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    MF202 Search Results

    MF202 Datasheets (2)

    Part ECAD Model Manufacturer Description Datasheet Type PDF PDF Size Page count
    MF2020004M1DN0CSB0
    		Songtian Electronics ICL 20 OHM 20% 4A 20MM Original PDF 4.07MB 20
    MF202R508M1DN0CSB0
    		Songtian Electronics ICL 2.5 OHM 20% 8A 20MM Original PDF 4.07MB 20
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    MF202 Price and Stock

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    Vishay Dale CMF2020K000GKEA

    RES 20K OHM 1W 2% AXIAL
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey () CMF2020K000GKEA Reel 2,500 2,500
    • 1 -
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    • 10000 $0.27
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    CMF2020K000GKEA Cut Tape 2,500 1
    • 1 $0.99
    • 10 $0.65
    • 100 $0.44
    • 1000 $0.32
    • 10000 $0.32
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    Vishay Dale CMF2027K000GKEA

    RES 27K OHM 1W 2% AXIAL
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey CMF2027K000GKEA Cut Tape 2,366 1
    • 1 $0.99
    • 10 $0.65
    • 100 $0.44
    • 1000 $0.32
    • 10000 $0.32
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    Vishay Dale CMF202K7000JNEA

    RES 2.7K OHM 1W 5% AXIAL
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey CMF202K7000JNEA Cut Tape 2,295 1
    • 1 $0.98
    • 10 $0.64
    • 100 $0.44
    • 1000 $0.32
    • 10000 $0.32
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    Songtian Electronics (STE) MF202R508M1DN0CSB0

    ICL 2.5 OHM 20% 8A 20MM
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey MF202R508M1DN0CSB0 Bag 967 1
    • 1 $3.80
    • 10 $2.91
    • 100 $2.23
    • 1000 $1.70
    • 10000 $1.50
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    Vishay Dale CMF202K0000JKR6

    RES 2K OHM 1W 5% AXIAL
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey CMF202K0000JKR6 Cut Tape 890 1
    • 1 $1.01
    • 10 $0.66
    • 100 $0.45
    • 1000 $0.36
    • 10000 $0.36
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    MF202 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    MF202

    Abstract: leadframe materials QFP PACKAGE thermal resistance POWER QFP MITSUBISHI INTEGRATED CIRCUIT PACKAGES
    Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE THERMAL RESISTANCE 5.2 HEAT DISSIPATION CHARACTERISTICS OF IC PACKAGE Figure 4 shows measured thermal resistance values of 16-pin plastic DIPs employing various lead-frame materials including 42 Alloy IronNickel alloy , phosphor bronze, #MF202 copper alloy, and copper-tin alloy. Except for the lead-frame material, all other factors were identical


    Original     		16-pin MF202 160P6) 152P6T) 135S8) 42Alloy) leadframe materials QFP PACKAGE thermal resistance POWER QFP MITSUBISHI INTEGRATED CIRCUIT PACKAGES PDF

    ALLOY leadframe C7025

    Abstract: ALLOY leadframe C7025 material property C19400 leadframe materials C18070 leadframe C7025 Cu6Sn5 MF202 C7025 c14415
    Contextual Info: Whisker Testing: Reality or Fiction? P. Oberndorff 1, M. Dittes2, P. Crema 3 1 Philips Centre for Industrial Technology, P.O. Box 218, 5600 MD Eindhoven, the Netherlands, pascal.oberndorff@philips.com 2 Infineon Technologies AG, P.O. Box 100944, D-93009 Regensburg, Germany,


    Original     		D-93009 ALLOY leadframe C7025 ALLOY leadframe C7025 material property C19400 leadframe materials C18070 leadframe C7025 Cu6Sn5 MF202 C7025 c14415 PDF

    MF202

    Abstract: Si3N4 AuSn eutectic eftec 45 SC-101 silicon carbide MgO Al2O3 Thermal conductivity coefficient properties fe -80 ni
    Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PROPERTIES OF PACKAGE MATERIALS 7. PROPERTIES OF PACKAGE MATERIALS Principal package material characteristics are shown in the following tables. Table 1 Case Material Characteristics Material Almina Alminum nitride Type Name


    Original     		SC-101 42Alloy MF202 Si3N4 AuSn eutectic eftec 45 SC-101 silicon carbide MgO Al2O3 Thermal conductivity coefficient properties fe -80 ni PDF