Hysol
Abstract: MG-52F TEXAS INSTRUMENTS, Mold Compound 73X128 Compound EN-4088Z SN74ABT16245ADL SN75976A1DL MG52F SN74ACT16543
Contextual Info: TEXAS INSTRUMENTS Qualification Notification for Hysol MG52F Mold Compound for DL SSOP Packages January 10, 1997 Abstract Texas Instruments is qualifying a new mold compound for the 28, 48, and 56 pin TSSOP DL packages. This new compound will be used in addition to the previously qualified compounds adding
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mg52fthis116/0hysolmg-52f+7texas instruments, mold compound73x128compounden-4088zsn74abt16245adlsn75976a1dlsn74act16543
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EPIC-1ZS
Abstract: sn74cbt3384dw relco a016 CBT16209 CBT16212 SN74CBT16209 SN74CBT16209A SN74CBT16212 SN74CBT16212A
Contextual Info: TEXAS INSTRUMENTS Qualification Notification for the SN74CBT16209A, Die Revision E and SN74CBT16212A, Die Revision D April 1, 1998 Abstract Texas Instruments has qualified a device revision for the CBT16212A, die revision ‘D’ and the SN74CBT16209A, die revision ‘E’. These devices were redesigned in order to incorporate improved
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sn74cbt16209asn74cbt16212acbt16212acbt16212+7epic-1zssn74cbt3384dwrelcoa016cbt16209sn74cbt16209sn74cbt16212
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