PCN0516
Abstract: G770* G770 mold compound Sumitomo 1000 sumitomo g770 G770* sumitomo thermal conductivity of sumitomo g770 G770 mold compound G770 plaskon G770 mold compound data sheet G770 sumitomo
Contextual Info: PROCESS CHANGE NOTIFICATION PCN0516 MOLD COMPOUND CHANGE FOR PBGA PACKAGES Change Description: Altera is adopting Sumitomo G770 series mold compound as the standard mold material on its plastic ball-grid array PBGA packaged devices. Devices in 225, 256, and 672 pin PBGA
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pcn0516x10-5/cx102n/mm2ul-94+101x10e12g770* g770 mold compound sumitomo 1000sumitomo g770g770* sumitomothermal conductivity of sumitomo g770g770 mold compoundg770plaskong770 mold compound data sheetg770 sumitomo
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