DS80320 Search Results

p15890

Abstract: P-16100 P-15830 P-15890 p1565 DK53 dk52 C19517 P1537 P-16400
Contextual Info: RELIABILITY MONITOR SUMMARY DATA STRESS: PRODUCT DS21S07A DS21S07A DS21S07A DS21S07A DS21S07A DS80C320 DS1302 DS1302 DS1302 DS1302 DS1302 DS1302 DS21S07A DS80320 DS80320 Burn-in 125°C, 7.0 V. 6.0 V. DS1302 MONITOR DATE JOB NO. Mar-95 May-95 Jul-95 Sep-95

Contextual Info: RMP TRENDS CUMULATIVE DATA DS1000 125°C, 7.0 V 0.40% 10 8 6 0.20% 4 HV. Life, 1000 hrs 0.10% 2 Inf. Life, 48 hrs 0.00% May-95 HV/L Fits 60% Cf I/L % Def 90% Cf 0.30% Jul-95 Sep-95 Feb-96 May-96 Aug-96 CUMULATIVE DATA DS1232 125°C, 7.0 V 0.40% HV. Life, 1000 hrs

Contextual Info: RMP TRENDS CUMULATIVE DATA DS232A 125°C, 7.0 V 0.40% 15 HV. Life, 1000 hrs 12 Inf. Life, 48 hrs 9 0.20% 6 0.10% Start Dec 95 Data Limited 3 0.00% Jun-96 HV/L Fits 60% Cf I/L % Def 90% Cf 0.30% Sep-96 Dec-96 Mar-97 Jun-97 Sep-97 CUMULATIVE DATA DS1000 125°C, 7.0 V

Contextual Info: RMP TRENDS CUMULATIVE DATA DS232A 125°C, 7.0 V 1.20% 32 0.90% 24 Inf. Life, 48 hrs 0.60% 0.30% 16 Start Dec 95 Data Limited HV/L Fits 60% Cf I/L % Def 90% Cf HV. Life, 1000 hrs 8 0.00% Dec-95 Mar-96 Jun-96 Sep-96 Dec-96 CUMULATIVE DATA DS1000 125°C, 7.0 V

Contextual Info: RMP TRENDS CUMULATIVE DATA DS232A 125°C, 7.0 V 1.20% 24 Start Dec 95 Data Limited HV. Life, 1000 hrs Inf. Life, 48 hrs 0.60% 16 0.30% 8 0.00% Dec-95 Mar-96 Jun-96 Sep-96 Dec-96 HV/L Fits 60% Cf I/L % Def 90% Cf 0.90% 32 Mar-97 CUMULATIVE DATA DS1000 125°C, 7.0 V

P2272

Abstract: P2274 P2147 dl817 P22770 P22522 P22328 dm803 DS2165Q
Contextual Info: RELIABILITY MONITOR DS1210S JUL '98 MONITOR - ANAM,K. DEVICE REVISION DATE CODE LOT NUMBER PACKAGE ASSEMBLY SITE DS1210S C1 9813 DN801581AAC 16 PIN SOIC ANAM-KOREA AICL PROCESS Single Poly, Single Metal 3.0 µ POCL3 reFlow (3um only); FLASH E2PROM (all other tech. numbers)

74 HTC 192

Abstract: DS2165Q
Contextual Info: RELIABILITY MONITOR DS1000M-100 JAN '99 MONITOR-HYUNDAI,CHINA DEVICE REVISION DATE CODE LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1000 E3 DIP 300 CPS China 9847 PROCESS Single Poly, Single Metal DH833179ADA 8 1.2 µm Standard Process JOB NO DESCRIPT Cf: 60%

dn729

Abstract: P2254 P22154 P22264 P22328 P2252
Contextual Info: RELIABILITY MONITOR DS1210S JAN '98 MONITOR-HYUNDAI DEVICE REVISION DATE CODE LOT NUMBER PACKAGE ASSEMBLY SITE DS1210 C1 9750 DN738347AAA 16 PIN SOIC HYUNDAI-KOREA HEI PROCESS Single Poly, Single Metal 3.0 µm POCL3 reFlow (3um only); FLASH E2PROM (all other tech. numbers)

dallas ds1280

Abstract: DS80320 DS1280 DS1283 DS1384 DS2148 DS2151 DS80C320 DS83C520 DS89C420
Contextual Info: DALLAS SEMICONDUCTOR 4401 South Beltwood Parkway Dallas, Texas 75244-3292 972 371-4000 Date: 9/7/00 PRODUCT CHANGE NOTICE – I000702 Subject: Assembly Site Change – 44 pin TQFP Description of Change:

Ablebond

Abstract: ABLEBONd 84-1 Ablebond 8361J DS83520 8361J 84-1 LMIs DS1684 DS80320 Dallas DS1212 DS2130
Contextual Info: DALLAS SEMICONDUCTOR 4401 South Beltwood Parkway Dallas, Texas 75244–3292 214 450–0400 Date: March 11, 1997 Subject: PRODUCT CHANGE NOTICE – B70302 Description: Die Attach Adhesive Change for PLCC Devices Description of Change: The die attach adhesive will be changed from Ablebond 84–1 LMIS to Ablebond 8361J for all PLCC

P21096

Abstract: 208-MIL P2075
Contextual Info: RELIABILITY MONITOR DS1000M-25 NOV.'97 MONITOR-OMEDATA DEVICE REVISION DATE CODE LOT NUMBER PACKAGE ASSEMBLY SITE DS1000 E3 9727 DD711504ABA 8 PIN PDIP OMEDATA PROCESS Single Poly, Single Metal 1.2 µ Standard Process JOB NO DESCRIPT Cf: 60% Ea: 0.7 β: 1

P22328

Abstract: P22157 p22230 mar 9746
Contextual Info: RELIABILITY MONITOR PROCESS: 0.8 µm Double Poly, Single Metal STRESS: INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS2153 A7 JUN '98 P22294 9740 ANAM-KOREA AICL DN725561AAB 44 PIN PLCC 48 237 DS2153Q A7 MAR '98 P22292

DS87520

Abstract: P2305 P23855
Contextual Info: RELIABILITY MONITOR DS1000M-100 JAN '99 MONITOR-HYUNDAI,CHINA DEVICE REVISION DATE CODE LOT NUMBER PACKAGE ASSEMBLY SITE DS1000 E3 DH833179ADA 8 PIN PDIP CHIPPAC, CHINA CPS 9847 PROCESS Single Poly, Single Metal 1.2 µm Standard Process JOB NO DESCRIPT Cf: 60%

P22157

Abstract: P21637 9744 P2220 P22200 P22123 208mil
Contextual Info: RELIABILITY MONITOR PROCESS: 0.8 µm Double Poly, Single Metal STRESS: INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS2153 A7 JUN '98 P22294 9740 ANAM-KOREA AICL DN725561AAB 44 PIN PLCC 48 237 DS2153Q A7 MAR '98 P22292

P22243

Abstract: DS1267E DN7-36 P22154 P21256
Contextual Info: RELIABILITY MONITOR DS1000M-25 FEB '98 MONITOR-OMEDATA DEVICE REVISION DATE CODE LOT NUMBER PACKAGE ASSEMBLY SITE DS1000 E3 9750 DD740614ABA 8 PIN PDIP OMEDATA PROCESS Single Poly, Single Metal 1.2 µ Standard Process JOB NO DESCRIPT Cf: 60% Ea: 0.7 β: 1

DS1620 C2

Abstract: 9814 DS1621 P22328 DS2165Q
Contextual Info: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Single Metal Ti/TiN layers u INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE DS2502 DM821478AIB 8 PIN SOIC C2 TOTALS FOR: DEC '98 P23041 9842 CARSEM 0.6 µm Double Poly, Single Metal (Ti/Ti

DM92

Abstract: DM-92 472E-06
Contextual Info: RELIABILITY MONITOR DS1232L APR '99 MONITOR-CHIPPAC,KOREA DEVICE REVISION DATE CODE LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1232L C2 SOIC 150 CPK ChipPac, K 9848 PROCESS Single Poly, Single Metal DL829603AAC 8 0.8 µm Standard Process JOB NO DESCRIPT

DS87520

Abstract: dm8304 P2271 DS2165Q
Contextual Info: RELIABILITY MONITOR DS1232L OCT '98 MONITOR-HYUNDAI,KOREA DEVICE REVISION DATE CODE LOT NUMBER PACKAGE ASSEMBLY SITE DS1232L C1 DL817678ABB 8 PIN SOIC CHIPPAC, KOREA 9830 PROCESS Single Poly, Single Metal 0.8 µm Standard Process JOB NO DESCRIPT Cf: 60% Ea: 0.7

DS1235YW

Abstract: ds1480 DS1235YWl DS2228-1MG DS1242 DS2402 ds2403 DS1990A-f50 DS2228-4MG DS1833A
Contextual Info: RELIABILITY MONITOR PROCESS TECHNOLOGY SAMPLING PLAN VEHICLE TECHNOLOGY 0.8 µ Double Poly, Single Metal w/TEOS-OxyNitride Passivation DS87520 DS1302 DS1315 DS17485 DS21S07A DS2153 DS1868 DS1706 DS1800 DS1817 DS1866 DS1305 DS17285 DS1306 DS17485 DS1307 DS17885

P2215

Abstract: P22102 P22372 P22121 40Pn B1 9742 P22071 dallas date code ds1230 208mil P22403
Contextual Info: RELIABILITY MONITOR STRESS: TEMP CYCLE CONDITIONS: -40 TO 85°C MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE READ POINT QTY FAIL DS2250T Y JUN 98 P22125 9814 DALLAS 101397 SIP STICK 100 11 DS2250T Y JUN 98 P22125 9814 DALLAS

h 9740

Abstract: dallas date code ds12887 P21256 9735 h P21490 P2070 P22149 B1 9742 dallas date code DS80320
Contextual Info: RELIABILITY MONITOR STRESS: TEMP CYCLE CONDITIONS: -40 TO 85°C MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE READ POINT QTY FAIL DS2250 na DEC 97 P21100 9743 DALLAS 096841 SIP STICK 100 11 DS2250 na DEC 97 P21100 9743 DALLAS

P22518

Abstract: mar 9746 dallas date code ds1230 9830 TO92 P22522 P2274 P22071 P22405 P22403 DS2165Q
Contextual Info: RELIABILITY MONITOR STRESS: TEMP CYCLE CONDITIONS: -55 TO 125°C MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS1210S C1 JUL 98 P22399 9813 ANAM-KOREA AICL DN801581AAC 16 PIN SOIC 300 40 DS1210S C1 JUL 98 P22399 9813 ANAM-KOREA (AICL)

P21256

Abstract: P22102 P22154 P22149 ds1302 dallas h 9740 P22021 P21308
Contextual Info: RELIABILITY MONITOR STRESS: TEMP CYCLE CONDITIONS: -40 TO 85°C MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE READ POINT QTY FAIL DS2250T Y JUN 98 P22125 9814 DALLAS 101397 SIP STICK 100 11 DS2250T Y JUN 98 P22125 9814 DALLAS

Contextual Info: RMP TRENDS CUMULATIVE DATA DS1000 125°C, 7.0 V 0.40% 10 8 6 0.20% 4 HV. Life, 1000 hrs 0.10% 2 Inf. Life, 48 hrs 0.00% May-95 HV/L Fits 60% Cf I/L % Def 90% Cf 0.30% Jul-95 Sep-95 Feb-96 May-96 Aug-96 CUMULATIVE DATA DS1232 125°C, 7.0 V 0.40% HV. Life, 1000 hrs