DS87530
Abstract: DS87520 C72701
Contextual Info: DALLAS SEMICONDUCTOR 4401 South Beltwood Parkway Dallas, Texas 75244–3292 972 371–4000 Date: April 7, 1997 Subject: PRODUCT CHANGE NOTICE – C72701 Description: DS87520 / DS87530 Revision Change Description of Change: The DS87520 and DS87530 Microcontrollers are being changed from revision A10 to A11. This
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DS87520
Abstract: DS87C520 DS87C530
Contextual Info: DALLAS SEMICONDUCTOR 4401 South Beltwood Parkway Dallas, Texas 75244-3292 972 371-4000 Date: May 13th, 1997 Subject: PRODUCT CHANGE NOTICE - E70201 Description: DS87520 and DS87530 passivation process changed.
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DS1235YW
Abstract: ds1480 DS1235YWl DS2228-1MG DS1242 DS2402 ds2403 DS1990A-f50 DS2228-4MG DS1833A
Contextual Info: RELIABILITY MONITOR PROCESS TECHNOLOGY SAMPLING PLAN VEHICLE TECHNOLOGY 0.8 µ Double Poly, Single Metal w/TEOS-OxyNitride Passivation DS87520 DS1302 DS1315 DS17485 DS21S07A DS2153 DS1868 DS1706 DS1800 DS1817 DS1866 DS1305 DS17285 DS1306 DS17485 DS1307 DS17885
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ds87520ds87523ds87530ds2118+15ds1302ds1315ds17485ds1721ds83ch20ds1235ywds1480ds1235ywlds2228-1mgds1242ds2402ds2403ds1990a-f50ds2228-4mgds1833a
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DS1235YW
Abstract: DS1235YWL DS2228-1MG DS1242 DS1868 DS1187 ds1480 DS1671 DS83520 DS1241
Contextual Info: RELIABILITY MONITOR PROCESS TECHNOLOGY SAMPLING PLAN VEHICLE DS87520 TECHNOLOGY 0.8 µ Double Poly, Single Metal w/TEOS-OxyNitride Passivation DS87520 DS1302 DS1585 DS1306 DS17485 DS1307 DS17885 DS1315 DS1803 DS1623 DS1806 DS1627 DS2430A DS1670 DS2437 DS1673
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ds87520ds87523ds87530ds2118+14ds1302ds1721ds83ch20ds12885bds1235ywds1235ywlds2228-1mgds1242ds1868ds1187ds1480ds1671ds83520ds1241
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DS87520
Contextual Info: DALLAS SEMICONDUCTOR 4401 South Beltwood Parkway Dallas, Texas 75244–3292 214 450–0400 Date: March 11, 1997 Subject: PRODUCT CHANGE NOTICE – A70702 Description: DS87520/DS87530 Revision Change Description of Change: The DS87520 and DS87530 Microcontrollers are being changed from revision A7 to revision A10.
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Hyundai 9944
Abstract: nseb ds1000m-100 DS2165Q
Contextual Info: RELIABILITY MONITOR DS1000M-100 OCT '99 MONITOR DEVICE REVISION DATE CODE LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1000 E3 DIP 300 CPS ChipPac, C 9944 PROCESS Single Poly, Single Metal DH927108AJC 8 1.2 µm Standard Process JOB NO DESCRIPT Cf: 60% Ea: 0.7
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74 HTC 192
Abstract: DS2165Q
Contextual Info: RELIABILITY MONITOR DS1000M-100 JAN '99 MONITOR-HYUNDAI,CHINA DEVICE REVISION DATE CODE LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1000 E3 DIP 300 CPS China 9847 PROCESS Single Poly, Single Metal DH833179ADA 8 1.2 µm Standard Process JOB NO DESCRIPT Cf: 60%
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Ablebond
Abstract: ABLEBONd 84-1 Ablebond 8361J DS83520 8361J 84-1 LMIs DS1684 DS80320 Dallas DS1212 DS2130
Contextual Info: DALLAS SEMICONDUCTOR 4401 South Beltwood Parkway Dallas, Texas 75244–3292 214 450–0400 Date: March 11, 1997 Subject: PRODUCT CHANGE NOTICE – B70302 Description: Die Attach Adhesive Change for PLCC Devices Description of Change: The die attach adhesive will be changed from Ablebond 84–1 LMIS to Ablebond 8361J for all PLCC
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b703028361jds1212ds2012+14ds1284ds2130ds1285ds2141ds2009ds2143ablebondablebond 84-1ablebond 8361jds8352084-1 lmisds1684ds80320dallas ds1212
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DS87520
Abstract: P2305 P23855
Contextual Info: RELIABILITY MONITOR DS1000M-100 JAN '99 MONITOR-HYUNDAI,CHINA DEVICE REVISION DATE CODE LOT NUMBER PACKAGE ASSEMBLY SITE DS1000 E3 DH833179ADA 8 PIN PDIP CHIPPAC, CHINA CPS 9847 PROCESS Single Poly, Single Metal 1.2 µm Standard Process JOB NO DESCRIPT Cf: 60%
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DS87520
Abstract: dm8304 P2271 DS2165Q
Contextual Info: RELIABILITY MONITOR DS1232L OCT '98 MONITOR-HYUNDAI,KOREA DEVICE REVISION DATE CODE LOT NUMBER PACKAGE ASSEMBLY SITE DS1232L C1 DL817678ABB 8 PIN SOIC CHIPPAC, KOREA 9830 PROCESS Single Poly, Single Metal 0.8 µm Standard Process JOB NO DESCRIPT Cf: 60% Ea: 0.7
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MP8000C
Abstract: DS2141A DS2151 DS2153 DS2180A DS2181A DS80320 DS87520 mold compound MP-8000
Contextual Info: DALLAS SEMICONDUCTOR 4401 South Beltwood Parkway Dallas, Texas 75244-3292 972-371-4000 Date: 8/26/98 Subject: PRODUCT CHANGE NOTIFICATION Description: Qualification of MP8000C Mold Compound and adding Hana, Hong Kong as a second source for 44L PLCC packages.
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mp8000caff3520ds2141ads2151+7ds2153ds2180ads2181ads80320ds87520mold compoundmp-8000
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