DS1620 C2
Abstract: 9814 DS1621 P22328 DS2165Q
Contextual Info: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Single Metal Ti/TiN layers u INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE DS2502 DM821478AIB 8 PIN SOIC C2 TOTALS FOR: DEC '98 P23041 9842 CARSEM 0.6 µm Double Poly, Single Metal (Ti/Ti
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dm821478aibds2502p23041ds2153q+10p23108p22556dn811539aabdn733468aabds2108ds1620 c29814ds1621p22328ds2165q
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P2272
Abstract: P2274 P2147 dl817 P22770 P22522 P22328 dm803 DS2165Q
Contextual Info: RELIABILITY MONITOR DS1210S JUL '98 MONITOR - ANAM,K. DEVICE REVISION DATE CODE LOT NUMBER PACKAGE ASSEMBLY SITE DS1210S C1 9813 DN801581AAC 16 PIN SOIC ANAM-KOREA AICL PROCESS Single Poly, Single Metal 3.0 µ POCL3 reFlow (3um only); FLASH E2PROM (all other tech. numbers)
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ds1210sdn801581aacp22330p22398+14p22690p22728p22729p22730p22731p2272p2274p2147dl817p22770p22522p22328dm803ds2165q
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DS87520
Abstract: dm8304 P2271 DS2165Q
Contextual Info: RELIABILITY MONITOR DS1232L OCT '98 MONITOR-HYUNDAI,KOREA DEVICE REVISION DATE CODE LOT NUMBER PACKAGE ASSEMBLY SITE DS1232L C1 DL817678ABB 8 PIN SOIC CHIPPAC, KOREA 9830 PROCESS Single Poly, Single Metal 0.8 µm Standard Process JOB NO DESCRIPT Cf: 60% Ea: 0.7
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ds1232ldl817678abbp22755p22778+8j-std-020ds87520dn825394aabds87c520p23306dm8304p2271ds2165q
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DS1232L
Abstract: DS1620 C2 ti 9815
Contextual Info: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Single Metal Ti/TiN layers used on all Metals INFANT LIFE READ POINT QTY FAILS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE DS2502 C2 DM821478AIB 8 PIN SOIC STRESS:
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dm821478aibds2502p23041p23123+4dk826585aads1232lds1620 c2ti 9815
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