L142
Abstract: M095-51 M095-37 M095-14B M095-45 M095-06 M095-29 M095-23B m095
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGING MATERIAL, TREATMENT AND OUTLINE DRAWINGS 4.2 TRAYS 1 TRAYS M095(MATERIAL : M095-01~06 : PS COMPOUND) M095-14B~ : PP COMPOUND W : 152.6 MITSUBISHI M095-40 ZW eW NW 160P6E-A HEAT PROOF L : 300.0 H ZL eL NL Pocket Pitch(mm)
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m095-01m095-14bm095-40160p6e-a+11m095-04m095-06m095-13bm095-17l142m095-51m095-37m095-45m095-29m095-23bm095
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M38881M2XXXFP
Abstract: M38881M2 M38802M2 M37510 176P6D M37690E8-XXXFP M38881M2XXXGP 80P6S-A m38813m4 m38802e2
Contextual Info: B uilt-in LCD driver type Memory type Memory size byte 20K One time PROM Mask ROM 32K One time PROM OnetimePROM Mask ROM OnelimePROM Type I*». Package ROM RAM Mask ROM Mask ROM # 24K 60K M37500M5-XXXFP 160P6E-A M37500M5-XXXGP 176P6D M37500E5-XXXFP M37500E5-XXXGP
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m37500m5-xxxfpm37500m5-xxxgpm37500e5-xxxfpm37500e5-xxxgp+16m37500m8-xxxfpm37500m8-xxxgpm37500e8-xxxfpm37500e8-xxxgpm37510m6-xxxfpm37s10e6-xxxfpm38881m2xxxfpm38881m2m38802m2m37510176p6dm37690e8-xxxfpm38881m2xxxgp80p6s-am38813m4m38802e2
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QFP160-P-2424-0
Abstract: QFP160
Contextual Info: 160P6E-A Plastic 160pin 24✕24mm body QFP Weight g 3.39 JEDEC Code – Lead Material Alloy 42 MD e EIAJ Package Code QFP160-P-2424-0.50 160 b2 ME HD D 121 1 120 I2 HE E Recommended Mount Pad Symbol 81 40 41 80 A L1 F A1 c A2 e b y L Detail F A A1 A2 b c
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160p6e-a160pinqfp160-p-2424-0qfp160 |
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432W6
Abstract: 48P4B hssop 44P3W-R 28P0 5P5T tsop 2-54 42P9R 70P3S-M 479F7G
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES LIST OF PACKAGE CODES CLASSIFIED ACCORDING TO PIN NUMBER 1. LIST OF PACKAGE CODES CLASSIFIED ACCORIDING TO PIN NUMBER Pin Count Structure Type Lead Pitch mm 5 P P P P P P C C P P P C P P P P P P P P C P P P P P P P
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240k6x-a240p6y-a240p6z-a255f7f+16256f7b256f7x-a/b256p6j-e256p6k-e272f7x-a/b281s8-c432w648p4bhssop44p3w-r28p05p5ttsop 2-5442p9r70p3s-m479f7g
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100MHZ
Abstract: IC PACKAGE ELECTRICAL CHARACTERISTIC LCR 24p2n-a 136P6S-C
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES IC PACKAGE ELECTRICAL CHARACTERISTIC 6.2 IC PACKAGE ELECTRICAL CHARACTERISTICS Tables 1, 2 and 3 show electrical characteristics of packages of various types. They are called LCR values, which include Ls, Lm, Co, Cm,
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136p6s-c100p6s-c80p6n-c208p6y-a+664p6n-b160p6e-a44p6n-b100mhzic package electrical characteristic lcr24p2n-a
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M37500M8
Contextual Info: MITSUBISHI MICROCOMPUTERS 7500 Group SINGLE-CHIP 8-B IT CMOS MICROCOMPUTER DESCRIPTION • 2 C lo c k gen e ra tin g circuit T h e 7 5 0 0 group is th e 8 -b it m icro com puter b a s e d on the C o n n e c t to external c era m ic resonator or quartz-crystal
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001b16m37500m8 |
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48P4B
Abstract: P/N146071 hssop 432W6 70P3S-M 10C2-C 136P6S-C 20P5A
Contextual Info: 3. DETAILED DIAGRAM OF PACKAGE OUTLINES LIST OF PACKAGE CODES CLASSIFIED ACCORIDING TO PACKAGE TYPE Pin Count Structure 5 8 8 10 12 9 12 12 14 16 20 24 8 14 16 18 18 20 20 22 22 24 24 24 24 28 28 28 30 32 32 32 40 42 20 28 30 32 36 40 42 48 52 64 P P P P P
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240k6x-a30s1b42s1b-a52s1b-b+1464s1b-e124s8135s8-f145s8149s8177s848p4bp/n146071hssop432w670p3s-m10c2-c136p6s-c20p5a
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160-pin renesas
Contextual Info: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid
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160p6e160-pin160-pin renesas |
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M31010M6-XXXHP
Abstract: M33210AFP-20 m31002s2hp 32-Bit Microcomputers M31000S2FP 5kpa M31010 31002S2HP 160P6-C 30600E8-XXXFP
Contextual Info: ♦M16C Family M I 6 C / 6 0 group # Memory size Memory type byte Package Type No. ROM RAM Mask ROM O ne time PROM 64K - 100P6S-A M30600M8-XXXGP 100P6Q-A 10K M 30600E8-XXXFP EPRO M External ROM M30600M8-XXXFP 10K M16C./61 g rou p (S IM -c o m p a tib le se ria l I/O built in)
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m30600m8-xxxfpm30600m8-xxxgp30600e8-xxxfp100p6s-a+13100p6q-a100p8s-am30612m4-xxxfpm306i2m4-xxxgpm31010m6-xxxhpm33210afp-20m31002s2hp32-bit microcomputersm31000s2fp5kpam3101031002s2hp160p6-c
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10C2
Abstract: 144PFB-A 48P4B 16P2S-A 240mil hssop Package tray dimension 12P9 16P2Z-A 18P4G
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE SPECIFICATIONS 3.1 INDIVIDUAL PACKS Each type of package is used to carry individually packed products as listed below: PACKAGE AND INDIVIDUAL PACK LIST Package Type SIP HSIP ZIP DIP SDIP Package Name Standard Dimension
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12p9b14p5a16p5a20p5a+1524p5a18p4g20p4g22p4h24p4d24p4y10c2144pfb-a48p4b16p2s-a240milhssoppackage tray dimension12p916p2z-a
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324pc
Abstract: L198 L-088 930PC 12P9B 300mil trays 4028PC L199 SP080 pt881
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE SPECIFICATIONS 3.2 PACKAGE AND CARTON SERIAL NUMBER AND STANDARD CAPACITY TUBES STANDARD PACKAGING 240mil Individual Pack Qty/Individual Tube No. Pack ( ) 45 SP050PC 340mil SP070PC Package Type Package Name Standard Dimension
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240milsp050pc340milsp070pc+15440mil12p9b14p5a16p5a20p5a24p5a324pcl198l-088930pc300mil trays4028pcl199sp080pt881
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m37500
Abstract: M37500M5 M37500M8 M37500E8FP
Contextual Info: MITSUBISHI M ICROCOM PUTERS 7500 Group SINGLE-CHIP 8-BIT CM O S M ICR O CO M P U TER DESCRIPTION • 2 C lock ge nera ting circu it The 7500 group is the 8 -b it m icro com p uter based on the C o n n e ct to external ceram ic resonator or quartz-crystal
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m37500m37500m5m37500m8m37500e8fp |
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