P2272
Abstract: P2274 P2147 dl817 P22770 P22522 P22328 dm803 DS2165Q
Contextual Info: RELIABILITY MONITOR DS1210S JUL '98 MONITOR - ANAM,K. DEVICE REVISION DATE CODE LOT NUMBER PACKAGE ASSEMBLY SITE DS1210S C1 9813 DN801581AAC 16 PIN SOIC ANAM-KOREA AICL PROCESS Single Poly, Single Metal 3.0 µ POCL3 reFlow (3um only); FLASH E2PROM (all other tech. numbers)
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ds1210sdn801581aacp22330p22398+14p22690p22728p22729p22730p22731p2272p2274p2147dl817p22770p22522p22328dm803ds2165q
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DS87520
Abstract: P2305 P23855
Contextual Info: RELIABILITY MONITOR DS1000M-100 JAN '99 MONITOR-HYUNDAI,CHINA DEVICE REVISION DATE CODE LOT NUMBER PACKAGE ASSEMBLY SITE DS1000 E3 DH833179ADA 8 PIN PDIP CHIPPAC, CHINA CPS 9847 PROCESS Single Poly, Single Metal 1.2 µm Standard Process JOB NO DESCRIPT Cf: 60%
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ds1000m-100ds1000dh833179adap23057+9p23178dn825394aabp23415p23306p23307j-std-020ds87520p2305p23855
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DS1620 C2
Abstract: 9814 DS1621 P22328 DS2165Q
Contextual Info: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Single Metal Ti/TiN layers u INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE DS2502 DM821478AIB 8 PIN SOIC C2 TOTALS FOR: DEC '98 P23041 9842 CARSEM 0.6 µm Double Poly, Single Metal (Ti/Ti
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dm821478aibds2502p23041ds2153q+10p23108p22556dn811539aabdn733468aabds2108ds1620 c29814ds1621p22328ds2165q
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DS87520
Abstract: dm8304 P2271 DS2165Q
Contextual Info: RELIABILITY MONITOR DS1232L OCT '98 MONITOR-HYUNDAI,KOREA DEVICE REVISION DATE CODE LOT NUMBER PACKAGE ASSEMBLY SITE DS1232L C1 DL817678ABB 8 PIN SOIC CHIPPAC, KOREA 9830 PROCESS Single Poly, Single Metal 0.8 µm Standard Process JOB NO DESCRIPT Cf: 60% Ea: 0.7
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ds1232ldl817678abbp22755p22778+8j-std-020ds87520dn825394aabds87c520p23306dm8304p2271ds2165q
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DS1232L
Abstract: DS1620 C2 ti 9815
Contextual Info: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Double Poly, Single Metal Ti/TiN layers used on all Metals INFANT LIFE READ POINT QTY FAILS MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE DS2502 C2 DM821478AIB 8 PIN SOIC STRESS:
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dm821478aibds2502p23041p23123+4dk826585aads1232lds1620 c2ti 9815
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DS2175D1
Contextual Info: RELIABILITY MONITOR PROCESS: STRESS: 0.6 µm Single Poly, Single Metal Ti/TiN layers used on all Metals INFANT LIFE MONITOR DATE ASSEMBLY PRODUCT REV DATE JOB NO CODE FACILITY LOT NO. PACKAGE DS2401 READ POINT QTY FAILS C2 MAR '99 P23371 9851 CARSEM DM832008AIA
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dm832008aiadk826547aads2401p23371+3p23673ds80c320ds2175d1
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