30A044 Search Results

vdr 275

Contextual Info: 512Kx16/256Kx32, 20 - 45ns, PGA 30A044-03 F 8 Megabit High Speed CMOS SRAM DPS256X32CV3/DPS256X32BV3 DESCRIPTION: The DPS256X32CV3/DPS256X32BV3 ‘’VERSA-STACK’’ module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC mounted

Contextual Info: DPS128X32AV3 HIG H SPEED 128K X 32 CMOS SRAM VERSA-STACK ADVANCED INFORMATION DESCRIPTION: The DPS128X32AV3 "VERSA-STACK" m odule is a re vo lu tio n a ry new high speed m em ory subsystem using Dense-Pac M icrosystem s' ceram ic Stackable Leadless C hip Carriers SLCC m ounted on a co-fired

Contextual Info: ^ f= ¡| j¡ñ ¡P > 'v.:. U DPS256X32AV3 ^ l v l Dense-Pac Microsystems, In c ^ y _ H IG H SPEED 256K X 32 C M O S SR A M VERSA-STACK w ADVANCED INFORMATION DESCRIPTION: The D PS2 5 6 X3 2 A V 3 "V E R SA -ST A C K " module is a revolutionary new high speed memory subsystem

Contextual Info: DPS128X24V3 Dense-Pac Microsystems, Inc. CERAMIC 128K X 24 C M O S SRAM VERSA-STACK O PRELIMINARY DESCRIPTION: T he D P S 1 2 8 X 2 4 V 3 " V E R S A - S T A C K " m odule is a r e v o lu t io n a r y n e w m e m o r y s u b s y s t e m u s in g Dense-Pac M icrosyste m s' ceram ic Stackable Leadless

Contextual Info: □PM Dense-Pac Microsystems, Inc. DPS512X32V3 ^ CERAMIC 512K X 32 C M O S SRAM VERSA-STACK PRELIM INARY DESCRIPTION: The DPS512X32V3 "VERSA-STACK" module is a revo lutio nary new mem ory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic

Contextual Info: DENSE-PAC 8 Megabit High Speed CMOS SRAM MICROSYSTEMS DPS256C32BV3 DESCRIPTION: The DPS256C32BV3 "VERSA-STACK" module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic

A2631

Contextual Info: DENSE-PAC M ie R O S ì S 16 Megabit High Speed CM OS SRAM D PS512X32C V3 i li M S D E S C R IP T IO N : The DP5512X32CV3 "VERSA-STACK" module is a revolutionarynew high speed memory subsystem using Dense-Pac Microsystems' ceramic Stackable Lead less Chip Carriers SLCQ

DPS128X32BV3

Abstract: DPS128X32CV3
Contextual Info: 4 Megabit High Speed CMOS SRAM DPS128X32CV3/DPS128X32BV3 DESCRIPTION: The DPS128X32CV3/DPS128X32BV3 ‘’VERSA-STACK’’ module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC

DPS128C32BV3

Contextual Info: DENSE-PAC MICROSYSTEMS 4 Megabit High Speed CMOS SRAM DPS128C32BV3 DESCRIPTION: T he D P S 128C 32B V 3 "VERSA-STACK" module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCQ mounted on a co-fired ceramic

DPS128X32CV3

Abstract: 2CV3
Contextual Info: DENSE-PAC MICROSYSTEMS 4 Megabit High Speed CMOS SRAM DPS 128X3 2CV3/D PS 128X3 2 BV3 D E SC R IPT IO N : The DPS!28X32CV3/DPS128X32BV3 "VERSA-STACK" module isa revolutionary new high speed memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCQ

OL80m

Abstract: DPS128X32BV3 DPS128X32CV3
Contextual Info: DENSE-PAC 4 Megabit High Speed CMOS SRAM DPS128X32CV3/DPS128X32BV3 M I C R O S Y S T E M S D ESCRIPTIO N : The D PS128X32CV 3/D PS128X32EV3 "V ER S A - S T A C K " m odule is a revolutionary new high speed m em ory subsystem using Dense-Pac Microsystems' ceram ic Stackable Leadless Chip Carriers SLCC

Contextual Info: DENSE-PAC MICROSYSTEMS 8 Megabit CMOS SRAM DPS256X32V3 DESCRIPTION: The D PS256X32V 3 "V E R S A -ST A C K ” module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCO mounted on a co-fired ceramic substrate. It offers 8

Contextual Info: Dense-Pac Microsystems, Inc. ¿-D PS1 28X24AV3 HIG H SPEED 128K X 24 CMOS SRAM VERSA-STACK O ADVANCED INFORMATION DESCRIPTION: The DPST28X24AV3 "VERSA-STACK" m odule is a re vo lu tio n a ry n e w high speed m em o ry subsystem using Dense-Pac M icrosystem s' ceram ic Stackable

Contextual Info: DENSE-PAC 4 Megabit CMOS SRAM MICROSYSTEMS DPS256X32V3 DESCRIPTION: The DPS256X32V3 "VERSA-STACK" m odule is a r e v o lu tio n a r y n e w m e m o ry subsystem u sin g Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic

Contextual Info: □PM DPS512X32AV3 Dense-Pac Microsystems. Inc. HIGH SPEED 512K X 32 CMOS SRAM VERSA-STACK O ADVANCED INFORMATION DESCRIPTION: The DPS512X32AV3 “ VERSA-STACK" m odule is a revolutionary new high speed m em ory subsystem using Dense-Pac M icrosystem s' ceram ic Stackable leadless C hip Carriers SLCC m ounted on a

Contextual Info: 8 Megabit CMOS SRAM DPS256X32V3 DESCRIPTION: The DPS256X32V3 ‘’VERSA-STACK’’ module is a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate. It offers 8

Contextual Info: DPS256X32AV3 Dense-Pac Microsystems. Inc. ~ H IG H SPEED 256K X 32 C M O S SR A M VERSA-STACK PRELIMINARY D ESC RIPTIO N : The D PS25 6X32 A V3 "V E R S A - S T A C K " m odule is a revolutionary n e w high speed m em ory subsystem using Dense-Pac M icrosystem s' ceram ic Stackable

Contextual Info: DENSE-PAC 4 Megabit CMOS SRAM DPS128X32V3 M I C R O S Y S T E M S DESCRIPTION: The DPS128X32V3 "VERSA-STACK" module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic

Contextual Info: 4 Megabit CMOS SRAM DPS128X32V3 DESCRIPTION: The DPS128X32V3 ‘’VERSA-STACK’’ module is a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate. It offers 4 Megabits of SRAM in a package

DPS512X32BV3

Contextual Info: 16 Megabit High Speed CMOS SRAM DPS512X32BV3 DESCRIPTION: The DPS512X32BV3 ‘’VERSA-STACK’’ module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic

ersa ms 8000

Contextual Info: □PM DPS512X32V3 Dense-Pac Microsystems, Inc. ^ CERAMIC 512K X 32 C M O S SRAM VERSA-STACK PRELIMINARY D ESC R IP T IO N : The D PS512X32V 3 "V ERSA -STA CK" module is a re v o lu tio n a ry n ew m e m o ry su b sy ste m u sing Dense-Pac Microsystems' ceramic Stackable Leadless

6AN7

Contextual Info: €n P M w IVI W U« c D e n s e - P a c M ic r o s y s t e m s , In c . 0 DPS512X32ÄV3 H IG H SPEED 512K X 32 C M O S SRAM VERSA-STACK ADVANCED INFORMATION D E S C R IP T IO N : The DPS512X32AV3 "VERSA-STACK" module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems'

Contextual Info: □PM V Dense-Pac Microsystems, Inc. DPS512X32V3 CERAMIC 512K X 32 CMOS SRAM VERSA-STACK O PRELIMINARY DESCRIPTION: The DPS512X32V3 "VER SA -ST A C K" module is a re v o lu tio n a ry n e w m em o ry subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless

a1289

Contextual Info: £ n D M w W U I V I Dense-Pac Microsystems, Inc. b DPS128X32AV3 ^ H IG H SPEED 128K X 32 C M O S S R A M VERSA-STACK ADVANCED INFORMATION DESCRIPTION: The D P S 1 2 8 X 3 2 A V 3 "V E R S A -S T A C K " m odule is a revolutionary n e w high speed m em ory subsystem