11-5B2
Abstract: HQFP152-P-2828-0
Contextual Info: 152P6T-C Plastic 152pin 28✕28mm body HQFP EIAJ Package Code HQFP152-P-2828-0.65 Weight g 5.39 JEDEC Code – Lead Material Alloy 42 MD e HD D ME 115 b2 152 1 114 I2 Symbol HE E Recommended Mount Pad 77 38 39 76 A L1 F A1 c A2 e A A1 A2 b c D E e HD HE L
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152p6t-c152pinhqfp152-p-2828-011-5b2 |
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432W6
Abstract: 48P4B hssop 44P3W-R 28P0 5P5T tsop 2-54 42P9R 70P3S-M 479F7G
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES LIST OF PACKAGE CODES CLASSIFIED ACCORDING TO PIN NUMBER 1. LIST OF PACKAGE CODES CLASSIFIED ACCORIDING TO PIN NUMBER Pin Count Structure Type Lead Pitch mm 5 P P P P P P C C P P P C P P P P P P P P C P P P P P P P
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240k6x-a240p6y-a240p6z-a255f7f+16256f7b256f7x-a/b256p6j-e256p6k-e272f7x-a/b281s8-c432w648p4bhssop44p3w-r28p05p5ttsop 2-5442p9r70p3s-m479f7g
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48P4B
Abstract: P/N146071 hssop 432W6 70P3S-M 10C2-C 136P6S-C 20P5A
Contextual Info: 3. DETAILED DIAGRAM OF PACKAGE OUTLINES LIST OF PACKAGE CODES CLASSIFIED ACCORIDING TO PACKAGE TYPE Pin Count Structure 5 8 8 10 12 9 12 12 14 16 20 24 8 14 16 18 18 20 20 22 22 24 24 24 24 28 28 28 30 32 32 32 40 42 20 28 30 32 36 40 42 48 52 64 P P P P P
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240k6x-a30s1b42s1b-a52s1b-b+1464s1b-e124s8135s8-f145s8149s8177s848p4bp/n146071hssop432w670p3s-m10c2-c136p6s-c20p5a
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M52777SP
Abstract: m52777 ic m52778sp M5265 M52340SP "VGA TO NTSC" CONVERTER M52008 M52311FP M52696FP M51366SP
Contextual Info: I I ll'll 1j \ —— I • D IG IT A L SIGNAL PROCESSING Application ASICs Y/C Separator Type No. Circuit functton Typical electrical characteristics \fi-2 S C Tvf Icc mA) Digital Adaptive Y/C Separator 5.0 100 52P4B M65630FP Motion Adaptive Y/C Separator
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m656i1sp52p4bm52777spm52777+8ic m52778spm5265m52340spvga to ntsc" converterm52008m52311fpm52696fpm51366sp
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MF202
Abstract: leadframe materials QFP PACKAGE thermal resistance POWER QFP MITSUBISHI INTEGRATED CIRCUIT PACKAGES
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE THERMAL RESISTANCE 5.2 HEAT DISSIPATION CHARACTERISTICS OF IC PACKAGE Figure 4 shows measured thermal resistance values of 16-pin plastic DIPs employing various lead-frame materials including 42 Alloy IronNickel alloy , phosphor bronze, #MF202 copper alloy, and copper-tin alloy. Except for the lead-frame material, all other factors were identical
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16-pinmf202160p6152p6t+6135s842alloyleadframe materialsqfp package thermal resistancepower qfpmitsubishi integrated circuit packages
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10C2
Abstract: 144PFB-A 48P4B 16P2S-A 240mil hssop Package tray dimension 12P9 16P2Z-A 18P4G
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE SPECIFICATIONS 3.1 INDIVIDUAL PACKS Each type of package is used to carry individually packed products as listed below: PACKAGE AND INDIVIDUAL PACK LIST Package Type SIP HSIP ZIP DIP SDIP Package Name Standard Dimension
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12p9b14p5a16p5a20p5a+1524p5a18p4g20p4g22p4h24p4d24p4y10c2144pfb-a48p4b16p2s-a240milhssoppackage tray dimension12p916p2z-a
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324pc
Abstract: L198 L-088 930PC 12P9B 300mil trays 4028PC L199 SP080 pt881
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE SPECIFICATIONS 3.2 PACKAGE AND CARTON SERIAL NUMBER AND STANDARD CAPACITY TUBES STANDARD PACKAGING 240mil Individual Pack Qty/Individual Tube No. Pack ( ) 45 SP050PC 340mil SP070PC Package Type Package Name Standard Dimension
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240milsp050pc340milsp070pc+15440mil12p9b14p5a16p5a20p5a24p5a324pcl198l-088930pc300mil trays4028pcl199sp080pt881
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12-Bit Parallel-IN Serial-OUT Shift Register
Abstract: M51660L M52770ASP M52778SP M5230L m52760sp M51971L m51957bl series M54640 M65817AFP
Contextual Info: ASSPs ICs for Visual and Audio Equipments ICs for Information and Communication Equipments ICs for Control , Driver and Others General Purpose ICs Preceding Page MITSUBISHI ELECTRIC CORPORATION ICs for Visual and Audio Equipments Sound Processor TV Sets
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12-bit24p4d/24p2n-bm66311p/fp+1152mhz12-bit parallel-in serial-out shift registerm51660lm52770aspm52778spm5230lm52760spm51971lm51957bl seriesm54640m65817afp
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