Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    DS87520 Search Results

    DS87520 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    DS87530

    Abstract: DS87520 C72701
    Text: DALLAS SEMICONDUCTOR 4401 South Beltwood Parkway Dallas, Texas 75244–3292 972 371–4000 Date: April 7, 1997 Subject: PRODUCT CHANGE NOTICE – C72701 Description: DS87520 / DS87530 Revision Change Description of Change: The DS87520 and DS87530 Microcontrollers are being changed from revision A10 to A11. This


    Original     		PDF C72701 DS87520 DS87530 yywwA11, yywwA10 C72701

    DS87520

    Abstract: DS87C520 DS87C530
    Text: DALLAS SEMICONDUCTOR 4401 South Beltwood Parkway Dallas, Texas 75244-3292 972 371-4000 Date: May 13th, 1997 Subject: PRODUCT CHANGE NOTICE - E70201 Description: DS87520 and DS87530 passivation process changed.


    Original     		PDF E70201 DS87520 DS87530 DS87C520 DS87C530 DS87C530

    DS1235YW

    Abstract: ds1480 DS1235YWl DS2228-1MG DS1242 DS2402 ds2403 DS1990A-f50 DS2228-4MG DS1833A
    Text: RELIABILITY MONITOR PROCESS TECHNOLOGY SAMPLING PLAN VEHICLE TECHNOLOGY 0.8 µ Double Poly, Single Metal w/TEOS-OxyNitride Passivation DS87520 DS1302 DS1315 DS17485 DS21S07A DS2153 DS1868 DS1706 DS1800 DS1817 DS1866 DS1305 DS17285 DS1306 DS17485 DS1307 DS17885


    Original     		PDF DS87520 DS87523 DS87530 DS2118 DS1302 DS1315 DS17485 DS1721 DS83CH20 DS1235YW ds1480 DS1235YWl DS2228-1MG DS1242 DS2402 ds2403 DS1990A-f50 DS2228-4MG DS1833A

    DS1235YW

    Abstract: DS1235YWL DS2228-1MG DS1242 DS1868 DS1187 ds1480 DS1671 DS83520 DS1241
    Text: RELIABILITY MONITOR PROCESS TECHNOLOGY SAMPLING PLAN VEHICLE DS87520 TECHNOLOGY 0.8 µ Double Poly, Single Metal w/TEOS-OxyNitride Passivation DS87520 DS1302 DS1585 DS1306 DS17485 DS1307 DS17885 DS1315 DS1803 DS1623 DS1806 DS1627 DS2430A DS1670 DS2437 DS1673


    Original     		PDF DS87520 DS87523 DS87530 DS2118 DS1302 DS1302 DS1721 DS83CH20 DS12885B DS1235YW DS1235YWL DS2228-1MG DS1242 DS1868 DS1187 ds1480 DS1671 DS83520 DS1241

    DS87520

    Abstract: No abstract text available
    Text: DALLAS SEMICONDUCTOR 4401 South Beltwood Parkway Dallas, Texas 75244–3292 214 450–0400 Date: March 11, 1997 Subject: PRODUCT CHANGE NOTICE – A70702 Description: DS87520/DS87530 Revision Change Description of Change: The DS87520 and DS87530 Microcontrollers are being changed from revision A7 to revision A10.


    Original     		PDF A70702 DS87520/DS87530 DS87520 DS87530 yywwA10,

    Hyundai 9944

    Abstract: nseb ds1000m-100 DS2165Q
    Text: RELIABILITY MONITOR DS1000M-100 OCT '99 MONITOR DEVICE REVISION DATE CODE LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1000 E3 DIP 300 CPS ChipPac, C 9944 PROCESS Single Poly, Single Metal DH927108AJC 8 1.2 µm Standard Process JOB NO DESCRIPT Cf: 60% Ea: 0.7


    Original     		PDF DS1000M-100 DS1000 DH927108AJC DS87C520 DN901118AAB Hyundai 9944 nseb DS2165Q

    74 HTC 192

    Abstract: DS2165Q
    Text: RELIABILITY MONITOR DS1000M-100 JAN '99 MONITOR-HYUNDAI,CHINA DEVICE REVISION DATE CODE LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1000 E3 DIP 300 CPS China 9847 PROCESS Single Poly, Single Metal DH833179ADA 8 1.2 µm Standard Process JOB NO DESCRIPT Cf: 60%


    Original     		PDF DS1000M-100 DS1000 DH833179ADA HOUR99 DS87C520 DN825394AAB J-STD-020 30C/60% 74 HTC 192 DS2165Q

    Ablebond

    Abstract: ABLEBONd 84-1 Ablebond 8361J DS83520 8361J 84-1 LMIs DS1684 DS80320 Dallas DS1212 DS2130
    Text: DALLAS SEMICONDUCTOR 4401 South Beltwood Parkway Dallas, Texas 75244–3292 214 450–0400 Date: March 11, 1997 Subject: PRODUCT CHANGE NOTICE – B70302 Description: Die Attach Adhesive Change for PLCC Devices Description of Change: The die attach adhesive will be changed from Ablebond 84–1 LMIS to Ablebond 8361J for all PLCC


    Original     		PDF B70302 8361J DS1212 DS2012 DS1284 DS2130 DS1285 DS2141 DS2009 DS2143 Ablebond ABLEBONd 84-1 Ablebond 8361J DS83520 84-1 LMIs DS1684 DS80320 Dallas DS1212 DS2130

    DS87520

    Abstract: P2305 P23855
    Text: RELIABILITY MONITOR DS1000M-100 JAN '99 MONITOR-HYUNDAI,CHINA DEVICE REVISION DATE CODE LOT NUMBER PACKAGE ASSEMBLY SITE DS1000 E3 DH833179ADA 8 PIN PDIP CHIPPAC, CHINA CPS 9847 PROCESS Single Poly, Single Metal 1.2 µm Standard Process JOB NO DESCRIPT Cf: 60%


    Original     		PDF DS1000M-100 DS1000 DH833179ADA P23057 P23178 DN825394AAB P23415 P23306 P23307 J-STD-020 DS87520 P2305 P23855

    DS87520

    Abstract: dm8304 P2271 DS2165Q
    Text: RELIABILITY MONITOR DS1232L OCT '98 MONITOR-HYUNDAI,KOREA DEVICE REVISION DATE CODE LOT NUMBER PACKAGE ASSEMBLY SITE DS1232L C1 DL817678ABB 8 PIN SOIC CHIPPAC, KOREA 9830 PROCESS Single Poly, Single Metal 0.8 µm Standard Process JOB NO DESCRIPT Cf: 60% Ea: 0.7


    Original     		PDF DS1232L DL817678ABB P22755 P22778 J-STD-020 DS87520 DN825394AAB DS87C520 P23306 dm8304 P2271 DS2165Q

    MP8000C

    Abstract: DS2141A DS2151 DS2153 DS2180A DS2181A DS80320 DS87520 mold compound MP-8000
    Text: DALLAS SEMICONDUCTOR 4401 South Beltwood Parkway Dallas, Texas 75244-3292 972-371-4000 Date: 8/26/98 Subject: PRODUCT CHANGE NOTIFICATION Description: Qualification of MP8000C Mold Compound and adding Hana, Hong Kong as a second source for 44L PLCC packages.


    Original     		PDF MP8000C Aff3520 DS2141A DS2151 DS2153 DS2180A DS2181A DS80320 DS87520 mold compound MP-8000