170BA Search Results

NM7050SA

Contextual Info: à tftftu c Crystal Bridge t o the Future N M 7050SA u t ^ s -T o • x - 7 3lg£tiU7ï[p] 4±0.1 mm 2.0 ±0.5 1,000 BmmisimmïXâîî Qty/reel cf 14_071001 _tapingj A p j f im e r Crystal Bridge t o the Future N M l 170BA ? - U T 1^3;?= • x - 7 mm glgttiUÆlgl

H5GQ4H24MFR-R2C

Abstract: H5GQ2H24AFR-R0C H5GC4H24MFR-T2C H5GQ1H24BFR-R0C H5GQ1H24BFR-T2C H5GC2H24BFR-T2C H5TQ2G63DFR-11c H5GQ2H24AFR-T2C H5TC4G63AFR-11C H5TQ2G63FFR
Contextual Info: Page 1 DENSI TY ORG. SPEED PART NUMBER PKG. FEATURE AVAI L. 1.1GHz 0.9ns H5TQ4G63AFR-N1C FBGA(96ball) 8Bank, 1.5V/ 1.5V Now 1.0GHz (1.0ns) H5TC4G63AFR-N0C FBGA(96ball) 8Bank, 1.35V/ 1.35V Now FBGA(96ball) 8Bank, 1.5V/ 1.5V Now FBGA(96ball) 8Bank, 1.35V/ 1.35V

Elpida GDDR5

Abstract: EDW2032BABG GDDR5 layout SGRAM
Contextual Info: DATA SHEET 2G bits GDDR5 SGRAM EDW2032BABG 64M words x 32 bits Specifications Features • Density: 2G bits • Organization — 4Mbit x 32 I/O x 16 banks — 8Mbit x 16 I/O x 16 banks • Package — 170-ball FBGA — Lead-free (RoHS compliant) and Halogen-free

Contextual Info: DATA SHEET 2G bits GDDR5 SGRAM EDW2032BBBG 64M words x 32 bits Specifications Features • Density: 2G bits • Organization — 4Mbit x 32 I/O x 16 banks — 8Mbit x 16 I/O x 16 banks • Package — 170-ball FBGA — Lead-free (RoHS compliant) and Halogen-free

GDDR5 pcb layout

Abstract: Elpida GDDR5 EDW2032BBBG EDW2032BBBG-60-F GDDR5 layout POD-15 EDW2032BBBG-60
Contextual Info: DATA SHEET 2G bits GDDR5 SGRAM EDW2032BBBG 64M words x 32 bits Specifications Features • Density: 2G bits • Organization — 4Mbit x 32 I/O x 16 banks — 8Mbit x 16 I/O x 16 banks • Package — 170-ball FBGA — Lead-free (RoHS compliant) and Halogen-free

EDW1032BBBG

Abstract: GDDR5 layout GDDR5 pcb layout POD-15 EDW1032BBBG-50-F Elpida GDDR5
Contextual Info: DATA SHEET 1G bits GDDR5 SGRAM EDW1032BBBG 32M words x 32 bits Specifications Features • Density: 1G bits • Organization — 2Mbit x 32 I/O x 16 banks — 4Mbit x 16 I/O x 16 banks • Package — 170-ball FBGA — Lead-free (RoHS compliant) and Halogen-free

k4g10325fe-hc04

Abstract: samsung gddr5 GDDR5 K4G10325FE K4W2G1646C K4G20325FC k4w2g1646 POD-15 K4W1G1646E gddr5 samsung
Contextual Info: Jul. 2010 Graphic Memory Product Guide SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed herein is provided on an "AS IS" basis, without warranties of any kind.

GDDR5

Abstract: GDDR5 pcb layout Elpida GDDR5 POD-15 gddr5 controller EDW1032BBBG-40-F gddr5 x16 W1032 GDDR5 layout
Contextual Info: DATA SHEET 1G bits GDDR5 SGRAM EDW1032BBBG 32M words x 32 bits Specifications Features • Density: 1G bits • Organization — 2Mbit x 32 I/O x 16 banks — 4Mbit x 16 I/O x 16 banks • Package — 170-ball FBGA — Lead-free (RoHS compliant) and Halogen-free

samsung gddr5

Abstract: GDDR5 h5gq1h24afr GDDR5 pcb layout hynix GDDR5 H5GQ1H24 GDDR5 hynix h5gq1h24afr-t2l gddr5 x16 Elpida GDDR5
Contextual Info: H5GQ1H24AFR 1Gb 32Mx32 GDDR5 SGRAM H5GQ1H24AFR This document is a general product description and is subject to change without notice. Hynix Semiconductor does not assume any responsability for use of circuits described. No patent licenses are implied. Rev. 1.0 /Nov. 2009

EDW1032BABG

Abstract: GDDR5 pcb layout Elpida GDDR5 EDW10 GDDR5
Contextual Info: DATA SHEET 1G bits GDDR5 SGRAM EDW1032BABG 32M words x 32 bits Specifications Features • Density: 1G bits • Organization — 2Mbit x 32 I/O x 16 banks — 4Mbit x 16 I/O x 16 banks • Package — 170-ball FBGA — Lead-free (RoHS compliant) and Halogen-free

Elpida GDDR5

Abstract: GDDR5
Contextual Info: DATA SHEET 2G bits GDDR5 SGRAM EDW2032BBBG 64M words x 32 bits Specifications Features • Density: 2G bits • Organization — 4Mbit x 32 I/O x 16 banks — 8Mbit x 16 I/O x 16 banks • Package — 170-ball FBGA — Lead-free (RoHS compliant) and Halogen-free

HY5PS1G1631CFP

Abstract: H5PS5162 h5ps5162ffr HY5PS1G1631C hy5rs123235b hy5ps121621cfp-25 HY5PS121621C-FP25 HY5PS1G1631 HY5RS123235BFP-14 hy5ps561621b
Contextual Info: Q2’ 2008 Short Form Catalog Part Number System Change Notice Back ground – Effective from September, 2007, a more concise part numbering system is utilized by Hynix with the intention of managing product line with more consistency Target Product – Devices developed after 2007-09-01 and their

H5TQ2G63BFR-H9C

Abstract: H5TQ1G83BFR-H9C H26M42001EFR H5RS1H23MFR h27u1g8f2b H27U1G8F2 H27UBG8T2A H27UBG8T H5MS2G22MFR-J3M H26M54001BKR
Contextual Info: Rev 0.0 Q2’2010 Databook C omputing Memory DDR3 SDRAM : Component VDD DENSITY ORG. SPEED PART NUMBER PKG. FEATURE AVAIL. 1.5V 1Gb 256Mx4 DDR3 1333 H5TQ1G43BFR-H9C FBGA 78ball 8Bank, 1.5V, CL9,9-9-9 Now H5TQ1G43TFR-H9C FBGA(78ball) 8Bank, 1.5V, CL9,9-9-9

K4G41325FC

Abstract: K4G41325F samsung GDDR5 K4G10325FG-HC03 gddr5 samsung K4W4G1646 256MX16 K4G20325FD
Contextual Info: Nov. 2012 Graphic Memory Product Guide SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed herein is provided on an "AS IS" basis, without warranties of any kind.

EDW4032BABG

Abstract: GDDR5 layout GDDR5 Elpida GDDR5
Contextual Info: PRELIMINARY DATA SHEET 4G bits GDDR5 SGRAM EDW4032BABG 128M words x 32 bits Specifications Features • Density: 4G bits • Organization — 8Mbit x 32 I/O x 16 banks — 16Mbit x 16 I/O x 16 banks • Package — 170-ball FBGA — Lead-free (RoHS compliant) and Halogen-free

EDW1032BABG

Abstract: GDDR5 Elpida GDDR5 EDW1032BABG-50-F GDDR5 pcb layout GDDR5 layout pre-charge EDW1032BABG-40-F E1597E11 170ball
Contextual Info: PRELIMINARY DATA SHEET 1G bits GDDR5 SGRAM EDW1032BABG 32M words x 32 bits Specifications Features • Density: 1G bits • Organization — 2Mbit x 32 I/O x 16 banks — 4Mbit x 16 I/O x 16 banks • Package — 170-ball FBGA — Lead-free (RoHS compliant) and Halogen-free