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    MF202 Datasheets (2)

    Songtian Electronics
    Part ECAD Model Manufacturer Description Datasheet Type PDF PDF Size Page count
    MF2020004M1DN0CSB0
    		Songtian Electronics ICL 20 OHM 20% 4A 20MM Original PDF 4.07MB 20
    MF202R508M1DN0CSB0
    		Songtian Electronics ICL 2.5 OHM 20% 8A 20MM Original PDF 4.07MB 20
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    MF202 Price and Stock

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    Vishay Intertechnologies CMF2027R000GKEA

    Resistor: metal film; 27Ω; 1W; ±2%; -55÷175°C; axial; L: 0.0095mm
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TME CMF2027R000GKEA 1,500 1,500
    • 1 -
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    • 100 -
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    • 10000 $0.07
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    SKF PCMF 202315 E SKF

    Bearing: slide; sleeve; with flange; Øout: 23mm; Øint: 20mm; L: 15mm
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TME PCMF 202315 E SKF 2 1
    • 1 $3.42
    • 10 $3.23
    • 100 $3.01
    • 1000 $3.01
    • 10000 $3.01
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    SKF PCMF 202321.5 E SKF

    Bearing: slide; sleeve; with flange; Øout: 23mm; Øint: 20mm
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TME PCMF 202321.5 E SKF 1
    • 1 $2.85
    • 10 $2.67
    • 100 $2.49
    • 1000 $2.49
    • 10000 $2.49
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    SKF PCMF 202316.5 E SKF

    Bearing: slide; sleeve; with flange; Øout: 23mm; Øint: 20mm
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TME PCMF 202316.5 E SKF 1
    • 1 $2.55
    • 10 $2.39
    • 100 $2.23
    • 1000 $2.23
    • 10000 $2.23
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    SKF PCMF 202311.5 SKF

    Bearing: slide; sleeve; with flange; Øout: 23mm; Øint: 20mm
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TME PCMF 202311.5 SKF 1
    • 1 $2.72
    • 10 $2.55
    • 100 $2.38
    • 1000 $2.38
    • 10000 $2.38
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    MF202 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    MF202

    Abstract: leadframe materials QFP PACKAGE thermal resistance POWER QFP MITSUBISHI INTEGRATED CIRCUIT PACKAGES
    Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE THERMAL RESISTANCE 5.2 HEAT DISSIPATION CHARACTERISTICS OF IC PACKAGE Figure 4 shows measured thermal resistance values of 16-pin plastic DIPs employing various lead-frame materials including 42 Alloy IronNickel alloy , phosphor bronze, #MF202 copper alloy, and copper-tin alloy. Except for the lead-frame material, all other factors were identical


    Original     		16-pinmf202160p6152p6t+6135s842alloyleadframe materialsqfp package thermal resistancepower qfpmitsubishi integrated circuit packages PDF

    ALLOY leadframe C7025

    Abstract: ALLOY leadframe C7025 material property C19400 leadframe materials C18070 leadframe C7025 Cu6Sn5 MF202 C7025 c14415
    Contextual Info: Whisker Testing: Reality or Fiction? P. Oberndorff 1, M. Dittes2, P. Crema 3 1 Philips Centre for Industrial Technology, P.O. Box 218, 5600 MD Eindhoven, the Netherlands, pascal.oberndorff@philips.com 2 Infineon Technologies AG, P.O. Box 100944, D-93009 Regensburg, Germany,


    Original     		d-93009alloy leadframe c7025alloy leadframe c7025 material propertyc19400+7leadframe materialsc18070leadframe c7025cu6sn5mf202c7025c14415 PDF

    MF202

    Abstract: Si3N4 AuSn eutectic eftec 45 SC-101 silicon carbide MgO Al2O3 Thermal conductivity coefficient properties fe -80 ni
    Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PROPERTIES OF PACKAGE MATERIALS 7. PROPERTIES OF PACKAGE MATERIALS Principal package material characteristics are shown in the following tables. Table 1 Case Material Characteristics Material Almina Alminum nitride Type Name


    Original     		sc-10142alloymf202si3n4+5ausn eutecticeftec 45silicon carbidemgo al2o3 thermal conductivity coefficientproperties fe -80 ni PDF