dallas date code ds1230
Abstract: 25091 e8 sot223 24446
Contextual Info: RELIABILITY MONITOR STRESS: WRITE CYCLE STRESS CONDITIONS: 85 C, 7.0 VOLTS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS1621 A7 JUN '99 24325 9915 ATP Anam, PI DK815282AAB SOIC 50 47 DS1869 A3 SEP '99 24445 9907 NSEB DJ824247ABA SOIC
|
Original
|
ds1621ds1869dk815282aabdj824247aba+9dm846764aads2502ds87c520dn901118aabdk935356aabdallas date code ds123025091e8 sot22324446
|
PDF
|
Hyundai 9944
Abstract: nseb ds1000m-100 DS2165Q
Contextual Info: RELIABILITY MONITOR DS1000M-100 OCT '99 MONITOR DEVICE REVISION DATE CODE LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1000 E3 DIP 300 CPS ChipPac, C 9944 PROCESS Single Poly, Single Metal DH927108AJC 8 1.2 µm Standard Process JOB NO DESCRIPT Cf: 60% Ea: 0.7
|
Original
|
ds1000m-100ds1000dh927108ajcds87c520+4dn901118aabhyundai 9944nsebds2165q
|
PDF
|
DS1233 a5
Abstract: e8 sot223 9915 dallas 25010 DN819 densit DS1232L ds1232l datasheet DS1869 DK815282AAB
Contextual Info: RELIABILITY MONITOR STRESS: WRITE CYCLE STRESS CONDITIONS: 85 C, 7.0 VOLTS MONITOR DATE ASSEMBLY DATE PRODUCT REV JOB NO CODE FACILITY LOT NO. DS1621 A7 JUN '99 24325 9915 ATP Anam, PI DK815282AAB SOIC 50 45 DS1621 A7 SEP '99 24466 9930 ATP (Anam, PI) DK906731AAC SOIC
|
Original
|
ds1621dk815282aabdk906731aacds1869+11dj821534abbdj824252aacdj824247abads1233 a5e8 sot2239915dallas 25010dn819densitds1232lds1232l datasheet
|
PDF
|
|
Contextual Info: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Single Metal Ti/TiN layers used on all Metals INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY READ POINT QTY FAILS LOT NO. PACKAGE DS2502 C3 MAR '00 25253 0005 Carsem S DM941226AA
|
Original
|
dm941226aadm941230agds2502 |
PDF
|
DN901118AAB
Abstract: c5 99 sot223 dk91
Contextual Info: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Single Metal Ti/TiN layers used on all Metals INFANT LIFE READ POINT QTY FAILS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE DS2502 C2 JUN '99 24169 9915 Carsem S DM846764AA
|
Original
|
dm846764aadm849359acds2502dn901118aab+2c5 99 sot223dk91
|
PDF
|
DS-1000
Abstract: DS1302 DIE REVISION DH020 ds1000m-100 25409
Contextual Info: RELIABILITY MONITOR DS1000M-100 OCT '99 MONITOR DEVICE REVISION DATE CD LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1000 E3 300 9944 PROCESS Single Poly, Single Metal DH927108AJC 8 PDIP CPS ChipPac, China 1.2 µm Standard Process JOB NO DESCRIPT Cf: 60%
|
Original
|
ds1000m-100ds1000dh927108ajcj-std-020+530c/60ds-1000ds1302 die revisiondh02025409
|
PDF
|
dallas date code ds1230
Abstract: dallas date code dallas ds1230 code 25807
Contextual Info: RELIABILITY MONITOR STRESS: VAPOR PHASE REFLOW CONDITIONS: 217C MONITOR DATE ASSEMBLY DATE PRODUCT REV JOB NO CODE FACILITY LOT NO. DS5002 C4 PACKAGE READ POINT QTY FAIL APR '00 25428 0004 Carsem DM925587AAF MQFP 3 203 DS87C520 A14 NOV '99 24798 9931 ATK Anam, K
|
Original
|
ds5002ds87c520dm925587aafdn901118aab+9dk935356aabj-std-020dm929359abds1232ds1233dallas date code ds1230dallas date codedallas ds1230code 25807
|
PDF
|
74 HTC 00
Abstract: 74 HTC 08 DS1302 DIE REVISION Hyundai 9944
Contextual Info: RELIABILITY MONITOR DS1000M-100 OCT '99 MONITOR DEVICE REVISION DATE CD LOT NUMBER PINS PACKAGE WIDTH ASSEMBLY SITE DS1000 E3 300 9944 PROCESS Single Poly, Single Metal DH927108AJC 8 PDIP CPS ChipPac, China 1.2 µm Standard Process JOB NO DESCRIPT Cf: 60%
|
Original
|
ds1000m-100ds1000dh927108ajcdk935356aab+6j-std-02030c/6074 htc 0074 htc 08ds1302 die revisionhyundai 9944
|
PDF
|
218E-08
Abstract: ti 9919
Contextual Info: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Single Metal Ti/TiN layers used on all Metals INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY READ POINT QTY FAILS LOT NO. PACKAGE DS2502 C2 MAR '99 24153 9913 Carsem S DM842206AL
|
Original
|
dm842206aldm846764aads2502218e-08+1ti 9919
|
PDF
|