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SHINETSU Datasheets Context Search
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shinetsu
Abstract: KMC288 SLL-28 EN-4088Z KMC-166 TEXAS INSTRUMENTS, Mold EPIC-1S
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kmc-288kmc-166sn74act16241dggjesd22+8 | |
shinetsu
Abstract: TEXAS INSTRUMENTS, Mold Compound Compound Texas Instruments packaging material KMC288 KMC166 SN74CBT16211 SN74HCT245 TEXAS INSTRUMENTS, Mold
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shinetsu-kmc288kmc288kmc166shinetsu+6 | |
shinetsu G746
Abstract: G746 shinetsu shinetsu G746 rohs G746 shinetsu ANGEN001 G746 rohs thermal conductivity shin-etsu shin-etsu Chemical
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an-gen-00125deg6x10e-32x10e14+11 | |
LS013B7DH01
Abstract: d143 T transistor Zebra stripe s TSSCS lcd tv parts Zebra stripe sharp TFT LCD tv driver LCP-2110019B Industrial Devices L168 V144H
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lcp-2110019bls013b7dh01celsius/95-30degrees+9 | |
Dow Corning 747
Abstract: 2a265vac 2A265 s202t01f S202T01 shin-etsu g747 sharp S202T02 2A125VAC s202t02 origin 4pin
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s102t01s202t01s102t02s202t02+10 | |
sma6822
Abstract: sma6822m SMA6820 2451 mosfet B105 CF35 G746 SC102 SMA6820MP YG6260
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sma6822mp24-pinsma6822sma6822m+8 | |
TO-126LPContextual Info: Precautions when handling transistors 1. Lead forming and cutting Sanyo transistor products are available in a range of lead configurations and lengths. As required, however, you can form or cut package leads to meet the needs of specific applications. As a general precaution, you should always handle |
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to-126lp | |
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Contextual Info: Freescale Semiconductor MPC8349EEC Rev. 2, 5/2005 Advance Information MPC8349E PowerQUICC II Pro Integrated Host Processor Hardware Specifications The MPC8349E contains a PowerPC processor core with system logic required for networking, storage, and general-purpose embedded applications. For functional |
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mpc8349eecmpc8349e | |
F 2452 mosfet
Abstract: SMA6862M B105 CF35 G746 SC102 SMA6800M YG6260
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sma6862m24-pinf 2452 mosfetb105+5 | |
M100 TRIACContextual Info: TMA16xP Series Triac Bidirectional Triode Thyristor Features and Benefits Description ▪ Exceptional reliability ▪ Small fully-molded SIP package with heatsink mounting for high thermal dissipation and long life ▪ VDRM of 400 or 600 V ▪ 16 ARMS on-state current |
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tma16xpm100 triac | |
3025Z
Abstract: 02578 SC102 diode G746 SC102 SI-3025ZD SI-3025ZF SSJ-02578
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si-3025zf3025z02578sc102 diode+4 | |
3phase MOSFET INVERTER
Abstract: sla68 B105 CF35 G746 SC102 SMA6861M YG6260 INVERTER ALLEGRO 24 samsung flyback pin diagram
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sma6851m24-pin3phase mosfet invertersla68+8 | |
sma6863
Abstract: sma6863m samsung electrolytic capacitor B105 CF35 G746 SC102 SMA6800M YG6260 F 2452 mosfet
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sma6863m24-pinsma6863samsung electrolytic capacitor+7 | |
CF35
Abstract: FM20 G746 SC102 TMA54S-L TMA56S-L YG6260 6562-9 samsung washing machine circuit diagram
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e118037o-220fcf35fm20+7 | |
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burglar alarm definition
Abstract: B105 CF35 G746 SC102 SCM1104M YG6260 samsung electrolytic aluminum foil capacitor dc motor controller igbt
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scm1104mburglar alarm definitionb105cf35+5 | |
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Contextual Info: Freescale Semiconductor MPC8349EEC Rev. 8, 2/2007 Technical Data MPC8349E PowerQUICC II Pro Integrated Host Processor Hardware Specifications The MPC8349E PowerQUICC™ II Pro is a next generation PowerQUICC II integrated host processor. The MPC8349E contains a PowerPC™ processor core built on Power |
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mpc8349eecmpc8349e | |
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Contextual Info: Freescale Semiconductor Technical Data Document Number: MPC8533EEC Rev. 0, 04/2008 MPC8533E PowerQUICC III Integrated Processor Hardware Specifications 1 MPC8533E Overview This section provides a high-level overview of MPC8533E features. Figure 1 shows the major functional units within |
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mpc8533eecmpc8533e32-bit32-kbyte | |
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Contextual Info: Freescale Semiconductor MPC8347EEC Rev. 2, 5/2005 Advance Information MPC8343E PowerQUICC II Pro Integrated Host Processor Hardware Specifications The MPC8343E contains a PowerPC processor core with system logic required for networking, storage, and general-purpose embedded applications. For functional |
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mpc8347eecmpc8343empc8349empc8343eec | |
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Contextual Info: VRM = 600 V, IF AV = 60 A, trr = 35 ns(max.) Fast Recovery and High Power Diode CTXS-6606S Preliminary Features Package The CTXS-6606S is a high power diode of the low-noise and low loss which realize a peak reverse voltage of 600 V. Typical forward voltage drop of 1.45 |
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ctxs-6606so-247-3lctxs-6606s-ds | |
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Contextual Info: Dropper Type - Application Note •Heat Radiation and Reliability Fastening Torque The reliability of an IC is highly dependent on its operating temperature. Design should pay particular attention to ensuring ample space for radiating heat. Be sure to apply silicon grease to the IC before attaching a heatsink, |
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si-3000nsi-3001nsi-3002nsi-3000b+6 | |
marking r55Contextual Info: Off-Line PWM Controllers with Integrated Power MOSFET STR4A100 Series General Descriptions Package The STR4A100 series are power ICs for switching power supplies, incorporating a sense MOSFET and a current mode PWM controller IC. The low standby power is accomplished by the |
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str4a100marking r55 | |
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Contextual Info: Primary Side Regulation Off-Line PWM Controllers with Integrated Power MOSFET STR5A100D Series General Descriptions Package The STR5A100D series is power IC with primary side regulation for switching power supplies, incorporating a sense MOSFET and a current mode PWM controller IC. |
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str5a100dstr5a100d-ds | |
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Contextual Info: VRM = 600 V, IF AV = 60 A, trr = 100 ns(max.) Fast Recovery and High Power Diode CTNS-6606S Preliminary Features Package The CTNS-6606S is a high power diode of the low-noise and low loss which realize a peak reverse voltage of 600 V. Typical forward voltage drop of 1.15 |
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ctns-6606so-247-3lctns-6606s-ds | |
PPAP level submission requirement table
Abstract: PPAP MANUAL for automotive industry foundry metals quality MANUALS result of 200 prize bond INCOMING MATERIAL INSPECTION checklist, PCB TSMC 90nm sram SMD a006 ISO 9001 Sony foundry INCOMING MATERIAL INSPECTION procedure INCOMING RAW MATERIAL INSPECTION procedure
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ppap level submission requirement tableppap manual for automotive industryfoundry metals quality manualsresult of 200 prize bond+6 | |