P2272
Abstract: P2274 P2147 dl817 P22770 P22522 P22328 dm803 DS2165Q
Contextual Info: RELIABILITY MONITOR DS1210S JUL '98 MONITOR - ANAM,K. DEVICE REVISION DATE CODE LOT NUMBER PACKAGE ASSEMBLY SITE DS1210S C1 9813 DN801581AAC 16 PIN SOIC ANAM-KOREA AICL PROCESS Single Poly, Single Metal 3.0 µ POCL3 reFlow (3um only); FLASH E2PROM (all other tech. numbers)
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ds1210sdn801581aacp22330p22398+14p22690p22728p22729p22730p22731p2272p2274p2147dl817p22770p22522p22328dm803ds2165q
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DS87520
Abstract: dm8304 P2271 DS2165Q
Contextual Info: RELIABILITY MONITOR DS1232L OCT '98 MONITOR-HYUNDAI,KOREA DEVICE REVISION DATE CODE LOT NUMBER PACKAGE ASSEMBLY SITE DS1232L C1 DL817678ABB 8 PIN SOIC CHIPPAC, KOREA 9830 PROCESS Single Poly, Single Metal 0.8 µm Standard Process JOB NO DESCRIPT Cf: 60% Ea: 0.7
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ds1232ldl817678abbp22755p22778+8j-std-020ds87520dn825394aabds87c520p23306dm8304p2271ds2165q
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TSOC 6
Abstract: P22713 P23162 dallas date code ds12887
Contextual Info: RELIABILITY MONITOR STRESS: WRITE CYCLE STRESS CONDITIONS: +85°C, 7.0 VOLTS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY DS1620 D1 SEP 98 P22710 9746 LOT NO. PACKAGE ALPHTK-BANGKOK NSEB DJ711527ABD 8PN SOIC, 208MIL READ POINT QTY FAIL 50 42
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ds1620p22710dj711527abd208mil+8j-std-020ds1232lds1233ds1267tsoc 6p22713p23162dallas date code ds12887
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P22518
Abstract: mar 9746 dallas date code ds1230 9830 TO92 P22522 P2274 P22071 P22405 P22403 DS2165Q
Contextual Info: RELIABILITY MONITOR STRESS: TEMP CYCLE CONDITIONS: -55 TO 125°C MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. DS1210S C1 JUL 98 P22399 9813 ANAM-KOREA AICL DN801581AAC 16 PIN SOIC 300 40 DS1210S C1 JUL 98 P22399 9813 ANAM-KOREA (AICL)
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ds1210sds1232lds1232sds1233+11ds1233zp22518mar 9746dallas date code ds12309830 to92p22522p2274p22071p22405p22403ds2165q
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