LQFP128
Abstract: LQFP128-P-1420-0
Contextual Info: 128P6D-D Plastic 128pin 14✕20mm body LQFP EIAJ Package Code LQFP128-P-1420-0.50 Weight g MD e JEDEC Code – Lead Material Cu Alloy HD 128 102 b2 103 ME D 1 l2 Symbol HE E Recommended Mount Pad 38 65 64 39 A L1 F b y A1 c A2 e L Detail F A A1 A2 b c D E
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128p6d-d128pinlqfp128-p-1420-0lqfp128 |
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LQFP128
Abstract: LQFP128-P-1420-0 128P6D-A D1102
Contextual Info: 128P6D-A Plastic 128pin 14✕20mm body LQFP EIAJ Package Code LQFP128-P-1420-0.50 Weight g 0.85 Lead Material Alloy 42 MD e JEDEC Code – HD 103 b2 128 ME D 1 102 I2 E HE Recommended Mount Pad Symbol 65 38 39 64 L1 A F A1 c A2 e b y L Detail F A A1 A2 b
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128p6d-a128pinlqfp128-p-1420-0lqfp128+1d1102
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LQFP128
Abstract: LQFP128-P-1420-0
Contextual Info: 128P6D-C Plastic 128pin 14✕20mm body LQFP EIAJ Package Code LQFP128-P-1420-0.50 Weight g Lead Material Cu Alloy MD e JEDEC Code – HD b2 128 103 1 ME D 102 l2 HE D Recommended Mount Pad Symbol 65 38 39 64 A L1 F b A1 c A2 e y L Detail F A A1 A2 b c D E
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128p6d-c128pinlqfp128-p-1420-0lqfp128 |
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432W6
Abstract: 48P4B hssop 44P3W-R 28P0 5P5T tsop 2-54 42P9R 70P3S-M 479F7G
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES LIST OF PACKAGE CODES CLASSIFIED ACCORDING TO PIN NUMBER 1. LIST OF PACKAGE CODES CLASSIFIED ACCORIDING TO PIN NUMBER Pin Count Structure Type Lead Pitch mm 5 P P P P P P C C P P P C P P P P P P P P C P P P P P P P
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240k6x-a240p6y-a240p6z-a255f7f+16256f7b256f7x-a/b256p6j-e256p6k-e272f7x-a/b281s8-c432w648p4bhssop44p3w-r28p05p5ttsop 2-5442p9r70p3s-m479f7g
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100MHZ
Abstract: IC PACKAGE ELECTRICAL CHARACTERISTIC LCR 24p2n-a 136P6S-C
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES IC PACKAGE ELECTRICAL CHARACTERISTIC 6.2 IC PACKAGE ELECTRICAL CHARACTERISTICS Tables 1, 2 and 3 show electrical characteristics of packages of various types. They are called LCR values, which include Ls, Lm, Co, Cm,
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136p6s-c100p6s-c80p6n-c208p6y-a+664p6n-b160p6e-a44p6n-b100mhzic package electrical characteristic lcr24p2n-a
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M5M410092AFP-13
Abstract: M5M410092BRF-10 16SRAM 100P6S M5M4V4169CTP-15 m5m410092
Contextual Info: 3 »jam w jiiM ^Kiaaw iaw •CACHED DYNAMIC RAMs Classification Memory capacity 4M Memory Configuration 256KX 16DRAM IKX16SRAM Cached Dynamic RAM 16M 1MX16DRAM 1K X 16SRAM Min. Cycle time fisi ■ Typ. power dissipation (mW - Package Outline Type No. 10
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m5m4v4169ctp-10m5m4v4169ctp-12m5m4v4169ctp-15m5m4v16169tp-10+670p3s-lm5m410092afp-13m5m410092brf-1016sram100p6sm5m410092
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M54630P
Abstract: M54630 n type laser diode APC RS 800 m5463 66515FP M54977 54975P M66515FP 16P2N
Contextual Info: lAPPLICATION SPECIFIC IC CONTINUED Function Tyjse No. Packase Outiire WttfKXM Features • U sag e /F ie ld • Includes self APC c irc u it N -type Laser diode d rive r with M 66515FP self APC function 20P 2N -A H igh speed Bip • H igh-speed sw itching 40M bps
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66515fpm66rks54972pm54974p+1454975pm54977ps4992p/fp54992ap54995pm56620apm54630pm54630n type laser diodeapc rs 800m5463m54977m66515fp16p2n
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M65826
Abstract: cd-rom ic signal 128P6D-A M65826FP
Contextual Info: y MITSUBISHI SOUND PROCESSOR ICs M65826FP SINGLE CHIP CD-ROM DECODER DESCRIPTION The M65826FP is a single chip CD-ROM Decoder using CMOS technology. CD-DA Digital Signal Processor {DSP , CD-ROM Decoder and ATAPI. This IC can be used in CD-ROM, CD-I and Video CD.
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m65826fp128p6d-am65826cd-rom ic signal |
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78Lxx voltage regulator
Abstract: M5N317L 78xx voltage regulator M51204 regulator 78xx series m5n317 M64500AFP M5237ML M5233 M5237L
Contextual Info: •DISPLAY CONTROLLER - — i ? Type No. Circuit function ! Supply ! voltage : ! M3S000AFP CRT & Color/Monochrome Flat Panel Control M64513AFP Interface for AX System with M64500AFP M64542FP Navigation Graphic Controller * M64545FP EI Typical electrical characteristics
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m3s000afpm64513afpm64542fpm64545fp+15m64500afp160p6160p6c128p6d5i203tl/fpm51204tl/fp78lxx voltage regulatorm5n317l78xx voltage regulatorm51204regulator 78xx seriesm5n317m5237mlm5233m5237l
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TSOP 48 thermal resistance
Abstract: TSOP 66 Package thermal resistance QFP PACKAGE thermal resistance TSOP 66 thermal resistance thermal resistance standards C8866 TSOP 54 thermal resistance 80p6n TSOP 66 Package 28P2V
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE THERMAL RESISTANCE 5.4 IC PACKAGE THERMAL RESISTANCE Table 2 shows the thermal resistance of representative IC packages. The symbol θja refers to thermal resistance from the chip to the air. Thermal resistance may differ depending on the size of chips in the package. Refer to appendices to our product delivery standards.
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300mil64p4b16p2p20p2n+13375mil28p2v26p3d400miltsop 48 thermal resistancetsop 66 package thermal resistanceqfp package thermal resistancetsop 66 thermal resistancethermal resistance standardsc8866tsop 54 thermal resistance80p6ntsop 66 package
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48P4B
Abstract: P/N146071 hssop 432W6 70P3S-M 10C2-C 136P6S-C 20P5A
Contextual Info: 3. DETAILED DIAGRAM OF PACKAGE OUTLINES LIST OF PACKAGE CODES CLASSIFIED ACCORIDING TO PACKAGE TYPE Pin Count Structure 5 8 8 10 12 9 12 12 14 16 20 24 8 14 16 18 18 20 20 22 22 24 24 24 24 28 28 28 30 32 32 32 40 42 20 28 30 32 36 40 42 48 52 64 P P P P P
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240k6x-a30s1b42s1b-a52s1b-b+1464s1b-e124s8135s8-f145s8149s8177s848p4bp/n146071hssop432w670p3s-m10c2-c136p6s-c20p5a
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8 BIT ALU IC
Contextual Info: MITSUBISHI LSIs M 5 M 4 1 0 0 9 2 A F P ,R F -1 0 ,-1 3 3D-RAM 10485760-BIT 327680-WQRD BY 32-BIT FRAME BUFFER MEMORY DESCRIPTION • Second-generation, 0.5 The M 5M 410092A FP.R F is a 10M-bit frame buffer memory which • 128-pin, plastic QFP integrates a 327680-word by 32-bit dynamic RAM array, 2048-bit
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10485760-bit327680-wqrd32-bit10092a+610m-bit128-pin327680-word2048-bit640-bit8 bit alu ic
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10C2
Abstract: 144PFB-A 48P4B 16P2S-A 240mil hssop Package tray dimension 12P9 16P2Z-A 18P4G
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE SPECIFICATIONS 3.1 INDIVIDUAL PACKS Each type of package is used to carry individually packed products as listed below: PACKAGE AND INDIVIDUAL PACK LIST Package Type SIP HSIP ZIP DIP SDIP Package Name Standard Dimension
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12p9b14p5a16p5a20p5a+1524p5a18p4g20p4g22p4h24p4d24p4y10c2144pfb-a48p4b16p2s-a240milhssoppackage tray dimension12p916p2z-a
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324pc
Abstract: L198 L-088 930PC 12P9B 300mil trays 4028PC L199 SP080 pt881
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE SPECIFICATIONS 3.2 PACKAGE AND CARTON SERIAL NUMBER AND STANDARD CAPACITY TUBES STANDARD PACKAGING 240mil Individual Pack Qty/Individual Tube No. Pack ( ) 45 SP050PC 340mil SP070PC Package Type Package Name Standard Dimension
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240milsp050pc340milsp070pc+15440mil12p9b14p5a16p5a20p5a24p5a324pcl198l-088930pc300mil trays4028pcl199sp080pt881
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