42ALLOY Search Results

P127

Abstract: P-MFP018 42-alloy P-TSOP050-0400 P-TSOP048-1220
Contextual Info: PACKAGE OUTLINES Unit : mm P-SOP008-0225 M TYP. 5.05 (1.05) 0.65 0−10゜ 0.1 Seating plane 0.65±0.2 Epoxy resin 42Alloy Solder plating 10 0.07 Package material Lead frame material Lead finishing・material Solder plating thickness (ı) Package weight (n)

GP1S94J0000F

Abstract: H131
Contextual Info: GP1S94J0000F GP1S94J0000F Gap : 3.5mm Slit : 0.3mm Phototransistor Output, Compact Transmissive Photointerrupter • Description ■ Agency approvals/Compliance GP1S94J0000F is a compact-package, phototransistor output, transmissive photointerrupter, with

V-by-1

Abstract: SONY colour tv circuit diagram CXA2039M sony led tv electronic diagram RY1, 9V sony tv diagram 24PIN SOP-24P-L01
Contextual Info: CXA2039M Base Band Hue/Color Control Description The CXA2039M is a bipolar color difference signal processing IC for color TVs. This chip enables base band hue and color control for color difference signals. Features • 2 UV inputs, 1 UV output • 3 Y inputs, 2 Y outputs

A6C-10R

Abstract: A6C-16R A6CV-10R A6CV-16R
Contextual Info: Dip Switch A6C Highly Reliable Subminiature Dip Switch Precision rotary cam and contactor drive provide high reliability • Subminiature: 9 W x 6.6 (L) x 4.5 (H) mm ■ Molded base and rotor sealed by O-ring; eliminates the need for tape sealing ■ Ordering Information

CXA2039M

Abstract: V-by-1 24PIN sony tv circuit diagram
Contextual Info: CXA2039M Base Band Hue/Color Control Description The CXA2039M is a bipolar color difference signal processing IC for color TVs. This chip enables base band hue and color control for color difference signals. Features • 2 UV inputs, 1 UV output • 3 Y inputs, 2 Y outputs

CCD linear 22pin

Abstract: 2SC2785 74AC04 ILX718K S5363
Contextual Info: ILX718K 5363-pixel x 3 line CCD Linear Sensor Color For the availability of this product, please contact the sales office. Description The ILX718K is a reduction type CCD linear sensor developed for color image scanner, and has shutter function per each color. This sensor reads A4-size

package weight

Abstract: N-DIP016-0450 19 20 003 0251
Contextual Info: PACKAGE OUTLINES Unit : mm 5.9±0.3 3.0±0.2 0.7 0.65 4.55±0.2 P-SIP009-0240 9-0.5 ±0.1 P-2.54 TYP. 9 0.25 21.7 ±0.25 M 0.25±0.05 1.3 1.4 2.95±0.2 Package material Lead frame material Lead finishing・material Solder plating thickness ı Package weight (n)

GP1S25J0000F

Abstract: H126
Contextual Info: GP1S25J0000F GP1S25J0000F SMT, Gap : 1.6mm, Slit : 0.3mm Phototransistor Output, Compact Transmissive Photointerrupter • Description ■ Agency approvals/Compliance GP1S25J0000F is a compact-package, phototransistor output, transmissive photointerrupter, with opposing

GP1S96J0000F

Abstract: H133
Contextual Info: GP1S96J0000F GP1S96J0000F Gap : 1mm, Slit : 0.3mm Phototransistor Output, Compact Transmissive Photointerrupter • Description ■ Agency approvals/Compliance GP1S96J0000F is a compact-package, phototransistor output, transmissive photointerrupter, with opposing

GP1S74PJ000F

Abstract: phototransistor application notes sharp 292133-3 circuit diagram for photointerrupter
Contextual Info: GP1S74PJ000F GP1S74PJ000F Gap : 5mm Slit : 0.5mm Phototransistor Output, Snap-in fixing Transmissive Photointerrupter with Connector • Description ■ Agency approvals/Compliance GP1S74PJ000F is a standard, phototransistor output, transmissive photointerrupter with opposing emitter and

transistor d235

Abstract: d235 transistor SUMIKO 8r01 transistor sharp interrupt sensor GP1A73AJ000F GH4A003P000ZA
Contextual Info: GP1A73AJ000F GP1A73AJ000F Gap : 5mm Slit : 0.5mm *OPIC Output, Snap-in type Transmissive Photointerrupter with Connector • Description ■ Agency approvals/Compliance GP1A73AJ000F is a standard, OPIC output, transmissive photointerrupter with opposing emitter and detector

GP1S096HCZ0F

Abstract: H134
Contextual Info: GP1S096HCZ0F GP1S096HCZ0F Gap : 1mm, Slit : 0.3mm Phototransistor Output, Compact Transmissive Photointerrupter • Description ■ Agency approvals/Compliance GP1S096HCZ0F is a compact-package, phototransistor output, transmissive photointerrupter, with opposing emitter and detector in a molding that provides

38S02

Abstract: ipad data sheet MSM38S0000 MSM98S MSM98S000
Contextual Info: DATA SHEET O K I A S I C P R O D U C T S 0.8µm Mixed 3-V/5-V MSM38S0000 Sea of Gates and MSM98S000 Customer Structured Arrays February 1995 TRADEMARKS AIX, DOS, PC, and Windows are trademarks, and IBM is a registered trademark of IBM Corporation Apollo, Domain, and DomainOS are trademarks of Apollo Computer, a subsidiary of Hewlett-Packard

CAT 7103

Abstract: 7103 A6DR-2100 A6D-0100 A6D-0103 A6D-2100 A6D-2103 A6D-4100 A6D-4103 A6D-6100
Contextual Info: DIP Switch A6D/DR Space-saving, Subminiature DIP Switch Offers Both Sealed and Unsealed Construction • Completely sealed units allow immersion-cleaning without taping ■ Designed to standards of DIL-IC; top actuated types are auto insertable ■ Bifurcated movable contacts

ICX038ALA

Abstract: CXD1250 ICX038BLA icx038bla-6 ICX0386LA ICXO380LA sony HD image sensor sony CXD1250 icxo38
Contextual Info: SONY» I C X 3 8 B L A 1/2 inch C C D Image Sensor for EIA B/W Camera Description ICX038BLA is an Interline transfer CCD solid-state imager suitable for EIA 1/2 inch B/W video cameras. High sensitiveness is achieved through the adoption of HAD Hole-Accumulation Diode sensors.

Contextual Info: O K I Semiconductor MSM38S0000/MSM98S000 0.8|im Mixed 3-V/5-V Sea of Gates and Customer Structured Arrays DESCRIPTION OKI's 0.8 tm ASIC products, specially designed for mixed 3-V /5-V applications, are now available in both Sea Of Gates (SOG and Customer Structured Array (CSA) architectures. Both the SOG-based MSM38S

Contextual Info: SONY CXD2306Q 10-bit 80MSPS 1ch D/A Converter Description The CXD2306Q is a 1-ch 10-bit 80MSPS D/A converter for fine monitor and video, and is ideal for high definition TVs and high resolution displays. Features • 10-bit resolution • Maximum conversion rate

Contextual Info: SONY CXD1170M 6-bit 40MSPS High Speed D/A Converter Description The CXD1170M is a 6-bit 40MHz high speed D/A converter. The adoption of a current output system reduces power consumption to 80mW 200£2 load at 2Vp-p output . This IC is suitable for digital TV and graphic

Contextual Info: SONY ILX5 0 8 A 7926-pixel CCD Linear Image Sensor B/W D escription 24 pin DIP (Ceramic) The ILX508A is a reduction type C C D linear sensor developed for high resolution copiers. This sensor reads A3-slze documents at a density of 600 DPI (Dot Per Inch). A built-in timing generator and clock-drivers

Contextual Info: SONY CCD Delay Line for Multi System Descriptio 24 pin SOP Plastic The CXL1510M is an IC developed for use in conjunction with Y/C signal processing ICs for mult systems. This CCD delay line provides the comb filter output for eliminating the chrominance signa

NJU26100

Abstract: NJU26101 NJU26199 QFP32-R1 NJU26101NJU26199DSP
Contextual Info: NJU26100 シリーズ NJU26100シリーズ ハードウェア共通仕様書 •外 形 ■ 概 要 NJU26100シリーズは24ビットDSPコアのデジタル・オーディオ・プロセッサです。 この仕様書は、NJU26100シリーズハードウエアの共通仕様について記述しています。

CKG57NX5R1H226M

Abstract: CKG57N e415 CKG57K CKG45KX7R1C226M CKG57NX7R2A106M CKG57NX7R2J474M
Contextual Info: Multilayer Ceramic Chip Capacitors 2-chip piled type CKG series Type: CKG32K CKG45K CKG45N CKG57K CKG57N Issue date: September 2007 • All specifications are subject to change without notice. • Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific

capacitor .022 630v

Abstract: CKG57K X5R X7R capacitor 630v CKG32K CKG57N .047 630v capacitor 47 16v T 2A 250V MEGA CAP
Contextual Info: 積層セラミックコンデンサ メガキャップタイプ Multilayer ceramic capacitor MEGA CAP type S&S-03 金属端子付き メタルキャップ 高信頼性タイプ 特長 用途 ● 極性がありません ● 温度変動のある機器 ● 1 個分のスペ ースで従来の 2 倍の容量が得られ

SMD MARKING CODE 071 A01

Abstract: smd code 38P LGA 1155 PIN diagram MARKING CODE SMD IC A08 L QUAD Aluminum nitride smd marking m05 LGA 1155 Socket PIN diagram pitch 0.4 QFP 256p marking code smd fujitsu Texas Instruments epoxy Sumitomo
Contextual Info: To Top Contents Safety Precautions 1 Introduction to Packages 1.1 Overview 1.2 Package Lineup 1.3 Package Forms 1.4 Package Structures 1.5 How Package Dimensions Are Indicated 1.6 Package Codes 1.7 Marking 1.8 Future Trends in Packages 2 Package Mounting Methods