ABLEBOND Search Results

Ablecube

Abstract: ATM-0018 Ablestik ATM-0087 ablebond ablebond technical 8200C ATM-0089 ablebond ablestik ablestik ablebond
Contextual Info: PILOT TECHNICAL DATASHEET ABLEBOND 8200C ELECTRICALLY CONDUCTIVE DIE ATTACH ADHESIVE DESCRIPTION ABLEBOND® 8200C low bleed die attach adhesive is designed for small and medium sized dies across a variety of leadframes including PPF, Cu and Ag. This electrically conductive adhesive offers improved JEDEC

Ablebond

Abstract: Ablecube ablebond 2815a 2815A ablestik ablebond 2815a ATM-0018 ablebond ablestik ablebond technical Ablestik Ablestik 2815
Contextual Info: DEVELOPMENTAL TECHNICAL DATASHEET ABLEBOND 2815A THERMALLY CONDUCTIVE DIE ATTACH ADHESIVE DESCRIPTION ABLEBOND® 2815A die attach adhesive offers high thermal conductivity to minimize thermal resistance between the chip and substrate. This adhesive is designed to provide improved workability for applications requiring high heat extraction from die.

Ablebond

Abstract: ABLEBONd 84-1 Ablebond 8361J DS83520 8361J 84-1 LMIs DS1684 DS80320 Dallas DS1212 DS2130
Contextual Info: DALLAS SEMICONDUCTOR 4401 South Beltwood Parkway Dallas, Texas 75244–3292 214 450–0400 Date: March 11, 1997 Subject: PRODUCT CHANGE NOTICE – B70302 Description: Die Attach Adhesive Change for PLCC Devices Description of Change: The die attach adhesive will be changed from Ablebond 84–1 LMIS to Ablebond 8361J for all PLCC

84-1LMI

Contextual Info: NKD-100-D 4 MILLIMETER-WAVE FREQUENCY DOUBLER MMIC 5GHz TO 24GHz Typical Applications • Narrow and Broadband Commercial and • Upconversion Stage used in MW Radio/ Optical Designs Military Radio Designs • Linear and Saturated Radio Applications GENERAL PURPOSE

Contextual Info: NBB-302 4 CASCADABLE BROADBAND GaAs MMIC AMPLIFIER DC TO 12GHz Typical Applications • Narrow and Broadband Commercial and • Gain Stage or Driver Amplifiers for MWRadio/Optical Designs PTP/PMP/ Military Radio Designs • Linear and Saturated Amplifiers

ultrasonic bond

Abstract: LMA422 MIL-HDBK-263
Contextual Info: LMA422 LOW NOISE PHEMT MMIC • FEATURES ♦ ♦ ♦ ♦ ♦ • 26 GHz to 30 GHz Frequency Band 3.0 dB Noise Figure 22 dB Gain 5 dBm Output Power at Saturation +3 V Single Bias Supply DESCRIPTION AND APPLICATIONS The Filtronic Solid State LMA422 is a low noise PHEMT amplifier that operates from 26 to 30GHz.

LMA420

Abstract: MIL-HDBK-263
Contextual Info: LMA420 LOW NOISE PHEMT MMIC • FEATURES ♦ ♦ ♦ ♦ ♦ ♦ • 21 GHz to 24 GHz Frequency Band 3 dB Noise Figure 22 dB Gain 5 dBm Output Power at Saturation 12 dB Input/Output Return Loss +3 V Single Bias Supply DESCRIPTION AND APPLICATIONS The Filtronic Solid State LMA420 is a low noise PHEMT amplifier that operates from 21 to 24GHz.

Ablebond

Abstract: ultrasonic bond LMA406
Contextual Info: LMA406 LOW NOISE PHEMT MMIC • FEATURES ♦ ♦ ♦ ♦ ♦ • 18 GHz to 40 GHz Frequency Band 4.5 dB Noise Figure 12dB Gain 14 dBm Output Power at Saturation +3 V Single Bias Supply DESCRIPTION AND APPLICATIONS The Filtronic Solid State LMA406 is a low noise PHEMT amplifier that operates from 18 to 40GHz.

Contextual Info: E l Stanford Microdevices Product Description SNA-200 Stanford Microdevices' SNA-200 is a GaAs monolithic broadband amplifier MMIC in die form. This amplifier provides !6dB of gain when biased at 50mA and 4V. DC-6.5 GHz, Cascadable GaAs MMIC Amplifier External DC decoupling capacitors determine low frequency

Contextual Info: NBB-302 CASCADABLE BROADBAND GaAs MMIC AMPLIFIER DC TO 12GHz Typical Applications • Narrow and Broadband Commercial and • Gain Stage or Driver Amplifiers for MWRadio/Optical Designs PTP/PMP/ Military Radio Designs • Linear and Saturated Amplifiers LMDS/UNII/VSAT/WLAN/Cellular/DWDM

FMA3011

Abstract: HEMT MMIC POWER AMPLIFIER MIL-HDBK-263 15 GHz power amplifier Output Power 37dBm 2068 d 05332 214-3556
Contextual Info: FMA3011 FMA3011 12.7GHZ TO 16GHZ MMIC POWER AMPLIFIER Package Style: Bare Die Product Description Features The FMA3011 is a high performance 12.7GHz to 16GHz Gallium Arsenide monolithic power amplifier with sufficiently high gain to ensure that IMD products from

E115797

Abstract: ablebond 84-1 LMI ABLEBONd 84-1 Ablebond 84-1 SR4 E115797 ablebond 84-1 LMI Ablebond 84-1 SR4 thyristor catalogue TICP106M-S 1015 to-92 mold compound std883
Contextual Info: October, 2005 Circuit Protection Division Bourns Manufacturers Representatives Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team N IT CU ECTIO R I C ROT P Thyristor Surge Protector Product Change Notification PCN Tracking Number 39 Mold Compound Change - TO-92 & DO-92 Packages

mmic distributed amplifier

Abstract: 84-1LMI NDA-210-D
Contextual Info: GaInP/GaAs HBT MMIC Distributed Amplifier NDA-210-D DC-17 GHz 6000045 Rev. A 1 Features Applications • • • • • • • • Reliable low-cost HBT-based design 6 dB Gain, +12.6 dBm P1dB @ 2 GHz High P1dB of +13.4 dBm at 6.0 GHz and +8.5 dBm at 14.0 GHz

Ablebond

Contextual Info: 27.5-29.5 Three Stage GBAIpJia MMIC Driver Amplifier AA028P3-00 Features • Single Bias Supply Operation +6V ■ Designed for 27.5-29.5 GHZ LMDS & Digital Radio Bands ■ 19 dB Small Signal Gain Typical at 28 GHz ■ 16 dBm Output Power at 28 GHz (1 dBc)

IR2125

Abstract: 104X111 IR2125(S) equivalent IGBT manual 017D MP150 H3CR-F8-300 figure circuit manual 125+kHz+RFID+READER+EM+18+CIRCUIT
Contextual Info: Data Sheet No. PD-6.017D IR2125 CURRENT LIMITING SINGLE CHANNEL DRIVER Features Product Summary n Floating channel designed for bootstrap operation Fully operational to +500V Tolerant to negative transient voltage dV/dt immune n Gate drive supply range from 12 to 18V

ir2101 datasheet

Abstract: IR2101 IR2101 AN IR2101S MP150 B3 ho transistor
Contextual Info: Data Sheet No. PD-6.043C IR2101 HIGH AND LOW SIDE DRIVER Features Product Summary n Floating channel designed for bootstrap operation Fully operational to +600V Tolerant to negative transient voltage dV/dt immune n Gate drive supply range from 10 to 20V n Undervoltage lockout

AMMC-6220

Abstract: 74318 AMMC-6220-W50 AMMC-6220-W10 1710-01
Contextual Info: AMMC - 6220 6 - 20 GHz Low Noise Amplifier Data Sheet Chip Size: 1700 x 800 µm 67 x 31.5 mils Chip Size Tolerance: ± 10 µm (±0.4 mils) Chip Thickness: 100 ± 10 µm (4 ± 0.4 mils) Pad Dimensions: 100 x 100 µm (4 ± 0.4 mils) Description Features Avago Technologies’ AMMC-6220 is a high gain, low-noise

GaAs MMIC ESD, Die Attach and Bonding Guidelines

Abstract: ammc 5024 AMMC-5024
Contextual Info: AMMC-5024 30 KHz – 40 GHz Traveling Wave Amplifier Data Sheet Description Agilent ’s AMMC-5024 is a broadband PHEMT GaAs MMIC TWA designed for medium output power and high gain over the full 30 KHz to 40 GHz frequency range. The design employs a 9-stage,cascade-connected FET structure to ensure flat gain and power

70123A

Abstract: TOP224 Application Note top227 TOP221 TOP223 TOP222 TOP224 TOP223 application specifications curve tracer top221-224p
Contextual Info: April 1997 TOP221-224P PRODUCT SPECIFICATION Document Number PS026 Customer Name PI Signatory Date Customer Signatory Date W.B. Smith, Dir. QA&R This specification is a controlled document and is distributed to customers. Each customer recipient must acknowledge and register receipt by returning the cover sheet with an authorized signature to the Power Integrations

TOP227

Abstract: TOP-220 TOP222 TOP221 TOP223 application note specification of curve tracer top223y top227y Top224 TOP222y TOP223
Contextual Info: April 1997 TOP221-227Y PRODUCT SPECIFICATION Document Number Customer Name PS027-001 SONY PI Signatory Date Customer Signatory Date W.B. Smith, Dir. QA&R This specification is a controlled document and is distributed to customers. Each customer recipient must

2032-6344-00

Abstract: 3 to 10 GHz mixer AMMC-6530 203263 RF21
Contextual Info: Agilent AMMC-6530 5– 30 GHz Image Reject Mixer Data Sheet Features • Broad Band Performance 5– 30 GHz • Low Conversion Loss of 8 dB • High Image Rejection of 15 – 20 dB • Good 3rd Order Intercept of +18 dBm • Single -1V, no current Supply Bias

ablebond 84-1 LMI

Abstract: E115797 Ablebond 84-1 SR4 ABLEBONd 84-1 mil std 1015 R3752-1-S CS 110 thyristor 84-1 LMI plaskon TICP106M
Contextual Info: October, 2005 Circuit Protection Division Bourns Manufacturers Representatives Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team N IT CU ECTIO R I C ROT P Thyristor Surge Protector Product Change Notification PCN Tracking Number 39 Mold Compound Change - TO-92 & DO-92 Packages

ABLEBONd 84-1

Abstract: Ablebond 84-1 LMISR4 JESD22-B116 G600 TISP61089HDMR-S MIL-STD-883-2019 A101 B116 JESD22 TISP9110LDMR-S
Contextual Info: THYRISTOR SURGE PROTECTORS Bourns Manufacturers Representatives Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team May 6, 2009 PCN Tracking Number 48 Change from Gold to Copper Wire In 2Q08, Bourns qualified a change to the base metal composition of the wires used to bond overvoltage protection chips to the package terminals of the 8-pin SOP 150 mil package.

AMMC-5620

Abstract: AMMC-5620-W10 AMMC-5620-W50
Contextual Info: Agilent AMMC-5620 6 - 20 GHz High Gain Amplifier Data Sheet Features • Frequency Range: 6 - 20 GHz • High Gain: 19 dB Typical • Output Power: 15dBm Typical • Input and Output Return Loss: < -10 dB Chip Size: 1410 x 1010 µm 55.5 x 39.7 mils Chip Size Tolerance:± 10µm (± 0.4 mils)