135S8 Search Results

3303P

Abstract: PGA135-C-S14U-2
Contextual Info: 135S8-F Metal seal 135pin PGA EIAJ Package Code PGA135-C-S14U-2.54 JEDEC Code – 37.084±0.4 Weight g 11.05 4.49MAX 33.02±0.3 3.3±0.3 P N M L K J H G F E D C B A 33.02±0.3 2.54TYP φ1.27TYP 37.084±0.4 φ0.46±0.05 2.54TYP 14 13 12 11 10 9 8 INDEX AREA

Contextual Info: G m ic r o " I t tiEMiâSâ G G I S I S I â • M ITSUBISHI LSIs M33281GS-20 MITSUBISHI-CflICnPTR/MIPRO a^E D CMOS FLOATING-POINT PROCESSING UNIT M 3 2 /F P U DESCRIPTION PIN CONFIGURATION (BOTTOM VIEW) M33281GS-20 is a high-speed floating-point arithmetic LSI

432W6

Abstract: 48P4B hssop 44P3W-R 28P0 5P5T tsop 2-54 42P9R 70P3S-M 479F7G
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES LIST OF PACKAGE CODES CLASSIFIED ACCORDING TO PIN NUMBER 1. LIST OF PACKAGE CODES CLASSIFIED ACCORIDING TO PIN NUMBER Pin Count Structure Type Lead Pitch mm 5 P P P P P P C C P P P C P P P P P P P P C P P P P P P P

Contextual Info: G • M 'C R Ä ” t.24=iaaa 0015135 t ■ M IT S U B IS H I lsu M33220GS-20 " •\ iT ^ -n -v z - C M O S 3 2 -B ÍT P A R A L L E L M I C R O P R O C E S S O R M 3 2 /2 0 0 NITSUBISHI-CtllCMPTR/tllPRO DESCRIPTION S^E D PIN CONFIGURATION (BOTTOM VIEW>

Contextual Info: _ TM tH H ifla a G MICRO & SV*"’ » *„.A«*”" O D is m i T m M ITSUB ISH I l s u M33245GS n iT S U B is H iin ic n P T R /n iP R o ste d CMOS CACHE CONTROLLER/M EM ORY M 32/C C M v T S l'iß - Z L ~ DESCRIPTION M33245GS (M 32/C C M ) is a cache controller/mem ory for

48P4B

Abstract: P/N146071 hssop 432W6 70P3S-M 10C2-C 136P6S-C 20P5A
Contextual Info: 3. DETAILED DIAGRAM OF PACKAGE OUTLINES LIST OF PACKAGE CODES CLASSIFIED ACCORIDING TO PACKAGE TYPE Pin Count Structure 5 8 8 10 12 9 12 12 14 16 20 24 8 14 16 18 18 20 20 22 22 24 24 24 24 28 28 28 30 32 32 32 40 42 20 28 30 32 36 40 42 48 52 64 P P P P P

Contextual Info: _ TM MITSUBISHI LSIs G MICRO M33245GS c,oW* 9 ^ ' . „ • ” “'' s° > CMOS CACHE CONTROLLER/MEMORY M 32/C C M DESCRIPTION M 33245GS (M 3 2 /C C M ) is a cache co n tro lle r/m e m o ry for PIN CONFIGURATION (BOTTOM VIEW) M32 fam ily m icroprocessors (M 33210G S -20, M 33220GS-20,

M3328

Contextual Info: MITSUBISHI LSI« M33281GS-20 c.o«'* CMOS FLOATING-POINT PROCESSING UNIT M 32/FP U DESCRIPTION PIN CONFIGURATION (BOTTOM VIEW) M 3 3 2 8 1 G S -2 0 is a h ig h -s p e e d flo ating-p oint arithm etic LSI unit, and support th e e x te n d e d precision data form at of

MF202

Abstract: leadframe materials QFP PACKAGE thermal resistance POWER QFP MITSUBISHI INTEGRATED CIRCUIT PACKAGES
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE THERMAL RESISTANCE 5.2 HEAT DISSIPATION CHARACTERISTICS OF IC PACKAGE Figure 4 shows measured thermal resistance values of 16-pin plastic DIPs employing various lead-frame materials including 42 Alloy IronNickel alloy , phosphor bronze, #MF202 copper alloy, and copper-tin alloy. Except for the lead-frame material, all other factors were identical

10C2

Abstract: 144PFB-A 48P4B 16P2S-A 240mil hssop Package tray dimension 12P9 16P2Z-A 18P4G
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE SPECIFICATIONS 3.1 INDIVIDUAL PACKS Each type of package is used to carry individually packed products as listed below: PACKAGE AND INDIVIDUAL PACK LIST Package Type SIP HSIP ZIP DIP SDIP Package Name Standard Dimension