DPS512X32 Search Results

Contextual Info: DENSE-PAC 16 Megabit CM OS SRAM MICROSYSTEMS DPS512X32ML/DPS512X32MW PRELIMINARY DESCRIPTION: PIN-OUT DIAGRAM The DPS512X32ML/DPS512X32MW is a 512K x 32 high density, high-speed Static Random Access Memory SRAM module, intended for high performance computers and digital signal processing

Contextual Info: □PM Dense-Pac Microsystems, Inc. DPS512X32V3 ^ CERAMIC 512K X 32 C M O S SRAM VERSA-STACK PRELIM INARY DESCRIPTION: The DPS512X32V3 "VERSA-STACK" module is a revo lutio nary new mem ory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic

Contextual Info: DENSE-PAC 16 Megabit CMOS SRAM DPS512X32ML7DPS512X32MW MI G R Ö S Y S ! B M S DESCRIPTION: The DPS512X32ML/DPS512X32MW is a 512K x 32 high density, high-speed Static Random Access Memory SRAM module, intended for high performance computers and digital signal processing

DPS512X32MKY5

Contextual Info: 16 Megabit High Speed SRAM DPS512X32MKY5 PRELIMINARY DESCRIPTION: The DPS512X32MKY5 is the 512K x 32 SRAM module that utilize the new and innovative space saving TSOP stacking technology. The module is constructed of four 512K x 8 SRAM’s that are configured as 512K x 32.

Contextual Info: DENSE-PAC 16 Megabit High Speed CMOS SRAM MICROSYSTEMS DPS512X32MFn3 ADVANCED INFORMATION D E S C R IP T IO N : The DPS512X32MFn3 High Speed S R A M "S T A C K " modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCO.

Contextual Info: DENSE-PAC MICROSYSTEMS 16 Megabit CMOS SRAM DPS512X32ML/DPS512X32MW PRELIMINARY DESCRIPTION: P IN -O U T D IA G R A M The DPS512X32ML/DPS512X32MW is a 512K x 32 high density, high-speed Static Random Access Memory SRAM module, intended for high performance computers and digital signal processing

Contextual Info: □PM DPS512X32AV3 Dense-Pac Microsystems. Inc. HIGH SPEED 512K X 32 CMOS SRAM VERSA-STACK O ADVANCED INFORMATION DESCRIPTION: The DPS512X32AV3 “ VERSA-STACK" m odule is a revolutionary new high speed m em ory subsystem using Dense-Pac M icrosystem s' ceram ic Stackable leadless C hip Carriers SLCC m ounted on a

Contextual Info: DENSE-PAC 16 Megabit CMOS SRAM DPS512X32MXP MICROSYSTEMS PRELIMINARY DESCRIPTION: The DPS512X32MXP is a 68-pin surface mount module consisting of four 512K x 8 SRAM devices in plastic TSOP packages surface mounted on a FR-4 substrate. The module is available with "J"-Leads.

Contextual Info: 16 Megabit CMOS SRAM DPS512X32MXP M í C \i O S Y S T E M S PRELIMINARY DESCRIPTION: The DPS512X32MXP is a 68-pin surface mount module consisting of four 512K x 8 SRAM devices in plastic TSOP packages surface mounted on a FR-4 substrate. The module is available with "T-Leads.

DPS512X32BV3

Contextual Info: 16 Megabit High Speed CMOS SRAM DPS512X32BV3 DESCRIPTION: The DPS512X32BV3 ‘’VERSA-STACK’’ module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic

ersa ms 8000

Contextual Info: □PM DPS512X32V3 Dense-Pac Microsystems, Inc. ^ CERAMIC 512K X 32 C M O S SRAM VERSA-STACK PRELIMINARY D ESC R IP T IO N : The D PS512X32V 3 "V ERSA -STA CK" module is a re v o lu tio n a ry n ew m e m o ry su b sy ste m u sing Dense-Pac Microsystems' ceramic Stackable Leadless

6AN7

Contextual Info: €n P M w IVI W U« c D e n s e - P a c M ic r o s y s t e m s , In c . 0 DPS512X32ÄV3 H IG H SPEED 512K X 32 C M O S SRAM VERSA-STACK ADVANCED INFORMATION D E S C R IP T IO N : The DPS512X32AV3 "VERSA-STACK" module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems'

Contextual Info: □PM V Dense-Pac Microsystems, Inc. DPS512X32V3 CERAMIC 512K X 32 CMOS SRAM VERSA-STACK O PRELIMINARY DESCRIPTION: The DPS512X32V3 "VER SA -ST A C K" module is a re v o lu tio n a ry n e w m em o ry subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless

M10I

Contextual Info: DENSE-PAC 16 Megabit High Speed CMOS SRAM MICROSYSTEMS DPS512X32CV3 DESCRIPTION: The DPS512X32CV3 "VERSA-STACK" module is a revolutionary new high speed m em ory subsystem using D ense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCQ mounted on a co-fired ceramic substrate. It offers 16 Megabits of

Contextual Info: □P M DPS512X32V3 Dense-Pac Microsystems, Inc. CERAMIC 512K X 32 C M O S SRAM VERSA-STACK O PRELIMINARY DESCRIPTION: The D P S 5 1 2 X 3 2 V 3 “V E R S A - S T A C K " m odule is a r e v o lu t io n a r y n e w m e m o r y s u b s y s t e m u s in g Dense-Pac M icrosyste m s' ceram ic Stackable Leadless

Contextual Info: DENSE-PAC m ic ro s y s te m s /H-^OmSUS High Density Memory Device 16 Megabit High Speed SRAM DPS512X32MY5 PRELIMINARY DESCRIPTION: The DPS512X32MY5 is the 512K x 32 SRAM module the utilize the new and innovative space saving TSOP stacking technology. The module is constructed of four

DPS512X32CV3

Contextual Info: 16 Megabit High Speed CMOS SRAM DPS512X32CV3 DESCRIPTION: The DPS512X32CV3 ‘’VERSA-STACK’’ module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate. It offers 16 Megabits of

DPS512X32MKV3

Contextual Info: 2Mx8/1Mx16/512Kx32, 20 - 45ns, PGA 30A128-02 C 16 Megabit High Speed CMOS SRAM DPS512X32MKV3 DESCRIPTION: The DPS512X32MKV3 ‘’VERSA-STACK’’ module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip

DPS512X32MKV3

Contextual Info: DENSE-PAC 16 Megabit High Speed CMOS SRAM DPS512X32MKV3 M 1C R O S Y S T E M S DESCRIPTION: The D PS 512X 32M K V3 "V E R S A -S T A C K ” m odule is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip

Contextual Info: 16 Megabit High Speed CMOS SRAM D E N S E - P A C M I C R O S Y S T E MS DPS512X32MFn3 ADVANCED INFORMATION D E S C R IP T IO N : SLCC Stack T he DPS512X32M Fn3 High Speed SRA M " S T A C K " modules are a re vo lu tio n a ry n e w m em ory subsystem using D ense-Pac

Contextual Info: DENSE-PAC 16 Megabit CM OS SRAM DPS512X32V3 M I C R O S Y S T E M S DESCRIPTION: T h e DPS512X32V3 "VERSA-STACK" m od ule is a r e v o lu t io n a r y n e w m e m o r y s u b s y s te m u s in g Dense-Pac M icrosystem s' ceram ic Stackable Leadless C hip Carriers SLCC m ounted on a co-fired ceram ic

Contextual Info: □PM DPS512X32V3 Dense-Pac Microsystems, Inc. CERAMIC 512K X 32 CMOS SRAM VERSA-STACK O PRELIMINARY DESCRIPTION: The DPS512X32V3 "VERSA-STACK" module is a re v o lu tio n a ry n e w m e m o ry subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless

Contextual Info: DENSE-PAC 16 Megabit CMOS SRAM MICROSYSTEMS DPS512X32V3 D E SC R IPT IO N : The DPS512X32V3 "VERSA -STA C K" module is a re v o lu tio n a r y n e w m e m o ry subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic

Contextual Info: □PM D P S 5 1 2 X 3 2 A V 3 Dense-Pac Microsystems, Inc. HIGH SPEED 512K X 32 CM O S SRAM VERSA-STACK A D V A N C E D IN F O R M A T IO N D ESC R IP TIO N : The DPS512X32AV3 "VERSA-STACK" module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems'