P2272
Abstract: P2274 P2147 dl817 P22770 P22522 P22328 dm803 DS2165Q
Contextual Info: RELIABILITY MONITOR DS1210S JUL '98 MONITOR - ANAM,K. DEVICE REVISION DATE CODE LOT NUMBER PACKAGE ASSEMBLY SITE DS1210S C1 9813 DN801581AAC 16 PIN SOIC ANAM-KOREA AICL PROCESS Single Poly, Single Metal 3.0 µ POCL3 reFlow (3um only); FLASH E2PROM (all other tech. numbers)
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ds1210sdn801581aacp22330p22398+14p22690p22728p22729p22730p22731p2272p2274p2147dl817p22770p22522p22328dm803ds2165q
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dn729
Abstract: P2254 P22154 P22264 P22328 P2252
Contextual Info: RELIABILITY MONITOR DS1210S JAN '98 MONITOR-HYUNDAI DEVICE REVISION DATE CODE LOT NUMBER PACKAGE ASSEMBLY SITE DS1210 C1 9750 DN738347AAA 16 PIN SOIC HYUNDAI-KOREA HEI PROCESS Single Poly, Single Metal 3.0 µm POCL3 reFlow (3um only); FLASH E2PROM (all other tech. numbers)
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ds1210sds1210dn738347aaap21776+12p22233p22310p22312p22230p22309p22311dn729p2254p22154p22264p22328p2252
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P22328
Abstract: P22157 p22230 mar 9746
Contextual Info: RELIABILITY MONITOR PROCESS: 0.8 µm Double Poly, Single Metal STRESS: INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS2153 A7 JUN '98 P22294 9740 ANAM-KOREA AICL DN725561AAB 44 PIN PLCC 48 237 DS2153Q A7 MAR '98 P22292
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ds2153ds2153qp22294p22292+8p22556dn725561aabdn720030aabdn733468aabp22328p22157p22230mar 9746
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DS1620 C2
Abstract: 9814 DS1621 P22328 DS2165Q
Contextual Info: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Single Metal Ti/TiN layers u INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE DS2502 DM821478AIB 8 PIN SOIC C2 TOTALS FOR: DEC '98 P23041 9842 CARSEM 0.6 µm Double Poly, Single Metal (Ti/Ti
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dm821478aibds2502p23041ds2153q+10p23108p22556dn811539aabdn733468aabds2108ds1620 c29814ds1621p22328ds2165q
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