KMC-166
Abstract: A112 TEXAS INSTRUMENTS, Mold Compound
Contextual Info: TEXAS INSTRUMENTS Final Notification for the Manufacture of 48/56 Pin TSSOP Package DGG at the TI Sherman Assembly/Test Facility November 12, 1996 Abstract As previously notified in March by PCN5249 Texas Instruments Advanced System Logic Products (ASL) has qualified the TI Sherman Assembly/Test Prototyping Facility to manufacture
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PCN5249
KMC-166
A112
TEXAS INSTRUMENTS, Mold Compound
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KMC-166
Abstract: A112
Contextual Info: TEXAS INSTRUMENTS Qualification Notification for the Planned Manufacture of 48/56 Pin TSSOP Package DGG at the TI Sherman Assembly/Test Facility February 28, 1996 Abstract Texas Instruments Advanced System Logic Products (ASL) is planning to qualify the TI
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TSSOP DGG
Abstract: A112 KMC-166 SN74ABT16543DGG KMC166 hitachi 4088z
Contextual Info: TEXAS INSTRUMENTS Informational Notification for the Manufacture of 56 Pin TSSOP Package DGG at the TI Malaysia Assembly/Test Facility August 17, 1995 Abstract Texas Instruments Advanced System Logic Products (ASL) has qualified the TI Malaysia Assembly/Test Facility to manufacture 56 pin TSSOP (DGG) packages. DGG packages are currently
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Hysol
Abstract: MG-52F TEXAS INSTRUMENTS, Mold Compound 73X128 Compound EN-4088Z SN74ABT16245ADL SN75976A1DL MG52F SN74ACT16543
Contextual Info: TEXAS INSTRUMENTS Qualification Notification for Hysol MG52F Mold Compound for DL SSOP Packages January 10, 1997 Abstract Texas Instruments is qualifying a new mold compound for the 28, 48, and 56 pin TSSOP DL packages. This new compound will be used in addition to the previously qualified compounds adding
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MG52F
MG52F
this116/0
Hysol
MG-52F
TEXAS INSTRUMENTS, Mold Compound
73X128
Compound
EN-4088Z
SN74ABT16245ADL
SN75976A1DL
SN74ACT16543
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