30PIN Search Results

TSSOP30

Contextual Info: SANYO Semiconductor Thin Shrink Small Outline Package 30Pin Plastic TSSOP30 275mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the

Contextual Info: INTEGRATED TO SH IB A CIRCUIT TECHNICAL TOSHIBA BIPOLAR LINEAR INTEGRATED CIRCUIT DATA TA8776N SILICON MONOLITHIC SURROUND PROCESSOR FOR A CTV TA8776N is a surround processor controlled l2C bus. It incorporates following functions on a 30pin dual-in-line shrink-type plastic package.

30P4

Abstract: DIP30-P-600-2
Contextual Info: 30P4 Plastic 30pin 600mil DIP EIAJ Package Code DIP30-P-600-2.54 Weight g 4.1 Lead Material Cu Alloy 16 1 15 E 30 e1 c JEDEC Code – Symbol A A2 D L A1 SEATING PLANE e b1 b b2 A A1 A2 b b1 b2 c D E e e1 L Dimension in Millimeters Min Nom Max – – 5.5

DIP30SD

Abstract: DIP-30SD
Contextual Info: SANYO Semiconductor Shrink Dual In-line Package 30Pin Plastic DIP30SD 400mil 外形図情報に関するご注意 三洋半導体パッケージは基本的に JEITA の名称付与規定（ED-7303A）に準じています。 ただし、従来のパッケージに用いている名称については、そのまま継続しています。

TA8776N

Abstract: philips sub woofer circuit diagram circuit diagram "dolby digital stereo" sub woofer circuit i2c bass volume balance hall
Contextual Info: TA8776N TOSHIBA BIPOLAR LINEAR INTEGRATED CIRCUIT SILICON MONOLITHIC TA8776N SURROUND PROCESSOR FOR A CTV TA8776N is a surround processor controlled I2C bus. It incorporates following functions on a 30pin dual-in-line shrink-type plastic package. FEATURES

traffic light controller

Abstract: BM1040R0A TLCS-870 TMP86CH12MG
Contextual Info: July 2007 TLCS-870 Family TLCS-870/C Series 30pin TMP86CH12MG 8-bit microcontroller in small-sized package suitable for inverter-type lights and IH appliances TLCS-870/C CPU Core •Operating voltage: 2.7 to 5.5 V ·Minimum instruction execution time: 250 ns at 16 MHz / 4.5 to 5.5 V

Contextual Info: 30S1B Metal seal 30pin 400mil DIP EIAJ Package Code WDIP30-C-400-1.78 Weight g JEDEC Code – 1 15 e1 16 E 30 c D L A1 A A2 Symbol z e b b1 SEATING PLANE A A1 A2 b b1 c D E e e1 L Z Dimension in Millimeters Min Nom Max – – 4.75 – – 0.72 3.53 – –

e50p

Abstract: DCE37PT
Contextual Info: D-subm iniature M etal Shell W ire W rap Basic D Series • Reliable wire wrap termination. • Two contact lengths: .375" or .585". • .025” square contact tails. Cinch Materials • Contact Material: Copper alloy machined . • Contact Plating: Gold flash or 30pin. gold. All over nickel.

Contextual Info: SANYO Semiconductor Zigzag In-line Package 30Pin Plastic SIP30Z Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations ED-7303A , which stipulate the names and codes for integrated circuit packages. However, the

Contextual Info: SANYO Semiconductor Shrink Dual In-line Package 30Pin Plastic DIP30SDLF 400mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the

MFP30S

Contextual Info: SANYO Semiconductor Shrink Small Outline Package 30Pin Plastic MFP30SDJ 375mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the

SSOP30

Abstract: SSOP30 package
Contextual Info: SANYO Semiconductor Shrink Small Outline Package 30Pin Plastic SSOP30 275mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the

MFP30S

Contextual Info: SANYO Semiconductor Shrink Small Outline Package 30Pin Plastic MFP30S 375mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the

toshiba ctv circuit diagram

Abstract: dolby bass circuit TA8776N philips sub woofer circuit diagram surround processor 254TYP sorround sound processor ic Ic surround 1996090 super treble diagram
Contextual Info: INTEGRATED TO SH IB A CIRCUIT TECHNICAL TOSHIBA BIPOLAR LINEAR INTEGRATED CIRCUIT DATA TA8776N SILICON MONOLITHIC SURROUND PROCESSOR FOR A CTV TA8776N is a surround processor controlled l2C bus. It incorporates following functions on a 30pin dual-in-line shrink-type plastic package.

Contextual Info: QB-144-CA-01's pin header cover for 78K0/KB2 30pin MC package CP1 CP2 CP3 CP4 GND N.C. N.C. 20 19 18 N.C. N.C. N.C. N.C. 17 16 N.C. N.C. N.C. N.C. N.C. N.C. N.C. N.C. N.C. N.C. N.C. 15 N.C. N.C. 14 13 N.C. 12 N.C. 11 10 9 8 7 N.C. N.C. GND GND 78K0/KB2 30pinMC

dip switch ece

Abstract: cs359
Contextual Info: I 3*427555 DD4T150 AIT • NECE N E C -DATA S H E E T . . BIPOLAR ANALOG INTEGRATED CIRCUIT ; E E C T R O N D E V IC E *’»> .» 4, . - »V -, it / / P C I 8 2 0 ' ; * ._t7 .7 ,.^ ?' COLOR TV/VTR PLL IF SIGNAL PROCESSING 1C The /¿PC1820 is a semiconductor integrated circuit for processing the color T V / V T R P IF / S IF signals. T his 1C is housed in a 30pin shrink dual-in-line package (D IP . Its main features are supported by the built-in keyed-pulse generator circuit needed for

Contextual Info: 30P4B Plastic 30pin 400mil SDIP JEDEC Code – Weight g 2.2 Lead Material Alloy 42 16 1 15 E 30 e1 c EIAJ Package Code SDIP30-P-400-1.78 D L A1 A A2 Symbol b1 SEATING PLANE b e A A1 A2 b b1 c D E e e1 L Dimension in Millimeters Min Nom Max – – 5.08 0.51

TLCS-870

Abstract: TMP86C408DMG TMP86C408NG TMP86C808DMG TMP86C808NG TMP86P808DMG TMP86P808NG
Contextual Info: July 2007 TLCS-870 Family TLCS-870/C Series TMP86C408DMG/NG TMP86P808DMG/NG TM86C808DMG/NG 30pin 8-bit microcontrollers with two serial interfaces in small-sized package TLCS-870/C CPU Core •Operating voltage: 2.7 to 5.5 V ·Minimum instruction execution time

TLCS-870

Abstract: TMP86C408DMG TMP86C408NG TMP86C808DMG TMP86C808NG TMP86P808DMG TMP86P808NG
Contextual Info: July 2007 TLCS-870 Family TLCS-870/C Series 30pin TMP86F808DMG/NG 8-bit microcontroller with flash memory and two serial interfaces in small-sized package TLCS-870/C CPU Core •Operating voltage: 2.7 to 5.5 V ·Minimum instruction execution time: 250 ns at 16 MHz / 4.5 to 5.5 Ｖ

Contextual Info: D-subminiature Metal Shell Vertical Dip Solder PCS D*U Series Cinch • .024" contact diameter. • Longer rear insulator provides integral standoff from PCB. Materials • Contact Material: Plug - Brass machined . Socket - Copper alloy (machined). • Contact Plating: Gold flash or 30pin. gold. All over nickel.

Contextual Info: TOSHIBA TA8776N TOSHIBA BIPOLAR LINEAR INTEGRATED CIRCUIT SILICON MONOLITHIC T A ft 7 7 fi M • m m » a ■v SURROUND PROCESSOR FOR A CTV TA8776N is a surround processor controlled l2C bus. It incorporates following functions on a 30pin dual-in-line shrink-type plastic package.

Contextual Info: September 2006 TLCS-870 Family TLCS-870/C Series 30pin TMP86FH92DMG 8-bit microcontroller incorporating Flash memory, power-on reset circuit and voltage detecting circuit in 30-pin SSOP TLCS-870/C CPU Core •Operating voltage 4.0 to 5.5 V, 2.7 to 5.5 V ·Minimum instruction execution time

HM511000

Abstract: hb56g19b-7
Contextual Info: HB56G19A/B Series Maintenance only 1,048,576-word x 9-bit High Density Dynamic RAM Module The HB56G19 is a 1M × 9 dynamic RAM module, mounted two 4-Mbit DRAM HM514400BS/BLS sealed in SOJ package and 1 Mbit DRAM (HM511000 AJP/ALJP) sealed in SOJ package. An outline of the HB56G19 is 30pin single in-line package. Therefore, the

Contextual Info: QB-144-CA-01's pin header cover for PD78F073x 30pin MC package CP1 GND N.C. N.C. N.C. N.C. N.C. N.C. 14 13 12 11 N.C. N.C. N.C. N.C. N.C. N.C. N.C. N.C. N.C. N.C. N.C. N.C. 22 21 20 19 18 17 16 15 23 N.C. N.C. 10 9 N.C. N.C. GND GND μPD78F073x 30MC CP2