160P6 Search Results

QFP160-P-2828-0

Abstract: 160P6C 160-PIN 160P6-C
Contextual Info: 160P6-C Plastic 160pin 28✕28mm body QFP EIAJ Package Code QFP160-P-2828-0.65 Weight g 4.61 JEDEC Code – Lead Material Alloy 42 MD e HD 121 b2 160 ME D 1 120 I2 Recommended Mount Pad HE E Symbol 81 40 80 A L1 e y b F A1 c A2 41 L Detail F A A1 A2 b c D

QFP160-P-2828-0

Contextual Info: 160P6-A Plastic 160pin 28✕28mm body QFP EIAJ Package Code QFP160-P-2828-0.65 Weight g 4.61 JEDEC Code – Lead Material Alloy 42 MD e HD 121 b2 160 ME D 1 120 I2 Recommended Mount Pad HE E Symbol A A1 A2 b c D E e HD HE L L1 y 81 40 80 A L1 c A2 41 y b

L142

Abstract: M095-51 M095-37 M095-14B M095-45 M095-06 M095-29 M095-23B m095
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGING MATERIAL, TREATMENT AND OUTLINE DRAWINGS 4.2 TRAYS 1 TRAYS M095(MATERIAL : M095-01~06 : PS COMPOUND) M095-14B~ : PP COMPOUND W : 152.6 MITSUBISHI M095-40 ZW eW NW 160P6E-A HEAT PROOF L : 300.0 H ZL eL NL Pocket Pitch(mm)

QFP160-P-2828-0

Abstract: 160-PIN
Contextual Info: 160P6F-E Weight g JEDEC Code – Lead Material Cu Alloy MD e EIAJ Package Code QFP160-P-2828-0.65 Plastic 160pin 28✕28mm body QFP HD 160 b2 ME D 121 1 120 l2 40 Symbol HE E Recommended Mount Pad A A1 A2 b c D E e HD HE L L1 y 81 41 80 A L1 e y b A1 c A2

M38881M2XXXFP

Abstract: M38881M2 M38802M2 M37510 176P6D M37690E8-XXXFP M38881M2XXXGP 80P6S-A m38813m4 m38802e2
Contextual Info: B uilt-in LCD driver type Memory type Memory size byte 20K One time PROM Mask ROM 32K One time PROM OnetimePROM Mask ROM OnelimePROM Type I*». Package ROM RAM Mask ROM Mask ROM # 24K 60K M37500M5-XXXFP 160P6E-A M37500M5-XXXGP 176P6D M37500E5-XXXFP M37500E5-XXXGP

QFP160-P-2424-0

Abstract: QFP160
Contextual Info: 160P6E-A Plastic 160pin 24✕24mm body QFP Weight g 3.39 JEDEC Code – Lead Material Alloy 42 MD e EIAJ Package Code QFP160-P-2424-0.50 160 b2 ME HD D 121 1 120 I2 HE E Recommended Mount Pad Symbol 81 40 41 80 A L1 F A1 c A2 e b y L Detail F A A1 A2 b c

M37760

Abstract: PROM 32pin r4944 R4944A free circuit diagram of rom pdf download R4945 PCA7477G-100 PCA7477G-160 R4945A OSD ic
Contextual Info: PCA7477G-100 PCA7477G-160 PROM Programming Adapters for M37760FFAGP/M37760FFAGP-160 User's Manual Rev. 1.00 July 1, 2003 REJ10J0178-0100Z * R4944A, R4945 and R4945A are trademarks of Advantest Corporation. Keep safety first in your circuit designs! • Renesas Technology Corporation and Renesas Solutions Corporation put the maximum effort into making semiconductor products better

432W6

Abstract: 48P4B hssop 44P3W-R 28P0 5P5T tsop 2-54 42P9R 70P3S-M 479F7G
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES LIST OF PACKAGE CODES CLASSIFIED ACCORDING TO PIN NUMBER 1. LIST OF PACKAGE CODES CLASSIFIED ACCORIDING TO PIN NUMBER Pin Count Structure Type Lead Pitch mm 5 P P P P P P C C P P P C P P P P P P P P C P P P P P P P

100MHZ

Abstract: IC PACKAGE ELECTRICAL CHARACTERISTIC LCR 24p2n-a 136P6S-C
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES IC PACKAGE ELECTRICAL CHARACTERISTIC 6.2 IC PACKAGE ELECTRICAL CHARACTERISTICS Tables 1, 2 and 3 show electrical characteristics of packages of various types. They are called LCR values, which include Ls, Lm, Co, Cm,

M37500M8

Contextual Info: MITSUBISHI MICROCOMPUTERS 7500 Group SINGLE-CHIP 8-B IT CMOS MICROCOMPUTER DESCRIPTION • 2 C lo c k gen e ra tin g circuit T h e 7 5 0 0 group is th e 8 -b it m icro com puter b a s e d on the C o n n e c t to external c era m ic resonator or quartz-crystal

m5931

Abstract: 44P6N 64105P 36P2H JBIG DECODER 160P6-C
Contextual Info: • A U T O M O B IL E /IN D U S T R IA L LAN Typical electrical characteristics Application Type No. Function ,!cc, mA Package outline Remarks 41.6Kbps/125Kbps PWM CSMA./CD LAN Transmission controller for general industry machine M 64105P LAN Transm ission

78Lxx voltage regulator

Abstract: M5N317L 78xx voltage regulator M51204 regulator 78xx series m5n317 M64500AFP M5237ML M5233 M5237L
Contextual Info: •DISPLAY CONTROLLER - — i ? Type No. Circuit function ! Supply ! voltage : ! M3S000AFP CRT & Color/Monochrome Flat Panel Control M64513AFP Interface for AX System with M64500AFP M64542FP Navigation Graphic Controller * M64545FP EI Typical electrical characteristics

48P4B

Abstract: P/N146071 hssop 432W6 70P3S-M 10C2-C 136P6S-C 20P5A
Contextual Info: 3. DETAILED DIAGRAM OF PACKAGE OUTLINES LIST OF PACKAGE CODES CLASSIFIED ACCORIDING TO PACKAGE TYPE Pin Count Structure 5 8 8 10 12 9 12 12 14 16 20 24 8 14 16 18 18 20 20 22 22 24 24 24 24 28 28 28 30 32 32 32 40 42 20 28 30 32 36 40 42 48 52 64 P P P P P

Contextual Info: MITSUBISHI IN TE G R A TE D CIRCUIT M65790FP F BTC IM A G E DATA DESCRIPTION M 65790FP F ix e d • is a p p l i e d c o m p re s s io n and le n g th C O M PR ES SIO N Easy M its u b is h i o r ig in a l im a g e d a ta d e c o m p re s s io n B lo c k T r u n c a t io n

160-pin renesas

Contextual Info: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid

M31010M6-XXXHP

Abstract: M33210AFP-20 m31002s2hp 32-Bit Microcomputers M31000S2FP 5kpa M31010 31002S2HP 160P6-C 30600E8-XXXFP
Contextual Info: ♦M16C Family M I 6 C / 6 0 group # Memory size Memory type byte Package Type No. ROM RAM Mask ROM O ne time PROM 64K - 100P6S-A M30600M8-XXXGP 100P6Q-A 10K M 30600E8-XXXFP EPRO M External ROM M30600M8-XXXFP 10K M16C./61 g rou p (S IM -c o m p a tib le se ria l I/O built in)

M60073

Abstract: M60084l M6008 4000 series CMOS Logic ICs "gate count" m60074 CMOS GATE ARRAYs mitsubishi 132X132
Contextual Info: ASIC Custom Semi-Custom A S S P - AV Sound Processor Audio TV VCR Peripherals Disk Drive SCSI OA Printer PPC FAX Communication Telephone Mobile Communication LAN Car/lndustriai LAN Automobile Multi-Media Image Compression/Decompression Display controller

MF202

Abstract: leadframe materials QFP PACKAGE thermal resistance POWER QFP MITSUBISHI INTEGRATED CIRCUIT PACKAGES
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE THERMAL RESISTANCE 5.2 HEAT DISSIPATION CHARACTERISTICS OF IC PACKAGE Figure 4 shows measured thermal resistance values of 16-pin plastic DIPs employing various lead-frame materials including 42 Alloy IronNickel alloy , phosphor bronze, #MF202 copper alloy, and copper-tin alloy. Except for the lead-frame material, all other factors were identical

10C2

Abstract: 144PFB-A 48P4B 16P2S-A 240mil hssop Package tray dimension 12P9 16P2Z-A 18P4G
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE SPECIFICATIONS 3.1 INDIVIDUAL PACKS Each type of package is used to carry individually packed products as listed below: PACKAGE AND INDIVIDUAL PACK LIST Package Type SIP HSIP ZIP DIP SDIP Package Name Standard Dimension

324pc

Abstract: L198 L-088 930PC 12P9B 300mil trays 4028PC L199 SP080 pt881
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE SPECIFICATIONS 3.2 PACKAGE AND CARTON SERIAL NUMBER AND STANDARD CAPACITY TUBES STANDARD PACKAGING 240mil Individual Pack Qty/Individual Tube No. Pack ( ) 45 SP050PC 340mil SP070PC Package Type Package Name Standard Dimension

m37500

Abstract: M37500M5 M37500M8 M37500E8FP
Contextual Info: MITSUBISHI M ICROCOM PUTERS 7500 Group SINGLE-CHIP 8-BIT CM O S M ICR O CO M P U TER DESCRIPTION • 2 C lock ge nera ting circu it The 7500 group is the 8 -b it m icro com p uter based on the C o n n e ct to external ceram ic resonator or quartz-crystal