70MIL Search Results

EPA025A-70

Abstract: 0466 1.5 micron
Contextual Info: Excelics EPA025A-70 DATA SHEET High Efficiency Heterojunction Power FET     6 6  '  • • • NON-HERMETIC LOW COST CERAMIC 70mil PACKAGE +21.5dBm TYPICAL OUTPUT POWER 8.0dB TYPICAL POWER GAIN AT 18GHz TYPICAL 0.85dB NOISE FIGURE AND 11.0dB ASSOCIATED GAIN AT 12GHz

EFA040A-70

Abstract: PT 1132
Contextual Info: Excelics EFA040A-70 DATA SHEET Low Distortion GaAs Power FET 44 19 4 20 S S 70 D 40 NON-HERMETIC LOW COST CERAMIC 70mil PACKAGE +22.0dBm TYPICAL OUTPUT POWER 8.0dB TYPICAL POWER GAIN AT 12GHz 0.3 X 400 MICRON RECESSED “MUSHROOM” GATE Si3N4 PASSIVATION

EFA080A-70

Contextual Info: Excelics EFA080A-70 DATA SHEET Low Distortion GaAs Power FET 44 19 4 20 S S 70 D 40 NON-HERMETIC LOW COST CERAMIC 70mil PACKAGE +23.5dBm TYPICAL OUTPUT POWER 7.0 dB TYPICAL POWER GAIN AT 12GHz 0.3 X 800 MICRON RECESSED “MUSHROOM” GATE Si3N4 PASSIVATION

17-pin

Contextual Info: ZIG-ZAG IN-LINE PACKAGE 17 PIN PLASTIC ZIP-17P-M02 Lead pitch 70mil Sealing method Plastic mold 17-pin plastic ZIP ZIP-17P-M02 17-pin plastic ZIP (ZIP-17P-M02) 31.50(1.240)MAX 4.20(.165)MAX 24.00(.945) R1.80(.071) 12.00 (.472) 6.50 (.256) INDEX 1.778(.070)TYP

EPA040A-70

Abstract: igd 515 Excelics 70mil PACKAGE
Contextual Info: EPA040A-70 High Efficiency Heterojunction Power FET UPDATED 11/22/2004 FEATURES • • • • • • NON-HERMETIC LOW COST CERAMIC 70MIL PACKAGE +25.5 dBm OUTPUT POWER AT 1dB COMPRESSION 7.0 dB POWER GAIN AT 12GHz 0.3 x 800 MICRON RECESSED “MUSHROOM” GATE

Contextual Info: SHRINK DUAL IN-LINE PACKAGE 40 PIN PLASTIC DIP-40P-M03 EIAJ code : ∗SDIP040-P-0600-1 40-pin plastic SH-DIP Lead pitch 70mil Row spacing 600mil Sealing method Plastic mold DIP-40P-M03 40-pin plastic SH-DIP (DIP-40P-M03) +0.20 +.008 38.35 –0.30 1.510 –.012

JKX050S65

Abstract: JKX0-50
Contextual Info: ib : File No. s : I — 2 67 SHEET r~ 1 / 1 j 2.50 2.50 llllllllllllllllllllllll o o H CO SPECIFICATION Insulator R esistance^ OOMegohms Min Contact Resistance:70Milliohm s Max Temperature:— 4 0 'C ~ + 8 5 'C lnsulator:High Temperature Thermoplastic U L 9 4 V -0 Glass Filled

EPA080A-70

Abstract: 744 773 047
Contextual Info: Excelics EPA080A-70 DATA SHEET High Efficiency Heterojunction Power FET 44 19 4 20 S S 70 D 40 NON-HERMETIC LOW COST CERAMIC 70mil PACKAGE +25.5dBm TYPICAL OUTPUT POWER 7.0dB TYPICAL POWER GAIN AT 12GHz 0.3 X 800 MICRON RECESSED “MUSHROOM” GATE Si3N4 PASSIVATION

11-source

Abstract: maximum idss FET
Contextual Info: EPA030C-70 High Efficiency Heterojunction Power FET UPDATED 01/06/2005 FEATURES • • • • • • • NON-HERMETIC LOW COST CERAMIC 70MIL PACKAGE +22.0 dBm OUTPUT POWER AT 1dB COMPRESSION 8.0 dB POWER GAIN AT 18GHz 0.3 x 300 MICRON RECESSED “MUSHROOM” GATE

EPA040A-70

Contextual Info: Excelics EPA040A-70 DATA SHEET High Efficiency Heterojunction Power FET 44 19 4 20 S S 70 D 40 NON-HERMETIC LOW COST CERAMIC 70mil PACKAGE +23.5dBm TYPICAL OUTPUT POWER 7.0dB TYPICAL POWER GAIN AT 18GHz 0.3 X 400 MICRON RECESSED “MUSHROOM” GATE Si3N4 PASSIVATION

070-007

Abstract: SDIP028-P-0400-1 020MIN
Contextual Info: SHRINK DUAL IN-LINE PACKAGE 28 PIN PLASTIC DIP-28P-M03 EIAJ code : SDIP028-P-0400-1 28-pin plastic SH-DIP Lead pitch 70mil Row spacing 400mil Sealing method Plastic mold DIP-28P-M03 28-pin plastic SH-DIP (DIP-28P-M03) +0.20 26.00 –0.30 1.024 +.008 –.012

Contextual Info: SHRINK DUAL IN-LINE PACKAGE 64 PIN CERAMIC DIP-64C-A06 EIAJ code : SDIP064-C-0750-2 Lead pitch 70mil Row spacing 750mil Sealing method Metal seal 64-pin ceramic SH-DIP DIP-64C-A06 64-pin ceramic SH-DIP (DIP-64C-A06) 56.90±0.56 (2.240±.022) 8.89(.350) DIA

DIP-64P-M01

Abstract: SDIP064-P-0750-1 020MIN 750-mil
Contextual Info: SHRINK DUAL IN-LINE PACKAGE 64 PIN PLASTIC DIP-64P-M01 EIAJ code : SDIP064-P-0750-1 64-pin plastic SH-DIP Lead pitch 70mil Row spacing 750mil Sealing method Plastic mold DIP-64P-M01 64-pin plastic SH-DIP (DIP-64P-M01) +0.22 58.00 –0.55 +.008 2.283 –.022

SIC01

Abstract: "vlsi technology" on 5718 ICC05
Contextual Info: SIC01 SERIES 70mil 1.778mm SHRINK IC SOCKET SUMMARY As IC electronic packaging progresses towards further LSI/VLSI technology, KEL Corp. has met this challenge by developing a new 70mil Shrink IC socket. Kel has again incorporated a high reliability and quality

Shrink Zig-Zag In-line Package

Abstract: 3569
Contextual Info: SHRINK ZIG-ZAG IN-LINE PACKAGE 40 PIN PLASTIC ZIP-40P-M02 EIAJ code : SZIP040-P-0470-1 40-pin plastic SZIP Lead pitch 35mil Row spacing 70mil Sealing method Plastic mold Mounting height 70mil MAX ZIP-40P-M02 40-pin plastic SZIP (ZIP-40P-M02) +0.50 +.020

Contextual Info: GNSG70-500E GNSG70-700E GNSG70-900E GNSG70-B00E RECTRON SEMICONDUCTOR TECHNICAL SPECIFICATION STANDARD GPP CHIP - 70MIL PRODUCT SPECIFICATIONS CHIPS FOR STD GPP/SOLDERING TYPE TYPE: GNSG70 SERIES CHIP DIMENSIONS CHIP APPEARANCE 47mil 70mil GNSG70-700E GNSG70-900E

V3055

Contextual Info: EPA018B-70 High Efficiency Heterojunction Power FET ISSUED 11/01/2007 FEATURES • • • • • • • Non-Hermetic Low Cost Ceramic 70mil Package +20.0 dBm Output Power at 1dB Compression 11.0 dB Power Gain at 18GHz Typical 0.75 dB Noise Figure and 12.5 dB Associated Gain at 12GHz

EPA060B-70

Abstract: 2657 FET EPA060B
Contextual Info: Excelics EPA060B-70 DATA SHEET High Efficiency Heterojunction Power FET     6  6 * PROVIDES EXTRA HIGH POWER EFFICIENCY, AND HIGH RELIABILITY Applications • High Dynamic Range LNA • DC to 18 GHz  '  0LQ $OO /HDGV Features • NON-HERMETIC LOW COST CERAMIC 70mil PACKAGE

Excelics EPA018A

Abstract: EPA018A-70 EPA018A7 Excelics 70mil PACKAGE
Contextual Info: Excelics EPA018A-70 DATA SHEET High Efficiency Heterojunction Power FET 44 19 4 20 S S 70 D 40 • • • NON-HERMETIC LOW COST CERAMIC 70mil PACKAGE +20.0dBm TYPICAL OUTPUT POWER 11.0dB TYPICAL POWER GAIN AT 18GHz TYPICAL 0.75dB NOISE FIGURE AND 12.5dB ASSOCIATED

EFA025A-70

Contextual Info: EFA025A-70 Low Distortion GaAs Power FET UPDATED 04/28/2006 FEATURES • • • • • • • • None-Hermetic Low Cost Ceramic 70mil Package +20.0 dBm Output Power at 1dB Compression 10.0 dB Power Gain at 12GHz 7.0 dB Power Gain at 18GHz Typical 1.50 dB Noise Figure and

d480

Contextual Info: SHRINK DUAL IN-LINE PACKAGE 48 PIN PLASTIC DIP-48P-M01 EIAJ code : SDIP048-P-0600-1 48-pin plastic SH-DIP Lead pitch 70mil Row spacing 600mil Sealing method Plastic mold DIP-48P-M01 48-pin plastic SH-DIP (DIP-48P-M01) +0.20 43.69 –0.30 +.008 1.720 –.012

dip 24 dimension

Contextual Info: SHRINK DUAL IN-LINE PACKAGE 24 PIN PLASTIC DIP-24P-M05 EIAJ code : SDIP024-P-0300-1 Lead pitch 70mil Row spacing 300mil Sealing method Plastic mold 24-pin plastic SH-DIP DIP-24P-M05 24-pin plastic SH-DIP (DIP-24P-M05) +0.20 22.05 –0.30 .868 +.008 –.012

EPA018BV-70SC

Abstract: Excelics 70mil PACKAGE noise gate compression
Contextual Info: EPA018BV-70SC High Efficiency Heterojunction Power FET ISSUED 01/31/2006 FEATURES • • • • • • • None-Hermetic Low Cost Ceramic 70mil Package +20.0 dBm Output Power at 1dB Compression 11.0 dB Power Gain at 18GHz Typical 0.75 dB Noise Figure and

EFA018A-70

Abstract: EFA018A
Contextual Info: Excelics EFA018A-70 DATA SHEET Low Distortion GaAs Power FET 20 P1dB G1dB PAE NF Ga S S 70 D G All Dimensions In mils. ELECTRICAL CHARACTERISTICS Ta = 25 OC SYMBOLS 44 19 4 40 • • • NON-HERMETIC LOW COST CERAMIC 70mil PACKAGE +18.5dBm TYPICAL OUTPUT POWER