TCKAB Search Results

Contextual Info: W3H264M16E-XBX ADVANCED* 256MB – 2 x 64M x 16 DDR2 SDRAM 79 PBGA FEATURES BENEFITS  Data rate = 400 Mb/s, 533 Mb/s, 667 Mb/s*  Larger ball pitch for higher reliability  Package:  Footprint compatible with W3H64M16E • 79 Plastic Ball Grid Array PBGA , 11 x 14mm

DNU-A13

Contextual Info: W3H64M16E-XBX 128MB – 64M x 16 DDR2 SDRAM 79 PBGA FEATURES BENEFITS  Data rate = 400 Mb/s, 533 Mb/s  Larger ball pitch for higher reliability  Package:  Pinout compatible with 2-Rank Version • 79 Plastic Ball Grid Array PBGA , 11 x 14mm

samsung pc2-6400

Abstract: PC2-3200 PC2-5300 PC2-6400 W3HG128M64EEU-D4 A7142
Contextual Info: White Electronic Designs W3HG128M64EEU-D4 ADVANCED* 1GB – 128Mx64 DDR2 SDRAM UNBUFFERED, SO-DIMM FEATURES DESCRIPTION 200-pin, Small-Outline DIMM SO-DIMM , Raw Card "B" The W3HG128M64EEU is a 128Mx64 Double Data Rate 2 SDRAM memory module based on 1Gb DDR2 SDRAM

tdb 158

Abstract: PC2-3200 PC2-4300 PC2-5300 PC2-6400 tisa 218 W3HG256M72AER-AD6
Contextual Info: White Electronic Designs W3HG256M72AER-AD6 2GB – 256Mx72 DDR2 SDRAM RDIMM, w/PLL, VLP FEATURES DESCRIPTION „ Registered 240-pin, dual in-line very low profile VLP memory module „ Fast data transfer rates: PC2-6400*, PC2-5300, PC2-4300 and PC2-3200 „

Contextual Info: W3H64M72E-XSBX W3H64M72E-XSBXF 512MB – 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS  Data rate = 667, 533, 400 Mb/s  30% Space saving vs. FBGA  Package:  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 22mm

Contextual Info: 1Gb: x4, x8, x16 DDR2 SDRAM Features DDR2 SDRAM MT47H256M4 – 32 Meg x 4 x 8 banks MT47H128M8 – 16 Meg x 8 x 8 banks MT47H64M16 – 8 Meg x 16 x 8 banks For the latest data sheet, refer to Micron’s Web site: http://www.micron.com/ddr2 Features • •

Contextual Info: 256Mb: x4, x8, x16 DDR2 SDRAM Features DDR2 SDRAM MT47H64M4 – 16 Meg x 4 x 4 banks MT47H32M8 – 8 Meg x 8 x 4 banks MT47H16M16 – 4 Meg x 16 x 4 banks For the latest data sheet, refer to Micron’s Web site: http://www.micron.com/ddr2 Features • •

Contextual Info: 1Gb: x4, x8, x16 DDR2 SDRAM Features DDR2 SDRAM MT47H256M4 – 32 Meg x 4 x 8 banks MT47H128M8 – 16 Meg x 8 x 8 banks MT47H64M16 – 8 Meg x 16 x 8 banks Features Options • • • • • • • • • • • • • • • • • • Configuration

old file for mt47h32m16

Abstract: DDR2-400 DDR2-533 DDR2-667 DDR2-800 MT47H32M16 MT47H64M8 EN4521
Contextual Info: 512Mb: x4, x8, x16 DDR2 SDRAM Features DDR2 SDRAM MT47H128M4 – 32 Meg x 4 x 4 banks MT47H64M8 – 16 Meg x 8 x 4 banks MT47H32M16 – 8 Meg x 16 x 4 banks For the latest data sheet, refer to Micron’s Web site: http://www.micron.com/ddr2 Features • •

Contextual Info: 1Gb: x4, x8, x16 DDR2 SDRAM Features DDR2 SDRAM MT47H256M4 – 32 Meg x 4 x 8 banks MT47H128M8 – 16 Meg x 8 x 8 banks MT47H64M16 – 8 Meg x 16 x 8 banks For the latest data sheet, refer to Micron’s Web site: http://www.micron.com/ddr2 Features • •

equivalent q406

Contextual Info: White Electronic Designs W3HG128M64EEU-D4 ADVANCED* 1GB – 128Mx64 DDR2 SDRAM UNBUFFERED, SO-DIMM FEATURES DESCRIPTION „ 200-pin, Small-Outline DIMM SO-DIMM , Raw Card "B" „ Fast data transfer rates: PC2-6400*, PC2-5300*, PC2-4200 and PC2-3200 „ Utilizes 800*, 667*, 533 and 400 Mb/s DDR2

W3H128M72E-XSBX

Abstract: 84 FBGA
Contextual Info: White Electronic Designs W3H128M72E-XSBX 128M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES  Data rate = 667, 533, 400  Package:  CK/CK# Termination options available • 0 ohm, 20 ohm • 208 Plastic Ball Grid Array PBGA , 16 x 22mm  Posted CAS additive latency: 0, 1, 2, 3 or 4

18CO

Contextual Info: White Electronic Designs W3H64M64E-XSBX ADVANCED* 64M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES  Commercial, Industrial and Military Temperature Ranges • 208 Plastic Ball Grid Array PBGA , 16 x 22mm  Organized as 64M x 64 • 1.0mm pitch

A08K 32

Abstract: A08K
Contextual Info: Advance‡Preliminary SpecTek Confidential and Proprietary 1Gb: x4, x8, x16 DDR2 SDRAM Features DDR2 SDRAM SAA256M4. – 32 Meg x 4 x 8 banks SAA128M8. – 16 Meg x 8 x 8 banks SAA64M16. – 8 Meg x 16 x 8 banks Features Options • • • • •

Contextual Info: W3H128M72E-XSBX W3H128M72E-XNBX 1GB – 128M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS  Data rate = 667, 533, 400  56% space savings vs. FBGA  Package:  Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 22mm

Contextual Info: 256MB, 512MB, 1GB x72, SR 240-Pin DDR2 SDRAM VLP RDIMM Features DDR2 SDRAM VLP Registered DIMM MT9HVF3272(P) – 256MB MT9HVF6472(P) – 512MB MT9HVF12872(P) – 1GB (Advance) For component specifications, refer to Micron’s Web site: www.micron.com/products/ddr2

Contextual Info: Preliminary‡ 1Gb: x4, x8 1.5V DDR2 SDRAM Features 1.5V DDR2 SDRAM MT47R256M4 – 32 Meg x 4 x 8 banks MT47R128M8 – 16 Meg x 8 x 8 banks Features • • • • • • • • • • • • • • • • • Options VDD/VDDQ = +1.55V, 1.50V to 1.9V range

mt47h128m16

Contextual Info: 2Gb: x4, x8, x16 DDR2 SDRAM Features DDR2 SDRAM MT47H512M4 – 64 Meg x 4 x 8 banks MT47H256M8 – 32 Meg x 8 x 8 banks MT47H128M16 – 16 Meg x 16 x 8 banks For the latest data sheet, refer to Micron’s Web site: www.micron.com/ddr2 Features • • •

Contextual Info: 512Mb: x4, x8, x16 DDR2 SDRAM Features DDR2 SDRAM MT47H128M4 – 32 Meg x 4 x 4 banks MT47H64M8 – 16 Meg x 8 x 4 banks MT47H32M16 – 8 Meg x 16 x 4 banks For the latest data sheet, refer to Micron’s Web site: http://www.micron.com/ddr2 Features • •

Contextual Info: 1Gb: x4, x8, x16 DDR2 SDRAM Features DDR2 SDRAM MT47H256M4 – 32 Meg x 4 x 8 banks MT47H128M8 – 16 Meg x 8 x 8 banks MT47H64M16 – 8 Meg x 16 x 8 banks For the latest data sheet, refer to Micron’s Web site: http://www.micron.com/ddr2 Features • •

Contextual Info: 256Mb: x4, x8, x16 DDR2 SDRAM Features DDR2 SDRAM MT47H64M4 – 16 Meg x 4 x 4 banks MT47H32M8 – 8 Meg x 8 x 4 banks MT47H16M16 – 4 Meg x 16 x 4 banks For the latest data sheet, refer to Micron’s Web site: http://www.micron.com/ddr2 Features • •

Contextual Info: White Electronic Designs W3H128M72E-XSBX 128M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES  Data rate = 667, 533, 400  Package:  CK/CK# Termination options available • 0 ohm, 20 ohm • 208 Plastic Ball Grid Array PBGA , 16 x 22mm  Posted CAS additive latency: 0, 1, 2, 3 or 4

Contextual Info: White Electronic Designs W3HG128M64EEU-D4 ADVANCED* 1GB – 128Mx64 DDR2 SDRAM UNBUFFERED, SO-DIMM FEATURES DESCRIPTION „ 200-pin, Small-Outline DIMM SO-DIMM , Raw Card "B" „ Fast data transfer rates: PC2-6400*, PC2-5300*, PC2-4200 and PC2-3200 „ Utilizes 800*, 667*, 533 and 400 Mb/s DDR2

Contextual Info: W3H128M72E-XSBX W3H128M72E-XNBX 1GB – 128M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES  Commercial, Industrial and Military Temperature Ranges  Data rate = 667, 533, 400  Organized as 128M x 72  Package:  Weight: W3H128M72E-XSBX - 4 grams max