750MIL Search Results

DIP64S

Contextual Info: SANYO Semiconductor Shrink Dual In-line Package 64Pin Plastic DIP64S 750mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the

Contextual Info: SHRINK DUAL IN-LINE PACKAGE 64 PIN CERAMIC DIP-64C-A06 EIAJ code : SDIP064-C-0750-2 Lead pitch 70mil Row spacing 750mil Sealing method Metal seal 64-pin ceramic SH-DIP DIP-64C-A06 64-pin ceramic SH-DIP (DIP-64C-A06) 56.90±0.56 (2.240±.022) 8.89(.350) DIA

DIP-64P-M01

Abstract: SDIP064-P-0750-1 020MIN 750-mil
Contextual Info: SHRINK DUAL IN-LINE PACKAGE 64 PIN PLASTIC DIP-64P-M01 EIAJ code : SDIP064-P-0750-1 64-pin plastic SH-DIP Lead pitch 70mil Row spacing 750mil Sealing method Plastic mold DIP-64P-M01 64-pin plastic SH-DIP (DIP-64P-M01) +0.22 58.00 –0.55 +.008 2.283 –.022

dip64s

Abstract: 750-mil DIP-64s
Contextual Info: SANYO Semiconductor Shrink Dual In-line Package 64Pin Plastic DIP64S 750mil 外形図情報に関するご注意 三洋半導体パッケージは基本的に JEITA の名称付与規定（ED-7303A）に準じています。 ただし、従来のパッケージに用いている名称については、そのまま継続しています。

64S1B-E

Abstract: 750-mil
Contextual Info: 64S1B-E EIAJ Package Code WDIP64-C-750-1.78 Metal seal 64pin 750mil DIP Weight g JEDEC Code – 1 32 e1 33 E 64 c D L A1 A A2 Symbol z e b b1 SEATING PLANE A A1 A2 b b1 c D E e e1 L Z Dimension in Millimeters Min Nom Max – – 5.35 – – 1.0 3.8 – –

lc6554h-4958

Abstract: lc6554h-4440 LC6554H DIP64S ic 3842 datasheet LC6554D-3249 lc6554h4440 LC6554H-3842 LC6554H-4298 4557 ic
Contextual Info: Ordering number : E I 0 0 7 3 Announcement Regarding the Discontinuation of MOS IC Products Thank you for using SANYO semiconductor products. The following SANYO semiconductor products, DIP64S 750mil , have been discontinued. Please check this list carefully and contact your SANYO sales representative if you have any questions.

Contextual Info: Ordering number : E I 0 0 6 3 Announcement Regarding the Discontinuation of MOS IC Products Thank you for using SANYO semiconductor products. The following SANYO semiconductor products, DIP64S 750mil , one-time PROM writing version, have been discontinued.

750-mil

Abstract: SDIP64-P-750-1
Contextual Info: 64P4B Plastic 64pin 750mil SDIP JEDEC Code – Lead Material Alloy 42 33 1 32 E 64 e1 c EIAJ Package Code SDIP64-P-750-1.78 Weight g 7.9 Symbol A1 L A A2 D e SEATING PLANE b1 b b2 A A1 A2 b b1 b2 c D E e e1 L Dimension in Millimeters Min Nom Max – – 5.08

SDIP064-C-0750-1

Abstract: 224002-2 55118
Contextual Info: SHRINK DUAL IN-LINE PACKAGE 64 PIN CERAMIC DIP-64C-A02 EIAJ code : SDIP064-C-0750-1 Lead pitch 70mil Row spacing 750mil Sealing method Metal seal 64-pin ceramic SH-DIP DIP-64C-A02 64-pin ceramic SH-DIP (DIP-64C-A02) 56.90±0.56 (2.240±.022) R1.27(.050)

lc66506b-4582

Abstract: LC66508B-3762 LC875924A LC66508B-3918 dip64s 4A01 LC66506B-4488 LC865612A LC66508B-4135 lc6554d 3230
Contextual Info: Ordering number : E I 0 0 6 2 Announcement Regarding the Discontinuation of MOS IC Products Thank you for using SANYO semiconductor products. The following SANYO semiconductor products, DIP64S 750mil , microcontrollers /one-time PROM custom version, have been discontinued.

s - ck5t

Abstract: CA52
Contextual Info: Preliminary KMM5321200BW/BWG DRAM MODULE KMM5321200BW/BWG Fast Page Mode 1Mx32 DRAM SIM M , 1K Refresh, 5V, using 1Mx16 DRAM GENERAL DESCRIPTION FEATURES The Samsung KMM5321200BW is a 1M bit x 32 Dynam ic RAM high density m em ory module. The • Part Identification

KM416C1200AJ

Abstract: ra57
Contextual Info: DRAM MODULE KMM5321200AW/AWG KMM5321200AW/AWG Fast Page Mode 1Mx32 DRAM SIMM, 1K Refresh, 5V, using 1Mx16 DRAM G EN ER AL DESCRIPTION FEATURES The Samsung KMM5321200AW is a 1M bit x 32 Dynam ic RAM high density m em ory module. The • Part Identification

Contextual Info: User's Guide SLVU388 – August 2010 TPS62122EVM This user’s guide describes the characteristics, operation, and use of the TPS62122 evaluation module EVM . The TPS62122EVM-586 is a fully assembled and tested circuit for evaluating the performance of the TPS62122 high-input voltage step-down converter. This document includes schematic diagrams, a

TC58NVG2D4BFT00

Abstract: TH58NVG3D4BFT00 SSTL-18 TMP86FS49FG H5401 TH58NVG*D TC58DVG14B1FT00 SSTL18 th58nvg TMP86FS49UG
Contextual Info: C O N T E N T S INFORMATION 東芝半導体情報誌アイ 2004年5月号 5 VOLUME 142 四日市工場で最先端の NAND型フラッシュメモリ製造棟の建設を開始 .4 今月の新製品情報 4ギガビットNAND型フラッシュメモリ .2

1933E

Abstract: caption 1AB3 25816 bc136 BC154 CR16 mitsubishi cr64 cr65 VP1160 vp251
Contextual Info: To all our customers Regarding the change of names mentioned in the document, such as Mitsubishi Electric and Mitsubishi XX, to Renesas Technology Corp. The semiconductor operations of Hitachi and Mitsubishi Electric were transferred to Renesas Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog

VP271

Abstract: BC163 VP1167 VP250 bc136 vp230 General Electric CR104 BC150 BC101 DATASHEET vp251
Contextual Info: MITSUBISHI MICROCOMPUTERS M37280MFH–XXXSP, M37280MKH–XXXSP M37280EKSP SINGLE-CHIP 8-BIT CMOS MICROCOMPUTER with CLOSED CAPTION DECODER and ON-SCREEN DISPLAY CONTROLLER 1. DESCRIPTION The M37280MFH–XXXSP and M37280MKH-XXXSP are single-chip microcomputers designed with CMOS silicon gate technology. They

Contextual Info: CXP82700 Piggyback/ CMOS 8-bit Single Chip Microcomputer evaluator type For the availability of this product, please contact the sales office. Description The CXP82700 is a CMOS 8-bit single chip microcomputer of piggyback/evaluator combined type, which is developed for evaluating the function

Contextual Info: FUJITSU MICROELECTRONICS DATA SHEET DS07-12548-4Ea 8-bit Microcontroller CMOS F2MC-8L MB89530 Series MB89537/537C/538/538C/F538L/P538 MB89PV530 • DESCRIPTION The MB89530 series is a one-chip microcontroller featuring the F2MC-8L core supporting low-voltage and highspeed operation. Built-in peripheral functions include timers, serial interface, A/D converter, and external interrupt.

D78323LP

Abstract: IC-8314 47 16L xn cs1m MSC 5511 tj1k IRKT 132 pd78312 mcl sbl 1 t002 94-0
Contextual Info: Mos M O S In te g ra te d C irc u it PD78323,78324 1 6 / 8 f c i- y //PD78324 l ì , b • '> > 7 7 ” - — 9 ¡S'i'4f£l6 fcf -y h CPU £ \HM L tz 16/8 tf >y h • v > U —XCO l o t t o « M > S î7 ^ P D 7 3 3 2 2 d it'" * , -y 7° • f tS M "E U ^ « S r ^ ï C l M

finder timer type 15.21

Abstract: D78243 RTL 8198 POWER COMMAND HM 1211 power controler RTL 8189 finder type 81.11 ussr a51 sf hen nec uPD78220 200QH
Contextual Info: u s e r ’s m a n u a l /¿PD78244 S U B -S E R IE S 8-B IT SINGLE-CHIP MICROCOMPUTER HARDWARE 078243 / P D 7 Q a 4 4 D ocu „, No. |EU_ , 3 6 e •D. No. /EU—747p) P m t e d UbllRhed m JapanA p ril 1 994 P USSR’S MANUAL uPD78244 S U B -S E R IE S

Contextual Info: DATA SHEET MOS INTEGRATED CIRCUIT f ¿/PD78011BY, 78012BY, 78013Y, 78014Y 8-BIT SINGLE-CHIP MICROCOMPUTERS DESCRIPTION The ¿¡PD78011BY, ¿¡PD78012BY, ¿¡PD78013Y and ¿¡PD78014Y, ¿¡PD78014Y sub-series products o f the 78K/0 series, su pp ort the l2C bus control fu nctio n. These com puters incorporate various peripherals such as the serial interface

stepping motor EM 323

Abstract: PD78213 em 154* "stepping motor" ZPD78213GQ-36 d78214 10000H D7821 PD78212 1NTC0 BT 815 transistor
Contextual Info: D A TA SHEET MOS INTEGRATED CIRCUIT ¿¿PD78212, 78213, 78214 8-BIT SINGLE-CHIP MICROCOMPUTER DESCRIPTION The //PD78212,78213 and 78214 are 78K/H series products. The 78K/II series is an 8-bit single chip microcomputer which can access the memory space o f 1M byte with an external expansion.

tb41

Contextual Info: DRAM MODULE KMM5362203AW/AWG KMM5362203AW/AWG Fast Page Mode 2Mx36 DRAM SIMM, 1K Ref, 5V, using 1Mx16 DRAM and 1Mx4 QCAS DRAM GENERAL DESCRIPTION FEATURES The Samsung KMM5362203AW is a 2M bit x 36 • Part Identification Dynam ic RAM high density m em ory module. The

Contextual Info: DRAM MODULE KMM5362205C2W/C2WG 2Mx36 DRAM SIMM 1MX 16 Base, Quad CAS EDO Revision 0.0 November 1997 Rev. 0.0 (Nov. 1997) DRAM MODULE KMM5362205C2W/C2WG Revision History Version 0.0 (November 1997) • Changed module PCB from 6-Layer to 4-Layer. • Changed Module Part No. from KMM5362205CW/CWG to KMM5362205C2W/C2WG caused by PCB revision .