dallas date code ds12887
Abstract: dallas date code P23073 DS1225A DALLAS DS80C320 9832 P23403 dallas date code ds80c320 P23074
Contextual Info: RELIABILITY MONITOR STRESS: ULTRASOUND CONDITIONS: J-STD-020 MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE DS1233 A5 JAN 99 P23064 9842 CARSEM DM823017AB SOT-223 DS1803 A2 NOV 98 P22797 9833 CHIPPAC, KOREA DS1869 A3 MAR 99 P23360
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j-std-020dm823017abds1233ds1803+15ds1869ds2109ds2153ds2175ds5002p23064dallas date code ds12887dallas date codep23073ds1225adallas ds80c3209832p23403dallas date code ds80c320p23074
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DS87520
Abstract: P2305 P23855
Contextual Info: RELIABILITY MONITOR DS1000M-100 JAN '99 MONITOR-HYUNDAI,CHINA DEVICE REVISION DATE CODE LOT NUMBER PACKAGE ASSEMBLY SITE DS1000 E3 DH833179ADA 8 PIN PDIP CHIPPAC, CHINA CPS 9847 PROCESS Single Poly, Single Metal 1.2 µm Standard Process JOB NO DESCRIPT Cf: 60%
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ds1000m-100ds1000dh833179adap23057+9p23178dn825394aabp23415p23306p23307j-std-020ds87520p2305p23855
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DS87520
Abstract: dm8304 P2271 DS2165Q
Contextual Info: RELIABILITY MONITOR DS1232L OCT '98 MONITOR-HYUNDAI,KOREA DEVICE REVISION DATE CODE LOT NUMBER PACKAGE ASSEMBLY SITE DS1232L C1 DL817678ABB 8 PIN SOIC CHIPPAC, KOREA 9830 PROCESS Single Poly, Single Metal 0.8 µm Standard Process JOB NO DESCRIPT Cf: 60% Ea: 0.7
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ds1232ldl817678abbp22755p22778+8j-std-020ds87520dn825394aabds87c520p23306dm8304p2271ds2165q
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TSOC 6
Abstract: P22713 P23162 dallas date code ds12887
Contextual Info: RELIABILITY MONITOR STRESS: WRITE CYCLE STRESS CONDITIONS: +85°C, 7.0 VOLTS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY DS1620 D1 SEP 98 P22710 9746 LOT NO. PACKAGE ALPHTK-BANGKOK NSEB DJ711527ABD 8PN SOIC, 208MIL READ POINT QTY FAIL 50 42
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ds1620p22710dj711527abd208mil+8j-std-020ds1232lds1233ds1267tsoc 6p22713p23162dallas date code ds12887
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DS1232L
Abstract: DS1620 C2 ti 9815
Contextual Info: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Single Metal Ti/TiN layers used on all Metals INFANT LIFE READ POINT QTY FAILS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE DS2502 C2 DM821478AIB 8 PIN SOIC STRESS:
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dm821478aibds2502p23041p23123+4dk826585aads1232lds1620 c2ti 9815
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DS2175D1
Contextual Info: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Single Poly, Single Metal Ti/TiN layers used on all Metals INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE DS2401 READ POINT QTY FAILS C2 MAR '99 P23371 9851 CARSEM DM832008AIA
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dm832008aiadk826547aads2401p23371+3p23673ds80c320ds2175d1
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