DPV12832VA Search Results

Contextual Info: DPV12832VA H IGH SPEED 128K X 32 UVEPRO M VERSAPAC Microsystems, Inc. 0 DESCRIPTION: The D PV12832VA is a 66-pin Pin Grid Array PGA consisting of four 128K X 8 U VEPRO M devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.

Contextual Info: DENSE-PAC MICROSYSTEMS 4 Megabit CMOS UVEPROM DPV12832VA DESCRIPTION: The DPV12832VA is a 66-pin Pin Grid Array PGA consisting of four 128KX 8 C M O S U V EPR O M devices in ceram ic LCC packages surface mounted on a co-fired ceram ic substrate with matched thermal

Contextual Info: DENSE-PAC 4 Megabit CMOS UVEPROM MICROSYSTEMS DPV12832VA DESCRIPTION: The DPV12832VA is a 66-pin Pin Grid Array PGA consisting o f four 128K X 8 CMOS UVEPROM devices in ceram ic LCC packages surface mounted on a co-fired ceram ic substrate w ith matched thermal

Contextual Info: DENSE-PAC 4 Megabit CMOS UVEPROM DPV12832VA M I C R O S Y S T E M S DESCRIPTION: The DPV12832VA is a 66-pin Pin Grid Array PGA consisting of four 128K X8 CMOS UVEPROM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal

Contextual Info: 4 Megabit CMOS UVEPROM Dense-Pac Microsystems. Inc. ^ D P V 12832V A DESCRIPTION: The DPV12832VA is a 66-pin Pin Grid Array PGA consisting of four 128K X 8 CM OS UVEPROM devices in ceram ic LCC packages surface mounted on a co-fired ceram ic substrate with matched thermal

Contextual Info: DPV12832VA □PM Dense-Pac Microsystems, Inc. ^ HIGH SPEED 128K X 32 UVEPROM VERSAPAC DESCRIPTION: The DPV12832VA is a 66-pin Pin Grid Array PGA consisting of four 128K X 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.

Contextual Info: DENSE-PAC 4 Megabit CMOS UVEPROM DPV12832VA M I C R O S Y S T E M S DESCRIPTION: The DPV12832VA is a 66-pin Pin Grid Array PGA consisting of four 128KX 8 C M O S U V EP R O M devices in ceram ic LCC packages surface mounted on a co-fired ceram ic substrate with matched thermal

Contextual Info: DENSE-PAC 1 Megabit UVEPROM M ICROSYSTEM S DPV3232VA DESCRIPTION; The DPV3232VA is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.

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Contextual Info: DENSE-PAC MICROSYSTEMS 1 Megabit UVEPROM DPV3232VA DESCRIPTION; The DPV3232VA is a 66-pin Pin Grid Array PGA consisting of four 32K x 8 UVEPROM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.

dram zip 256kx16

Contextual Info: INDEX GENERAL PRO D U CT INFORM ATION Dense-Pac Memory Module and Monolithic . 4 Emerging Technology / P r o d u c t s . 5