VFBGA Search Results

Contextual Info: SOT991-1 VFBGA56; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering code 12NC ending 118 Rev. 1 — 19 April 2013 Packing information 1. Packing method Printed plano box Barcode label Reel Tape QA Seal

Contextual Info: Package outline VFBGA144: plastic very thin fine-pitch ball grid array package; 144 balls A B D SOT1078-1 ball A1 index area E A A2 A1 detail X e1 1/2 e e ∅v ∅w b M M C C A B C y y1 C M L K J e H G e2 F E 1/2 e D C B A ball A1 index area 1 2 3 4 5 7 6

962n

Contextual Info: 2 MEG x 16 ASYNC/PAGE/BURST CellularRAM MEMORY BURST CellularRAMTM MT45W2MW16BAFB Features Figure 1: 54-Ball VFBGA • Single device supports asynchronous, page, and burst operations • VCC, VCCQ Voltages 1.70V–1.95V VCC 1.70V–3.30V VCCQ • Random Access Time: 70ns

Contextual Info: Package outline VFBGA24: plastic very thin fine-pitch ball grid array package; 24 balls; body 3 x 3 x 0.65 mm B D SOT1199-1 A ball A1 index area A2 A E A1 detail X e1 e C C A B C Øv Øw b y y1 C E e D e2 C B A ball A1 index area 1 2 3 4 X 5 1 Dimensions Unit

Contextual Info: Package outline VFBGA48: plastic very thin fine-pitch ball grid array package; 48 balls A B D SOT1063-1 ball A1 index area E A A2 A1 detail X e1 1/2 e e ∅v ∅w b H M M C C A B C y y1 C e G F E e2 D 1/2 e C B A ball A1 index area 1 2 3 4 5 6 7 8 X 2.5 5 mm

SR52

Abstract: FY618 SR-52
Contextual Info: 8 MEG x 16 ASYNC/PAGE/BURST FLASH MEMORY FLASH MEMORY MT28F1284W18 1.8V Low Voltage, Extended Temperature Features Figure 1: 56-Ball VFBGA Dedicated commands to decrease programming times for both in-factory and in-system operations Fast programming algorithm FPA for fast PROGRAM

mt29f4g16abchc

Abstract: 63-ball Micron NAND 8Gb SLC MT29F4G16A MT29F4G MT29F4G16AB MT29F4G16ABC
Contextual Info: MT Login Sign up for Access Home > Products > NAND Flash > NAND Flash Part Catalog > MT29F4G16ABCHC 4Gb Mass Storage : MT29F4G16ABCHC RSS part feed: Density: 4Gb Part Status: Production RoHS: Yes Depth: 256Mb Width: x16 Voltage: 1.8V Package: VFBGA Pin Count: 63-ball

jedec MO 225

Abstract: VFBGA56
Contextual Info: PDF: 2002 Aug 09 Philips Semiconductors Package outline VFBGA56: plastic very thin fine-pitch ball grid array package; 56 balls; body 4.5 x 7 x 0.65 mm B D SOT702-1 A ball A1 index area A E A2 A1 detail X e1 b e 1/2 C ∅v M C A B ∅w M C e y1 C y K J H e

Contextual Info: USB3290 Small Footprint Hi-Speed USB 2.0 Device PHY with UTMI Interface PRODUCT FEATURES „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ Data Brief Available in a 40 ball lead-free RoHS compliant 4 x 4 x 0.9mm VFBGA package Interface compliant with the UTMI specification

VFBG

Abstract: sot859
Contextual Info: Package outline Philips Semiconductors VFBGA52: plastic very thin fine-pitch ball grid array package; 52 balls; body 4.5 x 7 x 0.65 mm B D SOT859-1 A ball A1 index area A E A2 A1 detail X e1 C ∅v M C A B b e ∅w M C y1 C 1/2 e y K J H e G F e2 E D 1/2 e

FX109

Abstract: FY108 "NOR Flash" intel 28f MT28F644W18 FY113 FX113 FW117 fw12 FW118 FY114
Contextual Info: 4 MEG x 16 ASYNC/PAGE/BURST FLASH MEMORY FLASH MEMORY MT28F644W18 MT28F644W30 1.8V Low Voltage, Extended Temperature Features • • • • • • • Figure 1: 56-Ball VFBGA Flexible 4Mb multipartition architecture Single word 16-bit data bus Support for true concurrent operation with zero latency

Contextual Info: ADVANCE‡ 8 MEG x 16 ASYNC/PAGE/BURST FLASH MEMORY FLASH MEMORY MT28F1284L30 1.8V Low Voltage, Extended Temperature Features Figure 1: 80-Ball VFBGA Dedicated commands to decrease programming times for both in-factory and in-system operations Buffered fast programming algorithm Buffered FPA for

PVBG0064KB-A

Contextual Info: RENESAS Code PVBG0064KB-A w S B JEITA Package Code P-VFBGA64-5x5-0.50 Previous Code ⎯ MASS[Typ.] 0.043g D E w S A x4 v y1 S A A1 S SD e S Reference Symbol Dimension in Millimeters Min Nom Max 5.0 H E 5.0 G v 0.15 F w 0.20 E A D A1 SE e D C B A 3 1 2 7 5

TVBG0216KA-A

Contextual Info: JEITA Package Code T-VFBGA216-15x15-0.50 RENESAS Code TVBG0216KA-A Previous Code TBT-216B MASS[Typ.] 0.4g D w S B E w S A x4 v y1 S y A1 A S S ZD e A e AJ AH AG AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A Reference Symbol B Dimension in Millimeters

CSR BC212

Abstract: MDR741F CSR BLUECORE VIRTUAL MACHINE CSR BlueCore 4 Application Program Interface BlueCore 3 csr bluetooth csr BC02 BlueCore 2 External casira casira csr crystal trim kit BC212015ADN-E4
Contextual Info: Product Data Sheet Device Features BlueCore 2-External Low power 1.8V operation TM Small footprint in 96-Ball VFBGA Package 6x6mm Single Chip Bluetooth System Fully qualified Bluetooth component Full speed class 2 Bluetooth operation with full 7 slave piconet support

BCR100

Contextual Info: PRELIMINARY‡ 8 MEG x 16 ASYNC/PAGE/BURST CellularRAM MEMORY 128Mb BURST CellularRAMTM 1.5 MT45W8MW16BGX Features Figure 1: Ball Assignment 54-Ball VFBGA • Single device supports asynchronous, page, and burst operations • Vcc, VccQ Voltages 1.7V–1.95V Vcc

Contextual Info: Package outline VFBGA56: plastic very thin fine-pitch ball grid array package; 56 balls; body 4 x 4.5 x 0.65 mm Β ∆ SOT991-1 Α βαλλ Α1 ινδεξ αρεα Ε Α Α2 Α1 δεταιλ Ξ ε1 C ∅ϖΜ Χ Α Β ∅ωΜ Χ β ε Η Γ Φ Ε ∆ Χ Β

VFBGA

Contextual Info: Plastic Packages for Integrated Circuits Very Thin, Fine Pitch, Plastic Ball Grid Array Package VFBGA V81.5x5A D A1 CORNER 81 BALL VERY THIN, FINE PITCH, PLASTIC BALL GRID ARRAY PACKAGE (VFBGA) B A SYMBOL E (4x) 0.10 C TOP VIEW MIN NOMINAL MAX NOTES A 0.78

VFBGA

Abstract: BV48A BV36A
Contextual Info: Package Diagram VFBGA 36-Lead VFBGA 6 x 8 x 1 mm BV36A 51-85149-* 1 Package Diagram 48-Lead VFBGA (6 x 8 x 1 mm) BV48A 51-85150-* 2

Contextual Info: Package outline VFBGA52: plastic very thin fine-pitch ball grid array package; 52 balls; body 4.5 x 7 x 0.65 mm B D SOT859-1 A ball A1 index area A E A2 A1 detail X e1 C ∅v M C A B b e ∅w M C 1/2 e y1 C y K J H e G F e2 E D 1/2 e C X B A ball A1 index area

MT48LC4M32B2P

Abstract: marking 6a2 smd 6A 1176
Contextual Info: 128Mb: x32 SDRAM Features SDR SDRAM MT48LC4M32B2 – 1 Meg x 32 x 4 Banks Features Options Marking • Configuration – 4 Meg x 32 1 Meg x 32 x 4 banks • Package – OCPL1 – 86-pin TSOP II (400 mil) – 86-pin TSOP II (400 mil) Pb-free – 90-ball VFBGA (8mm x 13mm)

vFBGA* 96 bALL

Abstract: Amkor Wafer level mold compound amkor cabga thermal resistance BGA 256 PACKAGE thermal resistance Amkor Technology CABGA CTBGA MO-195 BGA PACKAGE thermal resistance amkor cabga
Contextual Info: LAMINATE data sheet CABGA/CTBGA/CVBGA Features: ChipArray Packages: ChipArray® BGA CABGA / LFBGA Thin ChipArray® BGA (CTBGA / TFBGA) Very Thin ChipArray® BGA (CVBGA / VFBGA) Amkor’s ChipArray® packages are laminatebased Ball Grid Array (BGA) packages that are

90 ball VFBGA

Abstract: MT46H16M32LF micron ddr mt46h32m16 32M16 A12 marking diode MARKING A9 Micron MT46H32M16LF micron ddr MT46H32M16
Contextual Info: Advance‡ 512Mb: 32 Meg x 16, 16 Meg x 32 Mobile DDR SDRAM Mobile Double Data Rate DDR SDRAM MT46H32M16LF – 8 Meg x 16 x 4 Banks MT46H16M32LF – 4 Meg x 32 x 4 Banks For a complete data sheet, please refer to www.micron.com/mobileds. Features Figure 1: 60-Ball VFBGA Assignment

Micron 32MB NOR FLASH

Abstract: 0-30v power DEVICE MARKING CODE table INFINEON transistor marking label infineon application note marking code C5 RCR Resistor active suspension sensor micron cmos sensor connection
Contextual Info: 2 MEG x 16, 1 MEG x 16 ASYNC/PAGE/BURST CellularRAM 1.0 MEMORY ASYNC/PAGE/BURST CellularRAM 1.0 MEMORY MT45W2MW16BAFB MT45W1MW16BAFB Features Figure 1: 54-Ball VFBGA • Single device supports asynchronous, page, and burst operations • Random Access Time: 70ns, 85ns