TNETA1555DW
Abstract: EN-4088Z TNETA1555 on abstract details TEXAS INSTRUMENTS, Mold
Contextual Info: TEXAS INSTRUMENTS Qualification Notification for the TNETA1555, Die Revision TDC1555G January 11, 1996 Abstract Texas Instruments Advanced System Logic is issuing this notification to qualify a die revision for the TNETA1555. The device was redesigned to correct an optical interface locking problem.
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tneta1555tdc1555gtdc1555a10kacn+4en-4088ztneta1555dwon abstract detailstexas instruments, mold
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MAX232
Abstract: EN-4088Z SN74ABT16240 SN74ABT16240A SN74ABT16241 SN74ABT16241A 1500KV ABT16241 Hitachi EN-4088Z ABT16240A
Contextual Info: TEXAS INSTRUMENTS Qualification Notification for the SN74ABT16240A and SN74ABT16241A, Die Revision D February 20, 1997 Abstract Texas Instruments qualified the SN74ABT16240A and SN74ABT16241A die revision D replacing die revision B. Die revision D includes an all layer change, which incorporates timing
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sn74abt16240asn74abt16241asn74abt16240sn74abt16241+7abt16241abt16241amax232en-4088z1500kvhitachi en-4088zabt16240a
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shinetsu
Abstract: KMC288 SLL-28 EN-4088Z KMC-166 TEXAS INSTRUMENTS, Mold EPIC-1S
Contextual Info: TEXAS INSTRUMENTS Final Notification for the Qualification of Shinetsu KMC-288 Mold Compound at the Hiji, Malaysia, and Mexico Assembly/Test Facilities May 19, 1998 Abstract Texas Instruments, Mixed Signal and Logic group, is qualifying Shinetsu KMC-288 mold
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kmc-288kmc-166sn74act16241dggjesd22+8sn74act16841dggsn74abt16823dgvshinetsukmc288sll-28en-4088ztexas instruments, moldepic-1s
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ABT16541A
Abstract: SN74ABT16540 SN74ABT16540A SN74ABT16541 SN74ABT16541A abt245n ASL2B SN74ABT245 EN4088Z
Contextual Info: TEXAS INSTRUMENTS Qualification Notification for the SN74ABT16540A and SN74ABT16541A, Die Revision D May 14, 1997 Abstract Texas Instruments qualified the SN74ABT16540A and SN74ABT16541A die revision D, replacing die revision B. Die revision D includes an all layer change and improves the
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sn74abt16540asn74abt16541asn74abt16540sn74abt16541+5abt16541aabt245nasl2bsn74abt245en4088z
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SN74CBT16233
Abstract: eiaj datecode relco CBT16233 EN-4088Z SN74CBT16233DL ASL2B
Contextual Info: TEXAS INSTRUMENTS Qualification Notification for the SN74CBT16233, Die Revision B October 29, 1998 Abstract Texas Instruments has qualified a die revision for the CBT16233, die revision ‘B’. This device was redesigned in order to incorporate improved ESD protection circuitry.
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sn74cbt16233cbt16233eiaj datecoderelco+3en-4088zsn74cbt16233dlasl2b
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texas instruments lot trace code
Abstract: EN-4088Z SN74CBT3245 SN74CBT3245A SN74CBT3245ADBQ
Contextual Info: TEXAS INSTRUMENTS Final Notification for the Manufacture of 20 pin SSOP and 24 pin SSOP variations to Texas Instruments Malaysia Assembly/Test Facility MLA April 30, 1998 Abstract Texas Instruments Standard Linear and Logic (SLL) is pleased to announce qualification of Texas
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texas instruments lot trace codeen-4088zsn74cbt3245sn74cbt3245a+1sn74cbt3245adbq
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EN-4088Z
Abstract: LVTH125 LVTH125D SN74LVT125 SN74LVTH125 SN74LVTH125D LVT125 5287a 5287c Hysol
Contextual Info: TEXAS INSTRUMENTS Notification for SN74LVT125 to SN74LVTH125 Device Redesign June 30, 1998 Abstract Texas Instruments has qualified the SN74LVTH125 device. The “H” in the device name denotes that Bus Hold circuitry is a feature on this device. Several devices were released with
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sn74lvt125sn74lvth1255287blvt125+9lvth1255287c74lvt12574lvth125en-4088zlvth125dsn74lvth125d5287ahysol
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5310B
Abstract: QMI-505MT EN-4088Z SN74ALVCH16831 80457 TEXAS INSTRUMENTS, Mold Compound 505MT Hitachi EN-4088Z Ablestik DL PACKAGE OUTLINE TEXAS
Contextual Info: TEXAS INSTRUMENTS Final Notification for the QMI 505MT Die Mount Compound Process at the Mexico and Malaysia Assembly/Test Facilities for TVSOP/SOIC /SSOP Product August 27, 1998 Abstract Texas Instruments, Standard Linear and Logic, is qualifying the QMI 505MT die mount
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505mten-4088z5310bqmi-505mt+6sn74alvch1683180457texas instruments, mold compoundhitachi en-4088zablestikdl package outline texas
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PC2400
Abstract: QMI-505MT QMI505 5310A EN-4088Z QMI505MT SN74F32 SN74F32N RH42
Contextual Info: TEXAS INSTRUMENTS Final Notification for the QMI 505MT Die Mount Compound Process at the Mexico and Malaysia Assembly/Test Facilities for PDIP Product March 18, 1998 Abstract Texas Instruments, Standard Linear and Logic, is qualifying the QMI 505MT die mount compound
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505mten-4088zqmi-505mtpc2400+6qmi5055310aqmi505mtsn74f32sn74f32nrh42
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ASL3C
Abstract: EN-4088Z SN74CBT3245A SN74CBTLV3245 SN74CBTLV3245A SN74CBTLV3245ADW SN74CBTLV3245DW 4088Z EN4088Z
Contextual Info: TEXAS INSTRUMENTS Informational Notification for the SN74CBTLV3245 June 30, 1999 Abstract The SN74CBTLV3245 device has been redesigned and released as the SN74CBTLV3245A. With this redesign, 2.5V±0.2V specs have been added to the Data Sheet, chip size has been reduced, circuit performance optimized to achieve improved ac performance,
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sn74cbtlv3245sn74cbtlv3245acbtlv3245cbtlv3245a+7asl3cen-4088zsn74cbt3245asn74cbtlv3245adwsn74cbtlv3245dw4088zen4088z
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texas instruments lot trace code
Abstract: EN-4088Z 505MT TEXAS INSTRUMENTS, Mold Compound 5310A
Contextual Info: TEXAS INSTRUMENTS Final Notification for the QMI 505MT Die Mount Compound Process at the Mexico and Malaysia Assembly/Test Facilities for TSSOP Product August 19, 1998 Abstract Texas Instruments, Standard Linear and Logic, is qualifying the QMI 505MT die mount
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505mten-4088z5310ctexas instruments lot trace code+2texas instruments, mold compound5310a
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SN75LP185A
Abstract: EN-4088Z SN75LPE185 SN75LPE185DW
Contextual Info: TEXAS INSTRUMENTS Final Notification for the SN75LP185A/SN75LPE185 Devices May 22, 1998 Abstract Texas Instruments has redesigned the SN75LP185 and SN75LPE185 to remove waivers currently associated with these devices. A data sheet change will occur on the SN75LP185 so it will be called the
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sn75lp185a/sn75lpe185sn75lp185sn75lpe185sn75lp185a+2en-4088zsn75lpe185dw
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EPIC-1ZS
Abstract: texas cmos databook ir 4310 50C24 CBT16211DL EN-4088Z SN74CBT16211DL texas cmos 50C24.1 texas instrument
Contextual Info: TEXAS INSTRUMENTS Notification for the Addition of EPIC-1ZS CMOS Process to the Lubbock Wafer Fabrication Site April 17, 1998 Abstract Texas Instrument’s Lubbock Wafer Fabrication Facility has successfully completed Texas Instrument’s qualification requirements for the manufacture of products using the EPIC-1ZS CMOS
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50c24epic-1zstexas cmos databookir 4310+6cbt16211dlen-4088zsn74cbt16211dltexas cmos50c24.1texas instrument
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SN74LVC16245A
Abstract: SN74LVC2244A SN74LVC240A SN74LVC244A SN74LVC245A SN74LVCH244A SN74LVCH245A SN74LVCR2245A 9511323 LVC240A
Contextual Info: TEXAS INSTRUMENTS Informational Notification of Errata for the Redesign of Several SN74LVC/LVCHXXXXA Devices August 4, 1997 Revision A Abstract This errata notification from Texas Instruments is due to an administrative error on PCN 5298 dated May 6, 1997 . The changed values were not highlighted in underlined bold italics as stated and the table
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sn74lvc/lvchxxxxasn74lvc16245asn74lvc240asn74lvc/lvch+9sn74lvc374asn74lvc2244asn74lvc244asn74lvc245asn74lvch244asn74lvch245asn74lvcr2245a9511323lvc240a
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ABT841A
Abstract: 74ABT841 SN74ABT841 SN74ABT841A
Contextual Info: TEXAS INSTRUMENTS Device Revision Notification for the SN74ABT841A, Die Revision B August 21, 1996 Abstract Texas Instruments has qualified the SN74ABT841A, Die Revision B, to replace the SN74ABT841, ‘No-Rev’ die revision. Die revision B was redesigned to improve Capacitive Discharge Model CDM
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Contextual Info: TEXAS INSTRUMENTS Qualification Notification for the SN74AC11257, Die Revision A September 6, 1996 Abstract Texas Instruments Advanced System Logic is issuing this notification to qualify the SN74AC11257, die revision A, to replace the SN74AC11257, ‘No-Rev’ die revision. The change was to enhance device
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sn74lvc
Abstract: SN74LVC244 SN74LVC240 SN74LVC244A SN74LVC540 SN74LVC541 SN74LVC543 SN74LVC646 SN74LVC652 SN74LVC823
Contextual Info: TEXAS INSTRUMENTS Notification for the Redesign of Several SN74LVC/LVCH to LVC-A/LVCH-A Devices August 22, 1997 Abstract Texas Instruments is redesigning the LVC family for improved performance which will include 5 volt tolerance features and to meet LCX specifications. To match LCX specifications an Ioff parameter
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EPIC-1ZS
Abstract: 50C24 50C24.1 SN74CBT16244 SN74CBT3125 SN74CBT3126 SN74CBT3306 SN74CBT6800 SN74CBT6800A SN74CBTD3306
Contextual Info: TEXAS INSTRUMENTS Qualification Notification for Select ’SN74CBT’ Technology Devices August 12,1999 Abstract Texas Instruments has qualified die revisions and die shrinks for several device types in the SN74CBT technology family. These devices were redesigned in order to optimize yields and increase capacity. This
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ABTH245
Abstract: j 5804 ABT541 74ABT541 SN74ABT541 SN74ABT541B ABT541B
Contextual Info: TEXAS INSTRUMENTS Device Revision Notification for the SN74ABT541B, Die Revision J January 2, 1997 Abstract This revision is to clarify that Bus Hold is NOT an option of the released version of the ABT541. Bus Hold is an option of the master die ABTH245 , which impacted this device.
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SHINKO
Abstract: KMC-166 EN-4065 EN-4088Z 50B40
Contextual Info: TEXAS INSTRUMENTS Final Notification for the Manufacture of TVSOP and TSSOP in all pin variations to TI Mexico Assembly/Test Facility TMX September 5, 1997 Abstract Texas Instruments Standard Linear and Logic (SLL) has completed the move of the TVSOP and
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tmlvch162830dbbsn74alvch162830dbbshinkokmc-166+3en-4065en-4088z50b40
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50B40
Abstract: EN-4088Z KMC-166 SN74GTL16612 SN74GTL16612A SN74GTL16616 TEXAS INSTRUMENTS, Mold Compound ASL2B mold compound
Contextual Info: TEXAS INSTRUMENTS Qualification Notification for the SN74GTL16612A GTL/GTL+ B-Port Output Edge Control Circuits Optimized for Distributed Load Applications August 27, 1999 Abstract Texas Instruments has qualified the SN74GTL16612A redesign of the SN74GTL16612
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sn74gtl16612asn74gtl1661295mhz85mhz+9gtl16612gtl16612a50b40en-4088zkmc-166sn74gtl16616texas instruments, mold compoundasl2bmold compound
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CBT16211A
Abstract: EPIC-1ZS EN-4088Z SN74CBT16209 SN74CBT16210 SN74CBT16211 SN74CBT16211A SN74CBT16211DL
Contextual Info: TEXAS INSTRUMENTS Qualification Notification for the SN74CBT16211A, Die Revision D September 16, 1997 Abstract Texas Instruments has qualified a device revision for the SN74CBT16211A, die revision ‘D’ to replace the SN74CBT16211, die revision ‘B’. This device was redesigned in order to improve the ESD
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SN74ACT16245DL
Abstract: act16245 texas cmos SN74ACT16245D EN-4088Z SN74HC00N SN74HC42D TEXAS INSTRUMENTS, Mold Compound TS-095 cmos testing abstract
Contextual Info: TEXAS INSTRUMENTS Notification of Wafer Thickness Reduction from 15 and 13 Mils to 11 Mils December 5, 1996 Abstract Texas Instruments Advanced System Logic is reducing wafer thickness from 15 and 13 mils to 11 mils for all CMOS and BiCMOS technologies in all Wafer Fabrication Sites producing these
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hc00nact16245dlabt245adbsn74act16245dl+9act16245texas cmossn74act16245den-4088zsn74hc00nsn74hc42dtexas instruments, mold compoundts-095cmos testing abstract
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Hysol
Abstract: MG-52F TEXAS INSTRUMENTS, Mold Compound 73X128 Compound EN-4088Z SN74ABT16245ADL SN75976A1DL MG52F SN74ACT16543
Contextual Info: TEXAS INSTRUMENTS Qualification Notification for Hysol MG52F Mold Compound for DL SSOP Packages January 10, 1997 Abstract Texas Instruments is qualifying a new mold compound for the 28, 48, and 56 pin TSSOP DL packages. This new compound will be used in addition to the previously qualified compounds adding
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mg52fthis116/0hysolmg-52f+7texas instruments, mold compound73x128compounden-4088zsn74abt16245adlsn75976a1dlsn74act16543
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