375MIL Search Results

HSOP24

Abstract: HSOP-24
Contextual Info: SANYO Semiconductor Small Outline Package with Heat Sink 24Pin Plastic HSOP24 375mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the

Contextual Info: SMALL OUTLINE L-LEADED PACKAGE 16 PIN PLASTIC FPT-16P-M03 EIAJ code : ∗SOP016-P-0375-1 16-pin plastic SOP Lead pitch 50mil Nominal dimensions 375mil Standard Conforms with EIAJ:TYPE III Lead shape Gullwing Sealing method Plastic mold FPT-16P-M03 16-pin plastic SOP

Contextual Info: SMALL OUTLINE L-LEADED PACKAGE 24 PIN PLASTIC FPT-24P-M02 EIAJ code : ∗SOP024-P-0375-1 24-pin plastic SOP Lead pitch 50mil Nominal dimensions 375mil Standard Conforms with EIAJ:TYPE III Lead shape Gullwing Sealing method Plastic mold FPT-24P-M02 24-pin plastic SOP

Contextual Info: SMALL OUTLINE L-LEADED PACKAGE 20 PIN PLASTIC FPT-20P-M05 EIAJ code : ∗SOP020-P-0375-2 20-pin plastic SOP Lead pitch 50mil Nominal dimensions 375mil Standard Conforms with EIAJ:TYPE III Lead shape Gullwing Sealing method Plastic mold FPT-20P-M05 20-pin plastic SOP

MFP36SLF

Contextual Info: SANYO Semiconductor Shrink Small Outline Package 36Pin Plastic MFP36SLF 375mil 外形図情報に関するご注意 三洋半導体パッケージは基本的に JEITA の名称付与規定（ED-7303A）に準じています。 ただし、従来のパッケージに用いている名称については、そのまま継続しています。

HSOP28HC

Contextual Info: SANYO Semiconductor Small Outline Package with Heat Sink 28Pin Plastic HSOP28HC 375mil 外形図情報に関するご注意 三洋半導体パッケージは基本的に JEITA の名称付与規定（ED-7303A）に準じています。 ただし、従来のパッケージに用いている名称については、そのまま継続しています。

Contextual Info: SANYO Semiconductor Shrink Small Dutline Package with Heat Sink 48Pin Plastic HSSOP48 375mil 外形図情報に関するご注意 三洋半導体パッケージは基本的に JEITA の名称付与規定（ED-7303A）に準じています。 ただし、従来のパッケージに用いている名称については、そのまま継続しています。

MS-013-AA

Abstract: SOP-16P 16P2V-A
Contextual Info: 16P2V-A Plastic 16pin 375mil SOP EIAJ Package Code SOP16-P-375-1.27 JEDEC Code MS-013AA Weight g 0.4 Lead Material Cu Alloy e b2 9 E Recommended Mount Pad 8 1 Symbol F A D A2 A1 b y L e L1 HE e1 I2 16 c Detail F A A1 A2 b c D E e HE L L1 y b2 e1 I2 Dimension in Millimeters

Contextual Info: SANYO Semiconductor Small Outline Package 28Pin Plastic MFP28 375mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the

codes

Contextual Info: SANYO Semiconductor Shrink Small Outline Package 36Pin Plastic MFP36SLF 375mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the

MFP24

Contextual Info: SANYO Semiconductor Small Outline Package 24Pin Plastic MFP24 375mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the

MFP30S

Contextual Info: SANYO Semiconductor Shrink Small Outline Package 30Pin Plastic MFP30SDJ 375mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the

Contextual Info: SANYO Semiconductor Shrink Small Dutline Package with Heat Sink 48Pin Plastic HSSOP48R 375mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the

Contextual Info: SANYO Semiconductor Shrink Small Outline Package 36Pin Plastic MFP36SD 375mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the

HSOP36

Abstract: HSOP36R
Contextual Info: SANYO Semiconductor Small Outline Package with Heat Sink 36Pin Plastic HSOP36R 375mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the

HSOP28H

Contextual Info: SANYO Semiconductor Small Outline Package with Heat Sink 28Pin Plastic HSOP28H 375mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the

MFP30S

Contextual Info: SANYO Semiconductor Shrink Small Outline Package 30Pin Plastic MFP30S 375mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the

Contextual Info: SMALL OUTLINE L-LEADED PACKAGE 20 PIN PLASTIC FPT-20P-M02 EIAJ code : ∗SOP020-P-0375-1 20-pin plastic SOP Lead pitch 50mil Nominal dimensions 375mil Standard Conforms with EIAJ:TYPE III Lead shape Gullwing Sealing method Plastic mold FPT-20P-M02 20-pin plastic SOP

Contextual Info: 24P2U-A Plastic 24pin 375mil SSOP EIAJ Package Code SSOP24-P-375-0.80 Weight g 0.4 JEDEC Code – Lead Material Cu Alloy e I2 13 E Recommended Mount Pad F Symbol 12 1 A A2 A1 D e y L L1 HE e1 24 b2 b c Detail F A A1 A2 b c D E e HE L L1 y b2 e1 I2 Dimension in Millimeters

14AD

Abstract: 28P2V SOP28 package SOP28-P-375-1 MS-013-AE
Contextual Info: 28P2V-A Plastic 28pin 375mil SOP EIAJ Package Code SOP28-P-375-1.27 JEDEC Code MS-013AE Weight g 0.67 Lead Material Cu Alloy e 15 E Recommended Mount Pad 1 Symbol F 14 A D A2 A1 b y L e L1 HE e1 I2 28 b2 A A1 A2 b c D E e HE L L1 y c Detail F b2 e1 I2 Dimension in Millimeters

MFP24D

Contextual Info: SANYO Semiconductor Small Outline Package 24Pin Plastic MFP24D 375mil 外形図情報に関するご注意 三洋半導体パッケージは基本的に JEITA の名称付与規定（ED-7303A）に準じています。 ただし、従来のパッケージに用いている名称については、そのまま継続しています。

Contextual Info: SANYO Semiconductor Shrink Small Outline Package 30Pin Plastic MFP30SD 375mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the names

JEDEC TRAY DIMENSIONS ssop

Abstract: SOP JEDEC tray
Contextual Info: UNIT : mm PPE 7 HEAT PROOF NEC 135°C MAX. 10.3 105.0 15.00 15.45 375mil48p SSOP A' 15.75 22.00 14.50 286.0 315.0 322.6 SECTION A – A' 5.27 (6.35) 15.75 7.62 135.9 8x14=112 A Applied Package Quantity (pcs) 48-pin • Plastic Shrink SOP (375mil)(1.7mm thick)

MS-013AC

Abstract: SOP20 Package SOP20-P-375-1 20P2V-A
Contextual Info: 20P2V-A Plastic 20pin 375mil SOP EIAJ Package Code SOP20-P-375-1.27 JEDEC Code MS-013AC Weight g 0.48 Lead Material Cu Alloy e 11 E Recommended Mount Pad 1 10 Symbol F A D A2 A1 b y L e L1 HE e1 I2 20 b2 c Detail F A A1 A2 b c D E e HE L L1 y b2 e1 I2 Dimension in Millimeters