Ablebond 8355
Contextual Info: Cypress Semiconductor Qualification Report QTP# 98193 VERSION 1.0 December, 1998 292-Pin BGA Package ASE, Taiwan Assembly CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Cypress Semiconductor Quality and Reliability Department Cypress Semiconductor Assembly: ASE, Taiwan

SS461A

Abstract: SS411A SS443A SS466A 3300H SS400 SS400-S SS413A SS441A SS449A
Contextual Info: Interactive Catalog Replaces Catalog Pages Honeywell Sensing and Control has replaced the PDF product catalog with the new Interactive Catalog. The Interactive Catalog is a power search tool that makes it easier to find product information. It includes more

3300H

Contextual Info: SS461A SS400 Series Latching HallEffect Digital Position Sensor; radial lead IC package Actual product appearance may vary. Features • • • • • • • • Digital current sinking output Quad-Hall design virtually eliminates mechanical stress effects

SS411A

Contextual Info: SS411A SS400 Series Bipolar HallEffect Digital Position Sensor; radial lead IC package Actual product appearance may vary. Features • • • • • • • • Digital current sinking output Quad-Hall design virtually eliminates mechanical stress effects

Contextual Info: 4551Ô3Q Solid State Sensors 0023750 147 SS400 Series Digital Position Sensors FEATURES • 3.8-30 VDC supply voltage • Digital current sinking output • 3 pin in-line PCB terminals • Quad-Hall design virtually eliminates mechanical stress effects • Temperature compensated

prx 2451

Abstract: plaskon
Contextual Info: www.hermeticswitch.com PO Box 2220 Chickasha, OK 73023 Phone: 405 224-4046 Fax: (405) 224-9423 ISO 9001 Registered PRX+2451 Part Number Contact Form A SPST Switch Configuration Rev. D World's Smallest and Most Magnetically Sensitive Overmolded Reed Switch

TAIYO PSR 4000

Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY
Contextual Info: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).

PCN0516

Abstract: G770* G770 mold compound Sumitomo 1000 sumitomo g770 G770* sumitomo thermal conductivity of sumitomo g770 G770 mold compound G770 plaskon G770 mold compound data sheet G770 sumitomo
Contextual Info: PROCESS CHANGE NOTIFICATION PCN0516 MOLD COMPOUND CHANGE FOR PBGA PACKAGES Change Description: Altera is adopting Sumitomo G770 series mold compound as the standard mold material on its plastic ball-grid array PBGA packaged devices. Devices in 225, 256, and 672 pin PBGA