UTY10 Search Results

Contextual Info: DENSE-PAC 1 Megabit UVEPROM M ICROSYSTEM S DPV3232VA DESCRIPTION; The DPV3232VA is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.

Contextual Info: DENSE-PAC 8 Megabit High Speed CMOS SRAM MICROSYSTEMS DPS512X 16Cn3/DPS512X 16Bn3 DESCRIPTION: The DPS512X16Cn3/DPS512X16Bn3 High Speed SRAM “ STACK" modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC .

Contextual Info: DENSE-PAC MICROSYSTEMS 4 Megabit CMOS SRAM DPS256X16n3 DESCRIPTION: The DPS256X16n3SRAM "STACK" modules are a revolutionarynew memory subsystem using Dense-PacMicrosystems'ceramicStackable Leadless Chip Carriers SLCC . Available in straight leaded, " J " leaded

Contextual Info: DENSE-PAC MICROSYSTEMS 1 Megabit CM OS SRAM DPS128M8n3/DPS 128X8A3 DESCRIPTION: The DPS128M8nY & DPS 128X8A3 SRAM devices are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC . Available in straight leaded,

Contextual Info: DENSE-PAC 4 Megabit CMOS UVEPROM MICROSYSTEMS DPV12832VA DESCRIPTION: The DPV12832VA is a 66-pin Pin Grid Array PGA consisting o f four 128K X 8 CMOS UVEPROM devices in ceram ic LCC packages surface mounted on a co-fired ceram ic substrate w ith matched thermal

Contextual Info: HAv ì a t*H 256K X 8 SRAM molaic MS8256SC-55/70/85 Issue 3.1 : April 1992 ^ i n Definition S e m ic o n d u c to r NC A16 A14 A12 A7 A6 A5 A4 A3 A2 A1 A0 DO D1 D2 GND 262,144 x 8 CMOS High Speed Static RAM Features Very Fast Access Times of 55/70/85 ns. JEDEC Standard 32 pin DIL footprint.

Contextual Info: 16 Megabit High Speed CMOS SRAM D E N S E - P A C MICROSYSTEMS D PS 5 1 2 C 3 2 M K V 3 PRELIMINARY DESCRIPTION: The DPS512C32MKV3 "VERSA-STACK" module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip

Contextual Info: DENSE-PAC MICROSYSTEMS 1 Megabit UVEPRO M DPV3232VA D ESC R IP T IO N : The D PV 3232V A is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 U VEPRO M devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.

Contextual Info: ä Square Type m Hü 5.7 mmX2.7mm S eries Unit: mm 4 .1 ± 0.2 T! T y p e No. 2 .9 ±0.2 L ig h tin g C olo r m LN 249R PH •••• .Red 4 .4 ± 0 .£ r L N 3 4 9 G P H - - .G re e n LN 449YPH •••• .A m b e r

MB8464A-10

Abstract: fujitsu mb8464a MB8464A MB8464 fujitsu 1988 777T7
Contextual Info: FUJITSU MICROELECTRONICS 47E D 37^7^2 DDlöRHS T • F U I cP April 1990 Edition 3.0 FUJITSU DATA SHEET MB8464A-80/-80U-80LL/-10/-10U-1OLL/-15/- 15U-15LL CMOS 64K BIT LOW POWER SRAM 8K Words x 8 Bits CMOS Static RAM with Low Power and Data Retention The Fujitsu MB8464A is a 8,192 words x 8 bits static random access memory

B84311

Abstract: U 3212 M B8432 sram 2k x 8 MB4321 20/TFK U 3212 M
Contextual Info: October 1989 Edition 1.0 = DATASHEET M B 8 4 3 1 /3 2 -9 0 /-9 0 L /-9 0 L L /-1 2 /-1 2 L /-1 2 L L CMOS 16K-BIT DUAL PORT SRAM 2K X 8-BIT CMOS DUAL PORT STATIC RANDOM ACCESS MEMORY The Fujitsu MB8431/32 are 2K words x 8 bits Dual port high-perform ance-static Random

30A044

Contextual Info: 16 Megabit High Speed C M O S SRAM D E N S E - P A C MICROSYSTEMS DPS512X32BV3 DESCRIPTION: The DPS512X32BV3 'V ERSA -ST A C K " module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCQ mounted on a co-fired ceramic

Contextual Info: n m Square Type Series CH 1.75mmX7.0mm T y p e No. Unit: mm 7.2 ± 0.2 . L ig h tin g C olo r L N 2 2 0 R P H .Red L N 3 2 0 G P H .G re e n L N 4 2 0 Y P H .A m b e r L N 8 2 0 R P H . O ra n g e

Contextual Info: DENSE-PAC 4 Megabit High Speed CMOS SRAM DPS128X32CV3/DPS128X32BV3 MICROSYSTEMS DESCRIPTION: The DPS128X32CV3/DPS128X32BV3 "VERSA-STACK" module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC