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    TE Connectivity 82CV-300G-R

    300PSIG CONSTANT VOLTAGE PRESSURE SENSOR
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    Master Electronics 82CV-300G-R
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    RS 82CV-300G-R Bulk 48
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    Sager 82CV-300G-R
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    Powell Electronics 82CV-300G-R 39 2
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    Richardson RFPD 82CV-300G-R 1
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    TE Connectivity 82CV-300A-R

    NISO LP CV ABS CBL MOQ Reduction
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    Master Electronics 82CV-300A-R
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    Avnet Americas 82CV-300A-R Bag 50
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    Sager 82CV-300A-R 50
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    Interstate Connecting Components 82CV-300A-R
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    TE Connectivity 82CV-300G-RT

    NISO LP CV GA CBL/TU MOQ Reduction
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    Master Electronics 82CV-300G-RT
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    Sager 82CV-300G-RT 50
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    Interstate Connecting Components 82CV-300G-RT
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    Infineon Technologies AG CY7C10212CV33-12BAXET

    SRAM Chip Async Single 3.3V 1M-Bit 64K x 16 12ns 48-Pin FBGA T/R - Tape and Reel (Alt: CY7C10212CV33-12BAXET)
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    Avnet Americas () CY7C10212CV33-12BAXET Tape & Reel 2,000
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    CY7C10212CV33-12BAXET Tape & Reel 2,000
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    Flip Electronics CY7C10212CV33-12BAXET 2,000
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    Infineon Technologies AG CY7C10212CV33-12BAXE

    - Trays (Alt: CY7C10212CV33-12BAXE)
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    Avnet Americas () CY7C10212CV33-12BAXE Tray 4,160
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    CY7C10212CV33-12BAXE Tray 4,160
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    Flip Electronics CY7C10212CV33-12BAXE 224
    • 1 $3.14
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    2CV3 Datasheets Context Search

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    DPS128X32CV3

    Abstract: 2CV3
    Contextual Info: DENSE-PAC MICROSYSTEMS 4 Megabit High Speed CMOS SRAM DPS 128X3 2CV3/D PS 128X3 2 BV3 D E SC R IPT IO N : The DPS!2CV3/DPS128X32BV3 "VERSA-STACK" module isa revolutionary new high speed memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCQ


    OCR Scan     		128x3dps128x32cv3/dps128x32bv3500mv30a044-24+2dps128x32cv32cv3 PDF