shinetsu
Abstract: TEXAS INSTRUMENTS, Mold Compound Compound Texas Instruments packaging material KMC288 KMC166 SN74CBT16211 SN74HCT245 TEXAS INSTRUMENTS, Mold
Contextual Info: TEXAS INSTRUMENTS Initial Notification for the qualification of Shinetsu-KMC288 Mold Compound at the Malaysia and Mexico Assembly/Test Facilities December 11, 1997 Abstract Texas Instruments, Standard Linear and Logic group, is qualifying Shinetsu KMC288 mold
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shinetsu-kmc288kmc288kmc166shinetsu+6texas instruments, mold compoundcompoundtexas instruments packaging materialsn74cbt16211sn74hct245texas instruments, mold
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shinetsu
Abstract: KMC288 SLL-28 EN-4088Z KMC-166 TEXAS INSTRUMENTS, Mold EPIC-1S
Contextual Info: TEXAS INSTRUMENTS Final Notification for the Qualification of Shinetsu KMC-288 Mold Compound at the Hiji, Malaysia, and Mexico Assembly/Test Facilities May 19, 1998 Abstract Texas Instruments, Mixed Signal and Logic group, is qualifying Shinetsu KMC-288 mold
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kmc-288kmc-166sn74act16241dggjesd22+8sn74act16841dggsn74abt16823dgvshinetsukmc288sll-28en-4088ztexas instruments, moldepic-1s
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QMI505
Abstract: MALAYSIA Texas Instruments, epoxy 5316b QMI-505MT 83D8JNK
Contextual Info: TEXAS INSTRUMENTS Informational Notification for the Moisture Sensitivity Level of the 64 Pin TSSOP and 80 Pin TVSOP October 8, 1998 Abstract Texas Instruments Standard Linear and Logic SLL is pleased to announce the qualification of the 64 pin TSSOP and 80 pin TVSOP packages as moisture level 1 for SLL products. The production of
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qmi505mtqmi505m5316bqmi505+4malaysiatexas instruments, epoxyqmi-505mt83d8jnk
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texas instruments lot trace code
Abstract: EN-4088Z 505MT TEXAS INSTRUMENTS, Mold Compound 5310A
Contextual Info: TEXAS INSTRUMENTS Final Notification for the QMI 505MT Die Mount Compound Process at the Mexico and Malaysia Assembly/Test Facilities for TSSOP Product August 19, 1998 Abstract Texas Instruments, Standard Linear and Logic, is qualifying the QMI 505MT die mount
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505mten-4088z5310ctexas instruments lot trace code+2texas instruments, mold compound5310a
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MALAYSIA
Contextual Info: TEXAS INSTRUMENTS Final Notification for the Manufacture of 64 pin TSSOP and 80 pin TVSOP variations to Texas Instruments Malaysia Assembly/Test Facility MLA June 22, 1998 Abstract Texas Instruments Standard Linear and Logic (SLL) is pleased to announce the qualification of
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F741583
Abstract: sp3721d d741667bpgf F741583PGF f721501apgf tnetv901apag F711862PGE F721730EPBK f721905pag F731891PDV
Contextual Info: 12500 TI Boulevard, MS 8640, Dallas, Texas 75243 Final Notification of Qualification of New Environmentally Friendly green Mold Compound for TQFP/LQFP Packages Assembled at TI Philippines and TI Taiwan Assembly Sites Change Notification Letter PCN# 20040714001
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en-4085s2k396milsl3/260cul94-v0+13tms471r1f13885c/853/260cf741583sp3721dd741667bpgff741583pgff721501apgftnetv901apagf711862pgef721730epbkf721905pagf731891pdv
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CEL-9240
Abstract: CEL9240HF10 EN4900F sumitomo crm en4900 CEL9240HF10AKG 1076DS ase qfn EN-4900 KMC288P
Contextual Info: July 23, 2009 CN-072309 Customer Notification M02067L-09-T Package Change Dear Valued Customer: This notification is for the purpose of informing you of a package change from the 4mm BCC package to the 4mm QFN package. Purpose ASE has informed us that the mold compound used for the non-RoHS BCC packages has been discontinued.
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cn-072309m02067l-09-t900ppm1500ppm+10cel-9240cel9240hf10en4900fsumitomo crmen4900cel9240hf10akg1076dsase qfnen-4900kmc288p
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texas instruments lot trace code
Abstract: EN-4088Z TEXAS INSTRUMENTS, Mold Compound 5310A QMI505
Contextual Info: TEXAS INSTRUMENTS Errata to the Final Notification for the QMI 505MT Die Mount Compound Process at the Mexico and Malaysia Assembly/Test Facilities for TSSOP Product September 3, 1998 Abstract Texas Instruments, Standard Linear and Logic, is qualifying the QMI 505MT die mount
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505mten-4088z5310dtexas instruments lot trace code+3texas instruments, mold compound5310aqmi505
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QMI519
Abstract: KEG3000D QMI-519 ra3906 GR828FC Kyocera mold compound Hitachi Datecode KE-G300 KE-G3000 Henkel
Contextual Info: Date Created: 1/28/2004 Date Issued: 3/2/2004 PCN # 20040411 DESIGN/PROCESS CHANGE NOTIFICATION - FINAL This is to inform you that a design and/or process change will be made to the following product s . This notification is for your information and concurrence.
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epax02ext686mm74hct00mtcxmm74hct05mtc+13mm74hct08mtcxmm74hct14mtcmm74hct240mtcxqmi519keg3000dqmi-519ra3906gr828fckyocera mold compoundhitachi datecodeke-g300ke-g3000henkel
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