PCN0404
Abstract: SUMITOMO g700l sumitomo EME G700L G700L TQFP 144 PACKAGE Compound SUMITOMO mold compound TQFP 144 PACKAGE altera G700
Contextual Info: PROCESS CHANGE NOTICE PCN0404 ADDITIONAL MOLD COMPOUND FOR TQFP 144 PACKAGE Change Description: The Sumitomo G700L mold compound is being added as additional mold compound choice for selected Altera devices in thin quad flat pack TQFP 144 lead packages assembled by
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pcn0404g700lsumitomo g700lsumitomo eme g700l+6tqfp 144 packagecompoundsumitomomold compoundtqfp 144 package alterag700
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PCN0602
Abstract: sumitomo G700 sumitomo G700 Tg sumitomo epoxy sumitomo g700 type g700 mold compound G700 SUMITOMO Tg G700 sumitomo g700 mold compound sumitomo epoxy G700
Contextual Info: PROCESS CHANGE NOTIFICATION PCN0602 MOLD COMPOUND CHANGE FOR CYCLONE II PQFP & TQFP PACKAGES Change Description: Altera is adopting the Sumitomo G700 series mold compound as the standard mold material on its Cyclone™ II low-k dielectric Plastic Quad Flat Pack PQFP and Plastic Thin Quad
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pcn0602e730sjsumitomo-g700eme-e730sj+12x10-5/x102n/mm2ul-94sumitomo g700sumitomo g700 tgsumitomo epoxysumitomo g700 typeg700 mold compoundg700 sumitomo tgg700sumitomo g700 mold compoundsumitomo epoxy g700
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PCN0702
Abstract: SUMITOMO G700 SUMITOMO G600 SUMITOMO EME G700 sumitomo 6300h mold compound SUMITOMO EME G600 EME G600 material properties G600 mold compound mp8000ch4 sumitomo G700 Tg
Contextual Info: Revision: 1.2.0 PROCESS CHANGE NOTIFICATION PCN0702 UPDATE MOLD COMPOUND CHANGE FOR PQFP, PDIP, AND RQFP PACKAGES Change Description: This is an update to PCN0702, published March, 2007. Altera is implementing mold compound material changes on the Plastic Quad Flat Pack PQFP , Plastic Dual In-Line
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pcn07026300hjg700mmp8000ch4+1148hrsx10-5ul-94sumitomo g700sumitomo g600sumitomo eme g700sumitomo 6300h mold compoundsumitomo eme g600eme g600material properties g600 mold compoundsumitomo g700 tg
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CRM1064
Abstract: SUMITOMO G700 ablestik 2288a CRM-1064 CRM1064B Ablestik G700 G700 mold compound Sumitomo G700A sumitomo g700 mold compound
Contextual Info: PRODUCT CHANGE NOTICE PCN PART NUMBER(S): PCN No.: 08-1201-02 XRT72L52IQ-F & XRT72L52IQTR-F DATE: 12/10/08 PART DESCRIPTION: Two Channel DS3/E3 Framer IC With HDLC Controller LEVEL OF CHANGE: [ ] Level I, Customer Approval. [ X ] Level II, Customer Information.
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xrt72l52iq-fxrt72l52iqtr-fg0006-6crm1064+9sumitomo g700ablestik 2288acrm-1064crm1064bablestikg700g700 mold compound sumitomog700asumitomo g700 mold compound
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sumitomo G700
Abstract: sumitomo epoxy 1076 0038 tsop ablebond Sumitomo 1076 8361J Compound c7025 Die Attach epoxy stamping sumitomo g700 type g700 mold compound
Contextual Info: 10/29/2004 PACKAGE RELIABILITY REPORT FOR 32 TSOP 8mm Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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sumitomo g700sumitomo epoxy 10760038 tsopablebond+6sumitomo 10768361jcompound c7025die attach epoxy stampingsumitomo g700 typeg700 mold compound
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SUMITOMO G700
Abstract: SUMITOMO EME G700 a2200 G700 sumitomo 6600h 84-1 LMIs Ablebond ABLEBONd 84-1 ablestick M02066-82
Contextual Info: September 23, 2009 CN-092309 Customer Notification M02066-82, M02066G-82, M02068-15-T, M02068G-15-T Additional Assembly and Test Site Dear Valued Customer: This notification is for the purpose of informing you of an additional assembly and test site for the M02066-82,
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cn-092309m02066-82m02066g-82m02068-15-t+10m02068g-15-tsumitomo g700sumitomo eme g700a2200g700sumitomo 6600h84-1 lmisablebondablebond 84-1ablestick
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HI-3584APQT
Abstract: HI-8010Q HI-3583APQT-15 sumitomo G700lx HI-3584APQI G700LX HI-3585PQTF HI-3584APQI-15 HI-8582PQIF Hi-3582APQI
Contextual Info: 52 & 44 Lead Quad Flat Pack QFP MSL Improvement Product Change Notice PCN1006 (v1.0) October 01, 2010 Overview This notice describes the changes to the 52 & 44 Lead Quad Flat Pack (QFP) Package for the ARINC 429, MIL-STD 1553, and LCD Display Driver family of devices.
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pcn10066600cglg700lx84-1lmisr4+15hi-3587pqtfhi-3587pqmhi-3587pqmfhi-3588pqihi-3588pqifhi-3588pqthi-3584apqthi-8010qhi-3583apqt-15sumitomo g700lxhi-3584apqihi-3585pqtfhi-3584apqi-15hi-8582pqifhi-3582apqi
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CRM1076E
Abstract: STMicroelectronics TRACEABILITY code XC18V02VQ44C part marking SUMITOMO G700 stmicroelectronics traceability datecode format stmicroelectronics soic marking code stmicroelectronics XC18V01SO20C sumitomo g700 type XC18V04VQ44C0901
Contextual Info: XC18V00 Series In-System Programmable Configuration PROMs R DS026 v4.1 December 15, 2003 Features • • Dual configuration modes - In-system programmable 3.3V PROMs for configuration of Xilinx FPGAs - Endurance of 20,000 program/erase cycles - • •
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xc18v00ds0265pm5a02335bm5a0233+13scd0901pcn2003-04apcn2003-04crm1076estmicroelectronics traceability codexc18v02vq44c part markingsumitomo g700stmicroelectronics traceabilitydatecode format stmicroelectronicssoic marking code stmicroelectronicsxc18v01so20csumitomo g700 typexc18v04vq44c0901
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SUMITOMO g700l
Abstract: g700l a1007 Ablestik 5V995 JESD22-A103 JESD22-A110 TQFP-64 G700* sumitomo 5V995P
Contextual Info: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1007-04 Product Affected: DATE: August 11, 2010 10.0mm x 10.0mm x 1.4mm TQFP-44 (Standard & Green) Date Effective: November 11, 2010
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a1007-04tqfp-445t93gl101pfgi5t93gl101pfgi8+155t93gl101pfi5t93gl101pfi85t995apfi5t995apfi85t995appgisumitomo g700lg700la1007ablestik5v995jesd22-a103jesd22-a110tqfp-64g700* sumitomo5v995p
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92HD80B1X5
Abstract: SUMITOMO G631 92HD79B1a5 92hd80 92hd80b1x5nlg 92HD80B1 92HD80B1X5NLGXTA48 92HD80B hitachi en4900 EN-4900
Contextual Info: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1007-01 Product Affected: DATE: July 16, 2010 MEANS OF DISTINGUISHING CHANGED DEVICES: PC Audio Products (VFQFPN-48) Product Mark
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a1007-01vfqfpn-4892hd81b1x5nlgxtax892hd81b1x5nlgxuax+1692hd81b1x5nlgxuax892hd81b1x5nlgxydx92hd81b1x5nlgxydx892hd83c1c5nlgxuax92hd83c1c5nlgxuax892hd83c1c5nlgxydx92hd80b1x5sumitomo g63192hd79b1a592hd8092hd80b1x5nlg92hd80b192hd80b1x5nlgxta4892hd80bhitachi en4900en-4900
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SUMITOMO g700l
Abstract: C18045 8361J J-STD-020 G700* sumitomo JESD22-B105 G700L
Contextual Info: 04/19/2006 PACKAGE RELIABILITY REPORT FOR ATK, 100 LQFP, 14x14x1.4mm Level 3 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292
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14x14x1sumitomo g700lc180458361j+4j-std-020g700* sumitomojesd22-b105g700l
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PCN0903
Abstract: Hitachi Datecode SUMITOMO G700 Nitto GE100LFCS GE100LFCS Hitachi FH920 Ablestik 2025D ablestik 2288a EPC16UI88AA sumitomo g700 type
Contextual Info: Revision: 1.0.1 PROCESS CHANGE NOTIFICATION PCN0903 ALTERNATIVE ASSEMBLY SITE FOR THE EPC CONFIGURATION FAMILY Change Description Altera is introducing Amkor, Philippines ATP and Amkor, Korea (ATK) as additional assembly sources for the EPC configuration devices. The EPC devices are currently assembled out of
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pcn0903hitachi datecodesumitomo g700nitto ge100lfcs+6ge100lfcshitachi fh920ablestik 2025dablestik 2288aepc16ui88aasumitomo g700 type
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SUMITOMO CRM1076
Abstract: sumitomo g770hcd JESD22-A113 SUMITOMO G631H cel9220 JESD22-A118 JESD22-A103 Ablebond 8600 sumitomo g770 G631H
Contextual Info: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1004-01R1 DATE: 4-Jun-2010 Product Affected: 5mm x 5mm VFQFP-N-32 (Standard & Green) Refer to Attachment II for the affected part numbers
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a1004-01r14-jun-2010vfqfp-n-322-jul-2010+16s395cklf9lvrs395cklft9lvrs395engklf9lvrs395engklft9lvrs396aklf9lvrs396aklftsumitomo crm1076sumitomo g770hcdjesd22-a113sumitomo g631hcel9220jesd22-a118jesd22-a103ablebond 8600sumitomo g770g631h
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JESD22-A118
Abstract: SUMITOMO G631H cel9220 Ablebond 8600 sumitomo g770hcd SUMITOMO CRM1076 SUMITOMO G700 G631H sumitomo g770 sumitomo G700ly
Contextual Info: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1004-01 DATE: 2-Apr-2010 Product Affected: 5mm x 5mm VFQFP-N-32 (Standard & Green) Refer to Attachment II for the affected part numbers
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a1004-012-apr-2010vfqfp-n-322-jul-2010+16s395cklf9lvrs395cklft9lvrs395engklf9lvrs395engklft9lvrs396aklf9lvrs396aklftjesd22-a118sumitomo g631hcel9220ablebond 8600sumitomo g770hcdsumitomo crm1076sumitomo g700g631hsumitomo g770sumitomo g700ly
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g700l
Abstract: G700LX JESD22-A108 G700* sumitomo jedec jesd22-a108 JESD A114 A114 transistor A114 100PF JESD22-A114
Contextual Info: RELIABILITY REPORT # 09-142 FOR SP508CF-L Six Layers Mask Change October 26, 2009 EXAR CORPORATION 48720 Kato Road, Fremont, CA 94538 Phone # 510 668-7000/ Fax # (510) 668-7022 Report #: 09-142 GENERAL INFORMATION CHIP DATA PACKAGE DATA FAB: Episil ASSEMBLY:
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sp508cf-lba230466e14x14x1327x234+10g700lxjesd22-a114jesd22-a108100pfg700lg700* sumitomojedec jesd22-a108jesd a114a114transistor a114
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Sumitomo G700K
Abstract: sumitomo 6600h Compound c7025 JESD22-B101 Nitto MP8000 G700K SUMITOMO-G600 epoxy 8290 ablebond ablestik 8290 SUMITOMO g600 UL
Contextual Info: 8/29/2006 RELIABILITY REPORT FOR DS1077, Rev C2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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ds1077jesd78sumitomo g700ksumitomo 6600h+8compound c7025jesd22-b101nitto mp8000g700ksumitomo-g600epoxy 8290ablebond ablestik 8290sumitomo g600 ul
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ABLEBOND
Contextual Info: 8/29/2006 RELIABILITY REPORT FOR DS1086L, Rev A1 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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G700K
Abstract: Nitto MP8000 Sumitomo G600 Sumitomo G700K JESD78 sumitomo 6600h Compound c7025 JESD-78 BCB4026
Contextual Info: 8/29/2006 RELIABILITY REPORT FOR DS1077L, Rev C2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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ds1077ljesd78g700knitto mp8000+6sumitomo g600sumitomo g700ksumitomo 6600hcompound c7025jesd-78bcb4026
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Nitto MP8000
Abstract: Sumitomo G700K g700k JESD78 JESD-78 sumitomo 6600h ablebond ablestik BCB4026
Contextual Info: 8/29/2006 RELIABILITY REPORT FOR DS1086, Rev A1 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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ds1086jesd78nitto mp8000sumitomo g700k+5g700kjesd-78sumitomo 6600hablebond ablestikbcb4026
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Sumitomo G700K
Abstract: SUMITOMO g600 Ablestik 84-1 sumitomo 6600h G700K
Contextual Info: 8/29/2006 RELIABILITY REPORT FOR DS1094L, Rev A3 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com
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ds1094ljesd78sumitomo g700ksumitomo g600+3ablestik 84-1sumitomo 6600hg700k
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sumitomo EME G700L
Abstract: SUMITOMO g700l g700l Loctite 536 EME-G700 EME G700L lead frame cu C194 ablestick tqfp upsd
Contextual Info: 05/12/06 µPSD ATK Assembly Qualification Test Report The following report summarizes the qualification testing of the uPSD family of µPSD Microcontrollers additional assembly and test locations AMKOR Technology Korea. To meet the increased product demand, and to enable flexibility for
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sumitomo eme g700lsumitomo g700lg700lloctite 536+6eme-g700eme g700llead frame cu c194ablesticktqfpupsd
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HMC916LP3
Abstract: SUMITOMO EME G700 hmc424lp3e SUMITOMO G700 HMC905LP3
Contextual Info: Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com Report Title: Qualification Test Report Report Type: See Attached Date: See Attached Package Type: 6L LP2, 16L LP3 Package Style: 16L 3x3mm QFN Package
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hmc424lp3ehmc536lp2hmc546lp2hmc646lp2+10hmc652lp2hmc653lp2hmc654lp2hmc655lp2hmc656lp2hmc657lp2hmc916lp3sumitomo eme g700sumitomo g700hmc905lp3
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STMicroelectronics marking code date
Abstract: CHN G4 chn 509 marking code stmicroelectronics Date Code Marking STMicroelectronics CHN 450 SUMITOMO G700 ablebond 8290 Part Marking STMicroelectronics ST MICROELECTRONICS DATE CODE MARKING
Contextual Info: PRODUCT/PROCESS CHANGE NOTIFICATION PCN MPG-EEP/04/578 M50FW, M50LPW, M50FLW Firmware Hub and Low Pin Count Product Families, TSOP40 Environmental Friendly Package and Assembly Location Change WHAT IS THE CHANGE? The present PCN replaces and upgrades PCN MPG/EE/0086 / CPCN MPG/EEP/04/450.
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mpg-eep/04/578m50fwm50lpwm50flw+13tsop40mpg/ee/0086mpg/eep/04/450stmicroelectronics marking code datechn g4chn 509marking code stmicroelectronicsdate code marking stmicroelectronicschn 450sumitomo g700ablebond 8290part marking stmicroelectronicsst microelectronics date code marking
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CV-8710
Abstract: EME-G770HCD Sumitomo EME-G600 material SUMITOMO EME G770 EME-G760 MGC CCL-HL832 EME-G600 CCL-HL832 sumitomo g770 Ablestik ablebond 3230 epoxy
Contextual Info: Chapter 3 Package Materials CHAPTER 3 PACKAGE MATERIALS Introduction JIG-101 Ed 3.0 Declarable Substance List Reporting of 38 Substances of Very High Concern EU REACH Material Declaration Sheets Packages and Packing Methodologies Handbook 6 Jul 2010
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jig-101cv-8710eme-g770hcdsumitomo eme-g600 material+7sumitomo eme g770eme-g760mgc ccl-hl832eme-g600ccl-hl832sumitomo g770ablestik ablebond 3230 epoxy
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