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    MF202 Datasheets (2)

    Songtian Electronics
    Part ECAD Model Manufacturer Description Datasheet Type PDF PDF Size Page count
    MF2020004M1DN0CSB0
    		Songtian Electronics ICL 20 OHM 20% 4A 20MM Original PDF 4.07MB 20
    MF202R508M1DN0CSB0
    		Songtian Electronics ICL 2.5 OHM 20% 8A 20MM Original PDF 4.07MB 20
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    MF202 Price and Stock

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    Panasonic Electronic Components MHMF202L1C8

    A6 MOTOR HI 2 KW 200 V RS
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    Master Electronics MHMF202L1C8
    • 1 $995.51
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    RS MHMF202L1C8 Bulk 1
    • 1 $1645.66
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    Sager MHMF202L1C8 1
    • 1 $1040.31
    • 10 $980.00
    • 100 $849.11
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    Panasonic Electronic Components MDMF202L1D7

    A6 MOTOR MI 2 KW 200 V RS
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    Master Electronics MDMF202L1D7
    • 1 $1214.58
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    RS MDMF202L1D7 Bulk 1
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    Sager MDMF202L1D7 1
    • 1 $1269.23
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    Panasonic Electronic Components MHMF202L1H7

    A6 MOTOR HI 2 KW 200 V BRK
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    Master Electronics MHMF202L1H7
    • 1 $1214.58
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    RS MHMF202L1H7 Bulk 1
    • 1 $2007.79
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    Sager MHMF202L1H7 1
    • 1 $1269.23
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    • 100 $1035.96
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    ITT Interconnect Solutions CA08COM-F20-29S-01-44-F0

    Circular Connector - 90° Plug - Contact Arrangement: 20-29 - Sockets - Threaded Coupling - Endbell for Flex Tube
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    Avnet Americas CA08COM-F20-29S-01-44-F0 Bulk 13 Weeks 100
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    Avnet Abacus CA08COM-F20-29S-01-44-F0 17 Weeks 26
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    IDEC Corporation HW1M-F2021-30

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    Master Electronics HW1M-F2021-30
    • 1 $75.88
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    • 100 $58.68
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    Newark HW1M-F2021-30 Bulk 1
    • 1 $91.95
    • 10 $85.32
    • 100 $81.91
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    RS HW1M-F2021-30 Bulk 1
    • 1 $85.44
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    Sager HW1M-F2021-30 1
    • 1 $73.80
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    Find more MF202 price and stock on Findchips.com

    MF202 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    MF202

    Abstract: leadframe materials QFP PACKAGE thermal resistance POWER QFP MITSUBISHI INTEGRATED CIRCUIT PACKAGES
    Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE THERMAL RESISTANCE 5.2 HEAT DISSIPATION CHARACTERISTICS OF IC PACKAGE Figure 4 shows measured thermal resistance values of 16-pin plastic DIPs employing various lead-frame materials including 42 Alloy IronNickel alloy , phosphor bronze, #MF202 copper alloy, and copper-tin alloy. Except for the lead-frame material, all other factors were identical


    Original     		16-pinmf202160p6152p6t+6135s842alloyleadframe materialsqfp package thermal resistancepower qfpmitsubishi integrated circuit packages PDF

    ALLOY leadframe C7025

    Abstract: ALLOY leadframe C7025 material property C19400 leadframe materials C18070 leadframe C7025 Cu6Sn5 MF202 C7025 c14415
    Contextual Info: Whisker Testing: Reality or Fiction? P. Oberndorff 1, M. Dittes2, P. Crema 3 1 Philips Centre for Industrial Technology, P.O. Box 218, 5600 MD Eindhoven, the Netherlands, pascal.oberndorff@philips.com 2 Infineon Technologies AG, P.O. Box 100944, D-93009 Regensburg, Germany,


    Original     		d-93009alloy leadframe c7025alloy leadframe c7025 material propertyc19400+7leadframe materialsc18070leadframe c7025cu6sn5mf202c7025c14415 PDF

    MF202

    Abstract: Si3N4 AuSn eutectic eftec 45 SC-101 silicon carbide MgO Al2O3 Thermal conductivity coefficient properties fe -80 ni
    Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PROPERTIES OF PACKAGE MATERIALS 7. PROPERTIES OF PACKAGE MATERIALS Principal package material characteristics are shown in the following tables. Table 1 Case Material Characteristics Material Almina Alminum nitride Type Name


    Original     		sc-10142alloymf202si3n4+5ausn eutecticeftec 45silicon carbidemgo al2o3 thermal conductivity coefficientproperties fe -80 ni PDF